JP2000196217A - Mounting structure of surface mounting electronic part - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a highly reliable mounting structure of a surface mounting electronic part which surely fixes and electrically connects a surface mounting electronic part on a substrate. SOLUTION: In a mounting structure of a surface mounting electronic part for mounting a surface mounting electronic part 1 such as a chip provided with an electrode 11 at both ends thereof on a substrate 2 wherein a specified conductor pattern is formed, a recessed part 22 to contain the surface mounting electronic part 1 is formed in a specified place of the substrate 2, elastic resin 4 is injected to the recessed part 22, the surface mounting electronic part 1 is contained in the recessed part 22 and an electrode 11 at both ends of the surface mounting electronic part 1 is pressed from above by a conductive elastic jig 5 connected to a connection electrode 21 whose one end is connected to a conductor pattern. As a result, the connection electrode 21 provided near the recessed part 22 and the electrode 11 at both ends of the surface mounting electronic part 1 are electrically connected and the surface mounting electronic part 1 is fixed to the substrate 2.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mounting structure of a surface-mounted electronic component such as a chip component, which is mounted on a substrate on which a predetermined conductor pattern is formed.

[0002]

2. Description of the Related Art Conventionally, as a method of mounting a surface mount type electronic component such as various chip components such as a resistor and a capacitor on a substrate on which a predetermined conductor pattern is formed, a solder cream is applied to the conductor pattern of the substrate. There is a method in which printing is applied to a predetermined portion of a connection electrode, a surface-mounted electronic component is mounted on the substrate, and then heated and reflow soldered. In this mounting method, as shown in FIG. 5, a skirt-shaped protruding portion called a solder fillet 3 is formed at a joint between the electrode 11 of the surface mount electronic component 1 and the connection electrode 21 of the conductor pattern of the substrate 2. Thereby, the surface-mount type electronic component 1 is fixed to the substrate 2, and the electrical connection with the connection electrode 21 of the conductor pattern of the substrate 2 is made.

[0003]

However, in the above-described mounting method, the molten solder is attracted onto the connection electrode 21 of the conductor pattern due to the surface tension of the molten solder at the time of reflow, and the self-alignment is performed. Since self alignment is performed, the surface mount electronic component 1
Has the advantage of simplifying the process of alignment on the substrate 2, but since the fixing between the surface-mount type electronic component 1 and the substrate 2 is performed only at the joints by the solder fillets 3, the temperature cycle and the There is a problem that fatigue cracks and slip cracks are generated in the solder fillet 3 due to stress generated by an external environment such as vibration and impact, thereby impairing fixing and electrical connection of the surface mount electronic component 1.

Japanese Patent Application Laid-Open No. 7-66207 discloses that
Although a method of fixing and electrically connecting a surface-mounted electronic component and a substrate using solder bumps is disclosed, even in this method, the fixing and electrical connection of both are performed only at the joints by the solder bumps. Therefore, there was a similar problem as described above.

The present invention has been made in view of the above points, and an object of the present invention is to provide a reliability capable of reliably fixing a surface-mounted electronic component on a substrate and making an electrical connection. It is an object of the present invention to provide a mounting structure for a surface-mounted electronic component having high reliability.

[0006]

According to the first aspect of the present invention,
In a mounting structure of a surface-mounted electronic component in which a surface-mounted electronic component such as a chip component provided with electrodes on both ends is mounted on a substrate on which a predetermined conductor pattern is formed, the surface-mounted electronic component is mounted at a predetermined position on the substrate. A concave portion capable of storing components is formed, an elastic resin is injected into the concave portion, the surface-mount type electronic component is stored in the concave portion, and one end is connected to a connection electrode connected to the conductor pattern. By pressing the electrodes at both ends of the surface-mounted electronic component from above with an elastic jig having a property, the electrical connection between the connection electrodes provided near the recess and the electrodes at both ends of the surface-mounted electronic component is made. And fixing the surface-mounted electronic component to a substrate.

According to a second aspect of the present invention, in the first aspect of the invention, the connection of the elastic jig to the connection electrode is
It is characterized by using a fastener.

According to a third aspect of the present invention, in the first aspect of the invention, the connection of the elastic jig to the connection electrode is
It is characterized in that it is performed by soldering.

According to a fourth aspect of the present invention, in the first aspect of the present invention, the whole of the elastic jig and the surface-mount type electronic component is covered with a film, and the film is brought into close contact with the substrate, so that the vicinity of the concave portion is provided. The electrical connection between the connection electrodes provided on the substrate and the electrodes at both ends of the surface-mounted electronic component is performed, and the surface-mounted electronic component is fixed to a substrate.

