JPH0273819A - Production of polyphenol - Google Patents
Production of polyphenolInfo
- Publication number
- JPH0273819A JPH0273819A JP22579488A JP22579488A JPH0273819A JP H0273819 A JPH0273819 A JP H0273819A JP 22579488 A JP22579488 A JP 22579488A JP 22579488 A JP22579488 A JP 22579488A JP H0273819 A JPH0273819 A JP H0273819A
- Authority
- JP
- Japan
- Prior art keywords
- phenols
- acid
- aromatic dialdehyde
- acid catalyst
- polyphenol
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 150000008442 polyphenolic compounds Chemical class 0.000 title claims description 15
- 235000013824 polyphenols Nutrition 0.000 title claims description 15
- 238000004519 manufacturing process Methods 0.000 title claims description 4
- 125000003118 aryl group Chemical group 0.000 claims abstract description 12
- ZNZYKNKBJPZETN-WELNAUFTSA-N Dialdehyde 11678 Chemical compound N1C2=CC=CC=C2C2=C1[C@H](C[C@H](/C(=C/O)C(=O)OC)[C@@H](C=C)C=O)NCC2 ZNZYKNKBJPZETN-WELNAUFTSA-N 0.000 claims abstract description 11
- 239000003377 acid catalyst Substances 0.000 claims abstract description 9
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 10
- 150000002989 phenols Chemical class 0.000 abstract description 9
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 abstract description 8
- 239000003822 epoxy resin Substances 0.000 abstract description 5
- 229920000647 polyepoxide Polymers 0.000 abstract description 5
- 239000002994 raw material Substances 0.000 abstract description 4
- JOXIMZWYDAKGHI-UHFFFAOYSA-N toluene-4-sulfonic acid Chemical compound CC1=CC=C(S(O)(=O)=O)C=C1 JOXIMZWYDAKGHI-UHFFFAOYSA-N 0.000 abstract description 4
- 125000000217 alkyl group Chemical group 0.000 abstract description 2
- 238000009833 condensation Methods 0.000 abstract description 2
- 230000005494 condensation Effects 0.000 abstract description 2
- 150000001875 compounds Chemical class 0.000 abstract 1
- 238000004821 distillation Methods 0.000 abstract 1
- 229910052736 halogen Inorganic materials 0.000 abstract 1
- 150000002367 halogens Chemical class 0.000 abstract 1
- 238000003475 lamination Methods 0.000 abstract 1
- 239000000463 material Substances 0.000 abstract 1
- 229940054441 o-phthalaldehyde Drugs 0.000 abstract 1
- ZWLUXSQADUDCSB-UHFFFAOYSA-N phthalaldehyde Chemical compound O=CC1=CC=CC=C1C=O ZWLUXSQADUDCSB-UHFFFAOYSA-N 0.000 abstract 1
- 229920005989 resin Polymers 0.000 abstract 1
- 239000011347 resin Substances 0.000 abstract 1
- 239000000565 sealant Substances 0.000 abstract 1
- 238000006243 chemical reaction Methods 0.000 description 7
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 6
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 6
- IWDCLRJOBJJRNH-UHFFFAOYSA-N p-cresol Chemical compound CC1=CC=C(O)C=C1 IWDCLRJOBJJRNH-UHFFFAOYSA-N 0.000 description 6
- 238000000034 method Methods 0.000 description 3
- 239000003566 sealing material Substances 0.000 description 3
- KUCOHFSKRZZVRO-UHFFFAOYSA-N terephthalaldehyde Chemical compound O=CC1=CC=C(C=O)C=C1 KUCOHFSKRZZVRO-UHFFFAOYSA-N 0.000 description 3
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- DTQVDTLACAAQTR-UHFFFAOYSA-N Trifluoroacetic acid Chemical compound OC(=O)C(F)(F)F DTQVDTLACAAQTR-UHFFFAOYSA-N 0.000 description 2
- 230000018044 dehydration Effects 0.000 description 2
- 238000006297 dehydration reaction Methods 0.000 description 2
