JPH06136082A - Production of phenolic resin - Google Patents

Abstract

PURPOSE:To obtain a phenolic resin having an excellent thermosetting property and excellent in heat resistance and moisture resistance by reacting a phenolic compound, a polycyclic aromatic aldehyde and a specific xylylene compound ix the presence of an acid catalyst. CONSTITUTION:(A) A phenolic compound (preferably phenol), (B) a polycyclic aromatic aldehyde (preferably naphthoaldehyde) and (C) a xylylene compound of the formula (R is H, 1-4C alkyl)(preferably xylylene glycol, xylylene glycol dimethyl ether) in the presence of an acid catalyst (e.g. hydrochloric acid, benzenesulfonic acid) usually at 100-180 deg.C for 1-10hr to provide the objective resin. Since the reaction produces water by the condensation reaction and further produces an alcohol or a carboxylic acid in dependence on the kind of the component C, a water-removing treatment or the water-removing treatment and an alcohol-removing treatment or a carboxylic acid-removing treatment are preferably performed. The reaction is preferably performed under a nitrogen gas atmosphere in order to prevent the production of the component B.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for producing a phenolic resin having excellent heat resistance, low hygroscopicity and thermosetting property, which is useful for molding materials, laminating materials, various binders, coating materials and the like.

[0002]

2. Description of the Related Art Phenol formaldehyde resin is widely used for various purposes as an inexpensive heat resistant resin.
However, the phenol-formaldehyde resin shows an initial heat resistance of 200 ° C. or more when sufficiently after-cured, but the long-term heat resistance is 150 ° C. or less because the resin itself is easily oxidized due to the phenolic hydroxyl group. . Further, the presence of this phenolic hydroxyl group has relatively weak water resistance and alkali resistance, which limits its use.

For the purpose of improving the above-mentioned drawbacks, a phenol aralkyl resin (Japanese Patent Publication No. 47-1111, JP-A-4-142328) using an aralkyl compound such as p-xylylene glycol dimethyl ale instead of formaldehyde of the phenol resin is proposed. The heat resistance and water resistance were improved. However, in such a phenol aralkyl resin, the thermosetting property when the curing agent such as hexamethylenetetramine is added is drastically reduced, so that it is necessary to take a sufficiently long heating and curing time, which is practical in terms of productivity. There are major restrictions on the conversion.

Further, formaldehyde may be used in combination with the aralkyl compound of the phenol aralkyl resin (see JP-A-4-
142324), or modification by adding a phenol formaldehyde resin during or after the reaction (JP-A-4-173834, JP-B-58-58378). The properties are remarkably reduced, and there is no great difference from general phenol formaldehyde resins, and the purpose of improving heat resistance has not been achieved.

[0005]

SUMMARY OF THE INVENTION The present invention is to solve the above problems and provides a method for producing a phenolic resin having excellent heat resistance and moisture resistance while maintaining the excellent thermosetting property of the phenolic resin. It is an object.

[0006]

The present invention relates to phenols and polycyclic aromatic aldehydes and general formulas.

[Chemical 2] (In the formula, R represents hydrogen, an alkyl group having 1 to 4 carbon atoms, or an acyl group having 2 to 4 carbon atoms.) A phenol system characterized by reacting a xylylene compound in the presence of an acid catalyst. This is a resin manufacturing method.

Examples of the phenols used in the present invention include phenol, cresol, xylenol, ethylphenol, butylphenol, halogenated phenol and the like, but phenol is preferably used.

Examples of the polycyclic aromatic aldehyde include naphthaldehyde, methylnaphthaldehyde, dimethylnaphthaldehyde, ethylnaphthaldehyde, isopropylnaphthaldehyde, halogenated naphthaldehyde, acenaphthene aldehyde, anthracene aldehyde and the like, but preferably naphthaldehyde. Is.

The xylylene compound used in the present invention has the general formula

[Chemical 3] In such a xylylene compound, xylylene glycol, xylylene glycol dimethyl ether, xylylene glycol diethyl ether,
Examples thereof include xylylene glycol diacetoxy ester and xylylene glycol dipropoxy ester, and xylylene glycol and xylylene glycol dimethyl ether are particularly preferable.

The acid catalyst used in the present invention may be any of inorganic acids such as phosphoric acid, sulfuric acid and hydrochloric acid and organic acids such as oxalic acid, benzenesulfonic acid, toluenesulfonic acid and methanesulfonic acid, and xylylene compounds. Depending on the type of.

The reaction of the phenols with the polycyclic aromatic aldehyde and the xylylene compound is usually carried out at 100 to 180 ° C. for about 1 to 10 hours.

This reaction proceeds while producing alcohol or carboxylic acid depending on the type of xylylene compound used in addition to water produced by condensation. Therefore, dehydration or dehydration is carried out under normal pressure or reduced pressure, and dealcoholation or decarboxylation is carried out. Good to acid. However, in the initial stage of the reaction, the reaction can be carried out under reflux.

When the phenols are reacted with the polycyclic aromatic aldehyde and the xylylene compound in the presence of an acid catalyst, the polycyclic aromatic aldehyde and the xylylene compound may be added at the same time to proceed the reaction. It is also possible to add the reaction first and then add the other to continue the reaction.

Before the reaction, the inside of the reaction vessel is replaced with nitrogen gas, or nitrogen gas is caused to flow during the reaction to prevent the polycyclic aromatic aldehyde from being oxidized to form an aromatic carboxylic acid, and to produce a resin. Helps prevent coloration.

The total ratio of the polycyclic aromatic aldehyde and the xylylene compound to the phenols is preferably 0.4 to 0.95 per mol of the phenols. When it is less than 0.4, the molecular weight of the produced resin is small and unreacted phenols are large, which is not suitable. When it is 0.95 or more, an insoluble resin is produced as the molecular weight of the produced resin increases, which is not preferable.

The ratio of the xylylene compound to the polycyclic aromatic aldehyde is appropriately in the range of 0.1 to 10 per 1 mol of the polycyclic aromatic aldehyde, but preferably 0.2.
~ 5. When the ratio is 0.1 or less, the resin cured by adding a curing agent such as hexamethylenetetramine is hard and brittle, and mechanical properties (Charpy impact value) are remarkably poor. On the other hand, when it is 10 or more, when a curing agent such as hexamethylenetetramine is added for curing, the curing time becomes long and the productivity is poor, so that it is not practical for industrial use.

The resin obtained by the present invention has a number average molecular weight of about 500 to 3,000 and can be cured in a relatively short time by adding hexamethylenetetramine. The appropriate amount of hexamethylenetetramine with respect to the produced resin is 5 to 15 wt%. At the time of curing, thermosetting can be promoted by adding an alkaline earth metal compound such as magnesium oxide or calcium carbonate to the resin obtained by the present invention.

The phenolic resin obtained by the present invention is a fibrous reinforcing agent such as glass fiber, carbon fiber or aramid fiber, which is generally used for ordinary phenolic resin, glass powder, silica powder, graphite, PTFE powder, By forming a composite with a powdery filler such as molybdenum sulfide, it can be used as a molding material or a laminated material in a wide range of applications as mechanical, electronic and electric parts. It can also be used as a friction material for brake pads, brake linings, clutch facings, etc., for refractories, for seal molds, as a binder for grindstones, for paints, and for insulating varnishes. Further, the resin obtained by the present invention can be cured with a resol type phenol resin or an epoxy resin, and the obtained cured resin is suitable for electronic materials such as a printed circuit board and an IC sealant. As described above, the phenolic resin obtained by the present invention can be applied to the so-called general-purpose phenolic resin as it is for the compounding and use.

[0019]

EXAMPLES The present invention will be specifically described below with reference to examples. The curability of the resins obtained in Examples and Comparative Examples and the physical properties of the cured resins were measured by the following methods.

(1) Curastometer Curability 4 g of a powder sample obtained by adding 15 parts of hexamine to 100 parts of the phenolic resin obtained by the condensation reaction was set in a curast meter (VPS type manufactured by Orientec Co., Ltd.), The maximum torque value was measured at a load of 4 kgf / cm ² and a temperature of 170 ° C., and the torque increase rate when the torque increased from 20% to 80% of the maximum torque was measured and used as the curing rate.

(2) Moisture absorption rate Phenol resin is blended with 13 wt% of hexamine, and 2
The resin was cured by heating at 00 ° C. for 3 hours, and the obtained resin cured product was crushed and the moisture absorption rate was measured when a constant weight was obtained in an atmosphere with a relative humidity of 85% and a temperature of 30 ° C.

(3) 10% weight loss temperature When the crushed resin cured product sample is heated at a temperature rising rate of 10 ° C./min in an air stream by thermogravimetric analysis, the weight loss reaches 10% of the initial weight. Measure the temperature and set this to 1
The temperature was set to 0% weight loss temperature. The higher this value, the better the heat resistance.

(4) Bending strength (5) Bending elastic modulus (6) Charpy impact value 15 parts of hexamine and 50 parts of glass fiber were added to 100 parts of the phenolic resin obtained by the condensation reaction and kneaded on a hot roll. The product is crushed and 170 ℃ × 10 in the mold.
It was pressure molded for a minute. The flexural strength, flexural modulus, and Charpy impact value (all of which are JIS K-6
911).

Example 1 A four-necked flask equipped with a stirrer, a thermometer, a condenser, and an N ₂ gas inlet tube had 580 parts of phenol, 140 parts of naphthaldehyde and p-.
510 parts of xylylene glycol dimethyl ether, p-
Toluenesulfonic acid (9 parts) was added and the mixture was heated to 100 to 150 ° C., and the reaction was carried out for 4 hours while dehydrating and removing methanol. After that, the temperature was raised to 180 ° C., and the contents were taken out into a vat and cooled and solidified. The obtained resin was light yellow and transparent and had a softening point of 52 ° C.

15 parts of hexamine was added to 100 parts of this resin, curability of 170 ° C. curastometer was measured by the above method (1), and various physical properties were measured by the above methods (2) to (6). The results are shown in Table 2.

Example 2 Phenol, naphthaldehyde and xylylene compounds were mixed in the proportions shown in Table 1,
The reaction was carried out by the method of Example 1 to synthesize a phenolic resin, and 13 wt% of hexamine was added thereto, curability was measured in the same manner as in Example 1, and other physical properties were also the same as in Example 1. Was measured. The results are also shown in Table 2.

[Comparative Example 1] 1050 parts of phenol, 680 parts of 37% formalin, p in a four-necked flask equipped with a stirrer, a thermometer, a condenser and an N ₂ gas inlet tube.
Toluenesulfonic acid (4 parts) was added, and the mixture was heated to 100 ° C. or higher and reacted under reflux for 4 hours. Then while dehydrating 1
After heating to 80 ° C., the contents were taken out in a vat and cooled and solidified. A novolak type phenolic resin having a softening point of 74 ° C. was obtained. The curability of the resin and the physical properties of the cured resin were measured in the same manner as in Example 1. The results are also shown in Table 2.

[Comparative Example 2] 700 parts of p-xylylene glycol dimethyl ether and 10 parts of p-toluenesulfonic acid were added to 570 parts of phenol, and a resin was synthesized in the same manner as in Example 1 and in the same manner as in Example 1. Curastometer Curability and physical properties of the cured resin were measured. The curing rate of this resin was remarkably slower than that of the example, and it took a long time to cure. The results are also shown in Table 2.

[Comparative Example 3] To 570 parts of phenol, 660 parts of β-naphthaldehyde and 5 parts of p-toluenesulfonic acid were added, a phenolbenzaldehyde resin was synthesized in the same manner as in Comparative Example 2, and in the same manner as in Example 1. Curastometer Curability and physical properties of the cured resin were measured. Although this phenolnaphthoaldehyde resin has an excellent curing rate, the cured resin was a brittle resin having a small impact value. The results are also shown in Table 2.

[0030]

[Table 1]

[0031]

[Table 2]

As is clear from the results of Table 2, Example 1
The moisture absorption rate of the phenolic resin obtained by the method of the present invention is less than 1/2 of that of the ordinary phenolic resin, and the 10% weight loss temperature is 30 to 50 ° C higher than that of the phenolic resin. Therefore, a phenol resin having excellent heat resistance and humidity resistance can be obtained. Further, its curing speed is much higher than that of the phenol aralkyl resin of Comparative Example 2, and since it can be cured at a speed comparable to that of the phenol resin, the productivity is high. Further, compared with the phenolbenzaldehyde resin of Comparative Example 3, it is excellent as a molding material in that the impact value is high.

[0033]

EFFECTS OF THE INVENTION According to the present invention, a phenolic resin having excellent heat resistance and humidity resistance and thermosetting property can be obtained, and it can be widely used as a molding material, a laminate material, various binders, mechanical and electronic parts, and electric parts. Can be used for.

Claims (1)

[Claims] 1. Phenols, polycyclic aromatic aldehydes and general formula: (In the formula, R represents hydrogen, an alkyl group having 1 to 4 carbon atoms, or an acyl group having 2 to 4 carbon atoms.) A phenol system characterized by reacting a xylylene compound in the presence of an acid catalyst. Resin manufacturing method.