According to a fifth aspect of the present invention, there is provided a mounting structure of a surface-mounted electronic component for mounting a surface-mounted electronic component such as a chip component having electrodes on both ends on a substrate on which a predetermined conductor pattern is formed. Forming a first concave portion at a predetermined portion of the substrate, forming a second concave portion capable of accommodating the surface-mounted electronic component on the bottom surface of the first concave portion, and injecting an elastic resin into the second concave portion. Storing the surface-mounted electronic component in the second recess, and forming a connection electrode connected to the conductor pattern in the vicinity of the second recess on the bottom surface of the first recess; The connection electrodes and the electrodes at both ends of the surface-mount type electronic component are electrically connected by an elastic jig having conductivity, and an elastic resin is injected into the first concave portion. It is characterized in that it is fixed to a substrate.

[0011]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. FIGS. 1A and 1B schematically show a mounting structure of a surface-mount type electronic component according to a first embodiment of the present invention, wherein FIG. 1A is a plan view and FIG.
In the present embodiment, a concave portion 22 that can accommodate the surface-mounted electronic component 1 is formed at a predetermined position on the substrate 2, the elastic resin 4 is injected into the concave portion 22, and the surface-mounted electronic component 1 is inserted into the concave portion 22 from above. To store. The connection electrode 21 connected to the conductor pattern (not shown) is formed in the vicinity of the concave portion 22, and has conductivity in which one end is screwed to the substrate 2 from above the connection electrode 21 by a bolt (fastener) 6. By pressing the electrodes 11 at both ends of the surface-mounted electronic component 1 from above with the elastic jig 5,
The connection electrodes 21 are electrically connected to the electrodes 11 at both ends of the surface-mounted electronic component 1, and the surface-mounted electronic component 1 is fixed to the substrate 2.

According to the present embodiment, the surface mount electronic component 1 is mechanically pressed by the elasticity of the elastic jig 5 and the elastic resin 4 so as to be connected and fixed to the substrate 2. The connection between the connection electrode 21 and the electrodes 11 at both ends of the surface-mount type electronic component 1 is performed due to the nature of the substrate 2. Therefore, the substrate 2 expands and contracts due to an external environment such as a temperature cycle, vibration, or impact. The generated stress does not concentrate on the connection portion between the electrodes 11 on both ends of the surface mount type electronic component 1 and the connection electrode 21 on the substrate 2. Therefore, the substrate 2 of the surface mount electronic component 1
The reliability of the fixing on top and the electrical connection is improved.

FIG. 2 schematically shows a mounting structure of a surface mount type electronic component according to a second embodiment of the present invention.
(A) is a plan view and (b) is a cross-sectional view. In the present embodiment, the connection between the elastic jig 5 and the connection electrode 21 is performed by soldering in the first embodiment.

The present embodiment also has the same effect as the first embodiment. FIGS. 3A and 3B schematically show a mounting structure of a surface-mounted electronic component according to a third embodiment of the present invention, wherein FIG. 3A is a plan view and FIG. 3B is a cross-sectional view. In the present embodiment, in the first embodiment,
The elastic jig 5 and the entire surface mount type electronic component 1 are covered with a film 7, and the film 7 is brought into close contact with the substrate 2, thereby connecting the elastic jig 5 and the connection electrode 21.

In the present embodiment, the same effects as those of the first embodiment can be obtained. FIGS. 4A and 4B schematically show a mounting structure of a surface mount electronic component according to a fourth embodiment of the present invention, wherein FIG. 4A is a plan view and FIG. 4B is a cross-sectional view. In the present embodiment, the first concave portion 2 is provided at a predetermined portion of the substrate 2.
3 is provided, and a second concave portion 24 that can accommodate the surface-mounted electronic component 1 is formed on the bottom surface of the first concave portion 23. The elastic resin 4 is injected into the second concave portion 24, and the surface-mounted electronic component 1 is stored in the second concave portion 24 from above. A connection electrode 21 is formed near the second recess 24 on the bottom surface of the first recess 23, and the connection electrode 21 and the electrodes 11 at both ends of the surface-mounted electronic component 1 are electrically conductive jigs. 5, the surface mount type electronic component 1 is fixed to the substrate 2 by injecting the elastic resin 8 into the first recess 23 from above.

According to the present embodiment, the connection between the elastic jig 5 and the connection electrodes 21 and the electrodes 11 is performed by pressing the elastic jig 5 with the elastic resins 4 and 8. It has the same effect as.

[0017]

As described above, according to the first to fourth aspects of the present invention, a predetermined conductor pattern is formed on a surface mount type electronic component such as a chip component having electrodes provided at both ends. In the mounting structure of the surface-mounted electronic component mounted on the substrate, a concave portion capable of storing the surface-mounted electronic component is formed at a predetermined position on the substrate, an elastic resin is injected into the concave portion, and the surface mounting is performed on the concave portion. The electronic component is housed, and the electrodes at both ends of the surface-mounted electronic component are pressed from above with an elastic jig having conductivity connected at one end to a connection electrode connected to the conductor pattern, thereby forming the recess. The electrical connection between the connection electrodes provided in the vicinity of the substrate and the electrodes at both ends of the surface-mounted electronic component is performed, and the surface-mounted electronic component is fixed to the substrate. Surface mount electronic components Such stress does not concentrate on the connection portion between the electrodes at both ends of the surface-mounted electronic component and the connection electrode of the substrate, and the fixing of the surface-mounted electronic component on the substrate and the electrical connection are reliably performed. A highly reliable surface mounting type electronic component mounting structure can be provided.