- RLSSMJSEOOYNOY-UHFFFAOYSA-N m-cresol Chemical compound CC1=CC=CC(O)=C1 RLSSMJSEOOYNOY-UHFFFAOYSA-N 0.000 description 2
- 235000006408 oxalic acid Nutrition 0.000 description 2
- 229920001568 phenolic resin Polymers 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- -1 0-cresol Chemical compound 0.000 description 1
- VGVRPFIJEJYOFN-UHFFFAOYSA-N 2,3,4,6-tetrachlorophenol Chemical class OC1=C(Cl)C=C(Cl)C(Cl)=C1Cl VGVRPFIJEJYOFN-UHFFFAOYSA-N 0.000 description 1
- VADKRMSMGWJZCF-UHFFFAOYSA-N 2-bromophenol Chemical class OC1=CC=CC=C1Br VADKRMSMGWJZCF-UHFFFAOYSA-N 0.000 description 1
- WJQOZHYUIDYNHM-UHFFFAOYSA-N 2-tert-Butylphenol Chemical compound CC(C)(C)C1=CC=CC=C1O WJQOZHYUIDYNHM-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 101150084935 PTER gene Proteins 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- IZALUMVGBVKPJD-UHFFFAOYSA-N benzene-1,3-dicarbaldehyde Chemical compound O=CC1=CC=CC(C=O)=C1 IZALUMVGBVKPJD-UHFFFAOYSA-N 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 125000005843 halogen group Chemical group 0.000 description 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000002648 laminated material Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000010680 novolac-type phenolic resin Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000001256 steam distillation Methods 0.000 description 1
- AKEJUJNQAAGONA-UHFFFAOYSA-N sulfur trioxide Inorganic materials O=S(=O)=O AKEJUJNQAAGONA-UHFFFAOYSA-N 0.000 description 1
- YNJBWRMUSHSURL-UHFFFAOYSA-N trichloroacetic acid Chemical compound OC(=O)C(Cl)(Cl)Cl YNJBWRMUSHSURL-UHFFFAOYSA-N 0.000 description 1
- ITMCEJHCFYSIIV-UHFFFAOYSA-N triflic acid Chemical compound OS(=O)(=O)C(F)(F)F ITMCEJHCFYSIIV-UHFFFAOYSA-N 0.000 description 1
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分〕
本発明は、封止材料および積層材料として有用な耐熱性
に優れたエポキシ樹脂原料用フェノール樹脂及びエポキ
シ樹脂硬化剤用フェノール樹脂の製造方法に関する。Detailed Description of the Invention [Industrial Application] The present invention relates to a method for producing a phenolic resin for use as an epoxy resin raw material and as an epoxy resin curing agent, which has excellent heat resistance and is useful as a sealing material and a laminated material. .
従来、ノボラック型フェノール樹脂の製造方法は、フェ
ノール1モルに対してホルムアルデヒドを0.5〜0.
9モルの範囲で、塩酸、シュウ酸等の酸性触媒で反応を
行い、その後脱水濃縮することにより得られている。近
年、電子部品の発展はめざましく、LSI等の高密度、
高集積は著しいものがあり、封止材料に対してもより高
い耐熱性が求められるようになってきた。そこで、ホル
ムアルデヒドの代わりに、芳香族ジアルデヒドを使用し
た四官能のエポキシ樹脂の原料であるポリフェノール(
特開昭55−139373号公報)が提案されている。Conventionally, in the production method of novolac type phenolic resin, formaldehyde is added in an amount of 0.5 to 0.0% per mole of phenol.
It is obtained by carrying out a reaction with an acidic catalyst such as hydrochloric acid or oxalic acid in a range of 9 mol, followed by dehydration and concentration. In recent years, the development of electronic components has been remarkable, and high-density devices such as LSI,
The high degree of integration is remarkable, and higher heat resistance is now required for sealing materials. Therefore, polyphenol (a raw material for tetrafunctional epoxy resin using aromatic dialdehyde instead of formaldehyde)
JP-A-55-139373) has been proposed.
しかし、上記ポリフェノールは、単一構造のために融点
が非常に高く、封止材料等には実用的でない。However, the polyphenol has a very high melting point due to its single structure, and is not practical for use as a sealing material.
本発明は、実用的な軟化温度を有するポリフェノールを
得るためになされたものである。The present invention was made in order to obtain polyphenols having a practical softening temperature.
本発明は、芳香族ジアルデヒド1モルに対し、フェノー
ル類を5〜32モルの範囲内で、酸触媒の存在下、反応
させ上記課題を解決したポリフェノールを得る方法を提
供するものである。The present invention provides a method for obtaining a polyphenol that solves the above problems by reacting 5 to 32 moles of phenols per mole of aromatic dialdehyde in the presence of an acid catalyst.
(芳香族ジアルデヒド)
本発明で使用される芳香族ジアルデヒドは、0フクルア
ルデヒド、イソフタルアルデヒドおよびテレフタルアル
デヒドである。(Aromatic dialdehyde) The aromatic dialdehyde used in the present invention is 0-fucuraldehyde, isophthalaldehyde and terephthalaldehyde.
(フェノール)
本発明で使用されるフェノール類としては、フェノール
、0−クレゾール、m−クレゾール、pクレゾール、p
−5ec−ブチルフェノール、pter t−ブチルフ
ェノール、クロルフェノール類、ブロムフェノール類等
が挙げられる。(Phenol) The phenols used in the present invention include phenol, 0-cresol, m-cresol, p-cresol, p-cresol, and p-cresol.
Examples include -5ec-butylphenol, pter t-butylphenol, chlorophenols, and bromophenols.
(酸触媒)
本発明に於いて使用される酸触媒は、塩酸、硫酸、無水
硫酸、p−トルエンスルホン酸、シュウ酸、リン酸、ト
リクロル酢酸、トリフルオロ酢酸、トリフルオロメタン
スルホン酸等が挙げられる。(Acid Catalyst) Examples of the acid catalyst used in the present invention include hydrochloric acid, sulfuric acid, sulfuric anhydride, p-toluenesulfonic acid, oxalic acid, phosphoric acid, trichloroacetic acid, trifluoroacetic acid, trifluoromethanesulfonic acid, etc. .
(反応方法)
ポリフェノールの製造は、芳香族ジアルデヒド1モルに
対し、フェノール類を5〜32モル、好ましくは、6〜
25モルの範囲で、酸触媒を芳香族ジアルデヒド100
重量部に対し、0.01〜10重量部、好ましくは0.
2〜5重量部添加し、80〜160℃の温度範囲で1〜
10時間脱水縮合を行い、過剰のフェノール類を留去す
ることによりポリフェノールを得る。(Reaction method) Polyphenols are produced by adding 5 to 32 moles of phenols, preferably 6 to 32 moles, of phenols per 1 mole of aromatic dialdehyde.
The acid catalyst is mixed with an aromatic dialdehyde in the range of 25 moles.
0.01 to 10 parts by weight, preferably 0.01 to 10 parts by weight.
Add 2 to 5 parts by weight and add 1 to 5 parts by weight in a temperature range of 80 to 160°C.
Polyphenols are obtained by performing dehydration condensation for 10 hours and distilling off excess phenols.
芳香族ジアルデヒド1モルに対し、フェノール類が5モ
ル未満であると、後記式(III)においてn=0であ
る5核体が30%未満になり、得られるポリフェノール
の軟化温度が200℃を超える。If the amount of phenol is less than 5 moles per mole of aromatic dialdehyde, the proportion of pentanuclear bodies with n=0 in formula (III) below will be less than 30%, and the softening temperature of the resulting polyphenol will be lower than 200°C. exceed.
また32モルを超えると、n=Qのものが90%を超え
、結晶化するためポリフェノールの軟化温度が200℃
以上となり好ましくない。Moreover, when the amount exceeds 32 moles, the proportion of n=Q exceeds 90% and crystallization occurs, so the softening temperature of the polyphenol increases to 200°C.
This is not preferable.
又、反応温度が低すぎると反応が進みにくく、高すぎる
と高分子量体が増加し、軟化温度が高くなるため好まし
くない。Furthermore, if the reaction temperature is too low, the reaction will be difficult to proceed, and if the reaction temperature is too high, the amount of high molecular weight will increase and the softening temperature will become high, which is not preferable.
(ポリフェノール)
本発明の方法により得られるポリフェノールは、下記−
殺伐(I[I)で示され、
(I[)
〔式中、Rは水素原子、ハロゲン原子、または炭素数1
〜4のアルキル基を示し、nは0又は1以上の整数であ
り、n=oが全組成の30〜90%の範囲である。〕
その軟化温度は80〜200℃の範囲にある。軟化温度
が80℃未満であると室温でブロッキング現象を起こし
取り扱いにくい。また200℃を超えるとエポキシ樹脂
用原料フェノール樹脂には実用的でない。(Polyphenol) The polyphenol obtained by the method of the present invention is as follows-
It is represented by (I[I), (I[) [wherein R is a hydrogen atom, a halogen atom, or a carbon number 1]
~4 alkyl group, n is an integer of 0 or 1 or more, and n=o is in the range of 30 to 90% of the total composition. ] Its softening temperature is in the range of 80 to 200°C. If the softening temperature is less than 80°C, a blocking phenomenon occurs at room temperature, making it difficult to handle. Further, if the temperature exceeds 200°C, it is not practical as a raw material phenolic resin for epoxy resin.
以下、実施例により本発明を更に詳細に説明する。 Hereinafter, the present invention will be explained in more detail with reference to Examples.
実施例1
温度計、冷却器および撹拌機を備えた21の四ロフラス
コ内にフェノール1.656 g、テレフタルアルデヒ
ド147.5 g (フェノール/テレフタルアルデヒ
ド=16/1モル比)および濃塩酸4.5gを仕込み1
10℃で3時間反応を行った。反応終了減圧下、温度2
00°Cでフェノールを留去した。Example 1 1.656 g of phenol, 147.5 g of terephthalaldehyde (phenol/terephthalaldehyde = 16/1 molar ratio) and 4.5 g of concentrated hydrochloric acid in a 21 four-hole flask equipped with a thermometer, condenser and stirrer. Preparation 1
The reaction was carried out at 10°C for 3 hours. At the end of the reaction, under reduced pressure, temperature 2
Phenol was distilled off at 00°C.
フェノールの留出が少なくなった時点で、水蒸気蒸留を
行い、完全にフェノールを留去し、赤褐色のポリフェノ
ール490gを得た。When the amount of phenol distilled out decreased, steam distillation was performed to completely remove phenol, yielding 490 g of reddish-brown polyphenol.
このポリフェノールの軟化温度は、155°Cであり、
n=0は69%であった。The softening temperature of this polyphenol is 155°C,
n=0 was 69%.
実施例2〜4、比較例1〜2
フェノール類、芳香族ジアルデヒドおよび酸触を表1の
ように変えてポリフェノールを得た。それらの結果を表
1に示す。Examples 2 to 4, Comparative Examples 1 to 2 Polyphenols were obtained by changing the phenols, aromatic dialdehydes, and acid catalysts as shown in Table 1. The results are shown in Table 1.
Claims (1)
5〜32モルの範囲内で、酸触媒の存在下、反応させる
ことを特徴とするポリフェノールの製造方法。1) A method for producing polyphenols, which comprises reacting 1 mole of aromatic dialdehyde with 5 to 32 moles of phenol in the presence of an acid catalyst.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP22579488A JPH0273819A (en) | 1988-09-09 | 1988-09-09 | Production of polyphenol |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP22579488A JPH0273819A (en) | 1988-09-09 | 1988-09-09 | Production of polyphenol |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0273819A true JPH0273819A (en) | 1990-03-13 |
Family
ID=16834884
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP22579488A Pending JPH0273819A (en) | 1988-09-09 | 1988-09-09 | Production of polyphenol |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0273819A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11233226B2 (en) | 2012-12-27 | 2022-01-25 | Kateeva, Inc. | Nozzle-droplet combination techniques to deposit fluids in substrate locations within precise tolerances |
-
1988
- 1988-09-09 JP JP22579488A patent/JPH0273819A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11233226B2 (en) | 2012-12-27 | 2022-01-25 | Kateeva, Inc. | Nozzle-droplet combination techniques to deposit fluids in substrate locations within precise tolerances |
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