JPH0273687A - Mounting structure of surface mounted parts - Google Patents
Mounting structure of surface mounted partsInfo
- Publication number
- JPH0273687A JPH0273687A JP22541588A JP22541588A JPH0273687A JP H0273687 A JPH0273687 A JP H0273687A JP 22541588 A JP22541588 A JP 22541588A JP 22541588 A JP22541588 A JP 22541588A JP H0273687 A JPH0273687 A JP H0273687A
- Authority
- JP
- Japan
- Prior art keywords
- mounting
- groove
- conductive pattern
- surface mount
- parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 abstract 1
- 229910000679 solder Inorganic materials 0.000 description 8
- 239000000853 adhesive Substances 0.000 description 7
- 230000001070 adhesive effect Effects 0.000 description 7
- 239000006071 cream Substances 0.000 description 6
- 230000000694 effects Effects 0.000 description 4
- 230000000147 hypnotic effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は表面実装型の電気、電子部品をプリント板等に
実装するための構造に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a structure for mounting surface-mounted electrical or electronic components on a printed board or the like.
従来、この種の表面実装部品は、第２図に示すように、
プリント板１の部品搭載位置に表面実装部品２を載置し
、該部品２の両端に設けた電極３をプリントＦｉ、ｌに
設けた導電パターン４にクリーム半田５．又は導電性接
着剤等で機械的、電気的に接続する構造がとられている
。この場合、通常ではクリーム半田５や導電性接着剤を
導電パターン４に予め塗布しておき、部品搭載時に半田
を溶融させ、或いは接着剤を軟化させて接続を行うよう
にしている。Conventionally, this type of surface mount component, as shown in Figure 2,
A surface mount component 2 is placed on the component mounting position of the printed board 1, and the electrodes 3 provided at both ends of the component 2 are applied with cream solder 5. to the conductive pattern 4 provided on the print Fi,l. Alternatively, a structure is adopted in which mechanical and electrical connections are made using a conductive adhesive or the like. In this case, usually cream solder 5 or conductive adhesive is applied to the conductive pattern 4 in advance, and the solder is melted or the adhesive is softened when the component is mounted to make the connection.
上述した従来の実装構造は、クリーム半田や導電性接着
剤を予めプリント板の表面に塗布する等の準備作業が必
要であり、かつその塗布量を均一にする必要もあって、
作業が面倒になるという問題がある。また、実装に際し
てはクリーム半田を溶融し、導電性接着剤を軟化させる
ために熱源が必要とされ、かつ接続後の実装品質（部品
浮き。The conventional mounting structure described above requires preparation work such as applying cream solder or conductive adhesive to the surface of the printed board in advance, and it is also necessary to make the amount of application uniform.
There is a problem that the work becomes troublesome. In addition, during mounting, a heat source is required to melt the cream solder and soften the conductive adhesive, and the mounting quality after connection (parts floating) is required.
傾き、接続状態等）のチエツクに時間を要し、かつその
修正作業に相当の時間を要するという問題もある。There is also the problem that it takes time to check (inclination, connection status, etc.) and it takes a considerable amount of time to correct them.
本発明は実装作業を簡略化するとともに、実装品質を向
上することができる表面実装部品の実装構造を提供する
ことを目的とする。An object of the present invention is to provide a mounting structure for surface mount components that can simplify mounting work and improve mounting quality.
（課題を解決するための手段〕
本発明の表面実装部品の実装構造は、プリント板の表面
実装部品の搭載箇所に、該表面実装部品に対応した形状
の凹溝と、この凹溝の内面にその一部を延長させた導電
パターンとを設け、表面実装部品をこの凹溝内に圧入す
るとともに、その電掘を導電パターンに接触させた構成
としている。(Means for Solving the Problems) The surface mount component mounting structure of the present invention includes a groove having a shape corresponding to the surface mount component at the mounting location of the surface mount component on a printed circuit board, and an inner surface of the groove. A conductive pattern with a portion of the conductive pattern extended is provided, and the surface mount component is press-fitted into this groove, and the electric groove is brought into contact with the conductive pattern.
上述した構成では、表面実装部品は凹溝内に圧入によっ
て機械的に支持し、その電極を導電パターンに接触させ
て電気的接続を行なう。In the above-described configuration, the surface mount component is mechanically supported by press-fitting into the groove, and the electrode thereof is brought into contact with the conductive pattern to establish an electrical connection.
次に、本発明を図面を参照して説明する。 Next, the present invention will be explained with reference to the drawings.
第１図は本発明の一実施例の縦断面図である。FIG. 1 is a longitudinal sectional view of one embodiment of the present invention.
図において、１はプリント板、２はこのプリント板ｌに
実装する表面実装型の電子部品、例えばチップ型抵抗で
あり、その両端には電極３を形成している。ここで、前
記プリント板１の実装箇所には、実装する表面実装部品
２の平面形状に対応した形状、例えば部品２の長さ方向
の寸法よりも多少小さい長さ寸法を有する凹溝６を形成
している。In the figure, 1 is a printed board, 2 is a surface-mounted electronic component, such as a chip resistor, mounted on this printed board 1, and electrodes 3 are formed at both ends thereof. Here, a concave groove 6 having a shape corresponding to the planar shape of the surface mount component 2 to be mounted, for example, a length dimension somewhat smaller than the dimension in the length direction of the component 2, is formed at the mounting location of the printed board 1. are doing.
そして、この凹溝６の内面、内底面の所要領域には、プ
リント板１の他の表面領域につながる導電パターン４を
延長形成している。A conductive pattern 4 connected to other surface areas of the printed board 1 is formed in a required area on the inner surface and inner bottom surface of the groove 6 to extend.
しかる上で、前記表面実装型部品２をこの凹溝６内に圧
入状態で挿入し、この圧入関係により表面実装部品２を
凹溝６内に機械的に支持させ、かつその電極３を導電パ
ターン４に電気的に接続させている。Then, the surface mount component 2 is press-fitted into the groove 6, and this press-fit relationship mechanically supports the surface mount component 2 in the groove 6, and the electrode 3 is connected to the conductive pattern. It is electrically connected to 4.
この構成によれば、表面実装部品の実装時にはクリーム
半田や導電性接着剤を塗布する準備作業が不要となり、
しかも実装時には単に表面実装部品２を凹溝６内に圧入
させるだけでよい。このため、実装作業を極めて簡単な
ものにできるとともに、実装に際しては熱源を不要にで
きる効果もある。According to this configuration, there is no need to prepare for applying cream solder or conductive adhesive when mounting surface mount components.
Furthermore, during mounting, it is sufficient to simply press fit the surface mount component 2 into the groove 6. Therefore, the mounting work can be made extremely simple, and there is also the effect that a heat source is not required during mounting.
以上説明したように本発明は、プリント板に凹溝と導電
パターンを設け、表面実装部品をこの凹溝内に圧入して
その電極を導電パターンに接触させているので、表面実
装部品は凹溝内に圧入によって機械的に支持され、その
電極は導電パターンに接触されて電気的に接続され、半
田や導電性接着剤を不要にした実装が可能となり、作業
の簡略化を図るとともに実装の信頼性を向上できる効果
がある。As explained above, in the present invention, a printed board is provided with a groove and a conductive pattern, and a surface mount component is press-fitted into the groove and its electrode is brought into contact with the conductive pattern. The electrodes are mechanically supported by press-fitting inside, and the electrodes are electrically connected by contacting the conductive pattern, making it possible to mount without the need for solder or conductive adhesive, simplifying the work and increasing the reliability of the mounting. It has the effect of improving sex.
第１図は本発明の一実施例の縦断面図、第２図は従来構
造の縦断面図である。
１・・・プリント板、２・・・表面実装部品、３・・・
電極、４・・・導電パターン、５・・・クリーム半田、
６・・・凹溝。
第１図
２乏節気変潰ア品
第２図FIG. 1 is a longitudinal sectional view of an embodiment of the present invention, and FIG. 2 is a longitudinal sectional view of a conventional structure. 1...Printed board, 2...Surface mount components, 3...
Electrode, 4... Conductive pattern, 5... Cream solder,
6...concave groove. Fig. 1 2 Hypnosis 2 Fig. 2
Claims (1)
装部品に対応した形状の凹溝と、この凹溝の内面にその
一部を延長させた導電パターンとを設け、前記表面実装
部品をこの凹溝内に圧入するとともに、その電極を前記
導電パターンに接触させたことを特徴とする表面実装部
品の実装構造。1. A concave groove having a shape corresponding to the surface mount component is provided at the mounting location of the surface mount component on the printed circuit board, and a conductive pattern with a part of the conductive pattern extended on the inner surface of the concave groove, and the surface mount component is mounted in the concave groove. A mounting structure for a surface mount component, characterized in that the electrode is press-fitted into the groove and brought into contact with the conductive pattern.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22541588A JPH0273687A (en) | 1988-09-08 | 1988-09-08 | Mounting structure of surface mounted parts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22541588A JPH0273687A (en) | 1988-09-08 | 1988-09-08 | Mounting structure of surface mounted parts |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0273687A true JPH0273687A (en) | 1990-03-13 |
Family
ID=16829013
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP22541588A Pending JPH0273687A (en) | 1988-09-08 | 1988-09-08 | Mounting structure of surface mounted parts |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0273687A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1998044769A1 (en) * | 1997-03-27 | 1998-10-08 | Ford Motor Company | Moulded sockets for electronic component attachment |
-
1988
- 1988-09-08 JP JP22541588A patent/JPH0273687A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1998044769A1 (en) * | 1997-03-27 | 1998-10-08 | Ford Motor Company | Moulded sockets for electronic component attachment |
| US5994648A (en) * | 1997-03-27 | 1999-11-30 | Ford Motor Company | Three-dimensional molded sockets for mechanical and electrical component attachment |
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