According to the present invention, a surface-mounted electronic component such as a chip component having electrodes provided at both ends is mounted on a substrate on which a predetermined conductor pattern is formed. In the mounting structure of (1), a first concave portion is provided at a predetermined position on the substrate, and a second concave portion capable of accommodating the surface-mounted electronic component is further formed on a bottom surface of the first concave portion.
An elastic resin is injected into the concave portion, the surface-mount type electronic component is housed in the second concave portion, and connected to the conductor pattern in the vicinity of the second concave portion on the bottom surface of the first concave portion. By forming a connection electrode, electrically connecting the connection electrode and the electrodes at both ends of the surface-mounted electronic component with an elastic jig having conductivity, and injecting an elastic resin into the first concave portion. Since the surface-mount type electronic component is fixed to the substrate, the same effects as described above can be obtained.

[Brief description of the drawings]

FIGS. 1A and 1B schematically show a mounting structure of a surface-mount type electronic component according to a first embodiment of the present invention, wherein FIG. 1A is a plan view and FIG.

FIGS. 2A and 2B schematically show a mounting structure of a surface-mount type electronic component according to a second embodiment of the present invention, wherein FIG. 2A is a plan view and FIG.

FIGS. 3A and 3B schematically show a mounting structure of a surface-mounted electronic component according to a third embodiment of the present invention, wherein FIG. 3A is a plan view and FIG.

FIGS. 4A and 4B schematically show a mounting structure of a surface-mounted electronic component according to a fourth embodiment of the present invention, wherein FIG. 4A is a plan view and FIG.

FIG. 5 is a cross-sectional view schematically showing a mounting structure of a conventional surface mount electronic component.

[Explanation of symbols]

 1 surface mount type electronic component 2 substrate 3 solder fillet 4 elastic resin 5 elastic jig 6 bolt 7 film 8 elastic resin 11 electrode 21 connection electrode 22, 23, 24 recess

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Yasushi Tanaka 1048 Kazuma Kadoma, Kadoma City, Osaka Prefecture Inside the Matsushita Electric Works Co., Ltd. Terms (reference) 5E336 AA04 AA08 AA09 AA16 BB01 BC14 BC26 BC34 CC32 CC43 DD02 DD17 DD22 DD26 DD28 EE15 GG11

Claims (5)

[Claims] 1. A mounting structure of a surface-mounted electronic component for mounting a surface-mounted electronic component such as a chip component having electrodes on both ends on a substrate on which a predetermined conductor pattern is formed.
A concave portion capable of accommodating the surface-mounted electronic component is formed at a predetermined position on the substrate, an elastic resin is injected into the concave portion, the surface-mounted electronic component is accommodated in the concave portion, and one end is formed on the conductor pattern. By pressing the electrodes at both ends of the surface-mounted electronic component from above with an elastic jig having conductivity connected to the connection electrode to be connected, the connection electrode provided near the concave portion and the surface-mounted electronic component are pressed. A surface mounting electronic component mounting structure, wherein electrical connection with electrodes at both ends of the component is made and the surface mounting electronic component is fixed to a substrate. 2. The mounting structure according to claim 1, wherein the connection of the elastic jig to the connection electrode is performed by using a fastener. 3. The mounting structure according to claim 1, wherein the connection of the elastic jig to the connection electrode is performed by soldering. 4. An entire surface of the elastic jig and the surface-mounted electronic component is covered with a film, and the film is brought into close contact with the substrate, so that a connection electrode provided in the vicinity of the concave portion and the surface-mounted electronic component are 2. The mounting structure for a surface-mounted electronic component according to claim 1, wherein the surface-mounted electronic component is electrically connected to electrodes at both ends, and the surface-mounted electronic component is fixed to a substrate. 5. A mounting structure of a surface-mounted electronic component for mounting a surface-mounted electronic component such as a chip component having electrodes on both ends on a substrate on which a predetermined conductor pattern is formed.
A first concave portion is provided at a predetermined portion of the substrate, a second concave portion for accommodating the surface-mounted electronic component is further formed on the bottom surface of the first concave portion, and an elastic resin is injected into the second concave portion. Every
The surface mount type electronic component is housed in the second recess, and a connection electrode connected to the conductor pattern is formed near the second recess on the bottom surface of the first recess. And electrically connecting the electrodes at both ends of the surface-mounted electronic component with an elastic jig having conductivity, and injecting an elastic resin into the first recess to fix the surface-mounted electronic component to the substrate. A mounting structure of a surface-mounted electronic component, characterized in that: