JPH0272601A - Printed resistor - Google Patents
Printed resistorInfo
- Publication number
- JPH0272601A JPH0272601A JP63224335A JP22433588A JPH0272601A JP H0272601 A JPH0272601 A JP H0272601A JP 63224335 A JP63224335 A JP 63224335A JP 22433588 A JP22433588 A JP 22433588A JP H0272601 A JPH0272601 A JP H0272601A
- Authority
- JP
- Japan
- Prior art keywords
- resistor
- electrode
- layer electrode
- lower layer
- insulating substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims abstract description 21
- 239000004020 conductor Substances 0.000 claims description 3
- 239000012212 insulator Substances 0.000 claims description 2
- 238000009966 trimming Methods 0.000 abstract description 14
- 230000002950 deficient Effects 0.000 description 6
- 238000010304 firing Methods 0.000 description 4
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- CPLXHLVBOLITMK-UHFFFAOYSA-N Magnesium oxide Chemical compound [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- WDQNIWFZKXZFAY-UHFFFAOYSA-M fentin acetate Chemical compound CC([O-])=O.C1=CC=CC=C1[Sn+](C=1C=CC=CC=1)C1=CC=CC=C1 WDQNIWFZKXZFAY-UHFFFAOYSA-M 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- SWELZOZIOHGSPA-UHFFFAOYSA-N palladium silver Chemical compound [Pd].[Ag] SWELZOZIOHGSPA-UHFFFAOYSA-N 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000000088 plastic resin Substances 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 229910001925 ruthenium oxide Inorganic materials 0.000 description 1
- WOCIAKWEIIZHES-UHFFFAOYSA-N ruthenium(iv) oxide Chemical compound O=[Ru]=O WOCIAKWEIIZHES-UHFFFAOYSA-N 0.000 description 1
- 238000005488 sandblasting Methods 0.000 description 1
Landscapes
- Non-Adjustable Resistors (AREA)
Abstract
Description
【発明の詳細な説明】
［発明の目的コ
（産業上の利用分野）
本発明は印刷抵抗体に関し、特に混成集積回路に用いら
れるものである。DETAILED DESCRIPTION OF THE INVENTION OBJECTS OF THE INVENTION (Industrial Field of Application) The present invention relates to printed resistors, particularly for use in hybrid integrated circuits.
（従来の技術）
周知の如く、混成集積回路においては印刷抵抗体か用い
られているが、この印刷抵抗体の抵抗値はレーザ光線や
サンドブラストによってトリミングすることにより適宜
調整されている。(Prior Art) As is well known, a printed resistor is used in a hybrid integrated circuit, and the resistance value of the printed resistor is adjusted as appropriate by trimming with a laser beam or sandblasting.
第４図は、従来の印刷抵抗体を示す。図中の１は、アル
ミナなどからなる絶縁性基板を示す。この絶縁性基板１
上には、２つの電極２ａ、２ｂが対向して形成されてい
る。ここで、これらの電極２ａ、２ｂは、導電系ペース
トなどを印刷した後。FIG. 4 shows a conventional printed resistor. 1 in the figure indicates an insulating substrate made of alumina or the like. This insulating substrate 1
Two electrodes 2a and 2b are formed facing each other on the top. Here, these electrodes 2a and 2b are formed after printing a conductive paste or the like.
焼成することにより形成される。前記電極２ａ。It is formed by firing. The electrode 2a.
２ｂ間には、これらＥ［ｉ極２ａ、２ｂに一部オーバラ
ツブして印刷抵抗体３が形成されている。ここで、印刷
抵抗体３は、酸化ルテニウム系抵抗体ペストなどを印刷
した後、焼成することにより形成する。A printed resistor 3 is formed between these E[i-poles 2a and 2b by partially overlapping them. Here, the printed resistor 3 is formed by printing a ruthenium oxide resistor paste or the like and then firing it.
こうした印刷抵抗体の抵抗値を調整するときは、所望と
する抵抗値以下となるように抵抗値幅及び長さを設計し
ておき、レーザ装置４（又はサントプラスター装置等）
により抵抗体３の一部をトリミングしてトリミング？？
１５を形成することにより所望の抵抗値に調整していた
。When adjusting the resistance value of such a printed resistor, design the resistance value width and length so that it is below the desired resistance value, and use the laser device 4 (or Santoplaster device, etc.)
Trimming by trimming a part of resistor 3? ?
15, the resistance value was adjusted to a desired value.
しかしながら、従来の印刷抵抗体によれば、トリミング
するにつれて印刷抵抗体３の抵抗値か−Ｌ昇するように
なっているため、トリミングの際所望する抵抗値を越え
てしまった場合抵抗値を１１Ｉび下げる事が不可能であ
り、絶縁性基板全体を不良としなければならなかった。However, according to the conventional printed resistor, the resistance value of the printed resistor 3 increases by -L as it is trimmed, so if the desired resistance value is exceeded during trimming, the resistance value is increased by 11I. It was impossible to lower the insulating substrate, and the entire insulating substrate had to be defective.
また、絶縁性基板１上に抵抗体ペーストを印刷、焼成し
て印刷抵抗体３を形成する際、焼成後の抵抗値か所望す
る抵抗値以上になった場合にも、上記と同様に絶縁性基
板全体を不良としなければならない。Furthermore, when printing and firing the resistor paste on the insulating substrate 1 to form the printed resistor 3, even if the resistance value after firing exceeds the desired resistance value, the insulation The entire board must be considered defective.
（発明が解決しようとする課題）
本発明は上記事情に鑑みてなされたもので、印刷抵抗体
の抵抗値が所望する抵抗値を越えた場合でも、絶縁性基
板全体を不良にすることなく抵抗値の調整が可能な印刷
抵抗体を提供することを目的とする。(Problems to be Solved by the Invention) The present invention has been made in view of the above circumstances, and even if the resistance value of the printed resistor exceeds the desired resistance value, the present invention is capable of resisting the printed resistor without making the entire insulating substrate defective. The purpose of the present invention is to provide a printed resistor whose value can be adjusted.
［発明の構成］
（課題を解決するための手段）
本発明は、絶縁性基板上に設けられたＦ層電極、この下
層電極上に印刷形成され、レーザ照射により絶縁体から
導電体に変異する変異層、及びこの変異層−にに設けら
れた１−層電極からなる短絡回路と、この短絡回路に並
列に接続された第１抵抗体と、この第１抵抗体に直列に
接続された第２抵抗体とを具備することを特徴とする印
刷抵抗体である。[Structure of the Invention] (Means for Solving the Problems) The present invention provides an F layer electrode provided on an insulating substrate, which is printed on the lower layer electrode, and changes from an insulator to a conductor by laser irradiation. A short circuit consisting of a variation layer, a 1-layer electrode provided on the variation layer, a first resistor connected in parallel to the short circuit, and a first resistor connected in series to the first resistor. This is a printed resistor characterized by comprising two resistors.
本発明において、絶縁性基板の祠料としてはアルミナ（
Ａ、、＆２ ｏ３） 、ＡｉＮ、マグネシア、ジルコニ
ア、石英ガラス、アルミニウムなどが挙げられる。In the present invention, alumina (
A, &2 o3), AiN, magnesia, zirconia, quartz glass, aluminum, etc.
本発明において、１−層電極と下層電極との電気的接続
はレーザ光線を照射することによりｊｌうが、下層・上
層電極間の変異層としてはレーザ照射により導電性をも
つ絶縁材料例えば可塑性樹脂バインダーとしてポリメチ
ルメタアクリレートを１５％用い、ジメチルホルムアミ
ドに溶解させ、粒径５００人の超微細銅粉を混合した材
料を用いて両者間の導通を行なう。In the present invention, the electrical connection between the first layer electrode and the lower layer electrode is established by irradiating the first layer electrode with a laser beam, and the layer between the lower layer electrode and the upper layer electrode is made of an insulating material that becomes conductive by laser irradiation, such as plastic resin. Conductivity between the two is established using a material in which 15% polymethyl methacrylate is used as a binder, dissolved in dimethyl formamide, and ultrafine copper powder with a particle size of 500 is mixed.
（作用）
本発明によれば、１回目の抵抗体のトリミングで所望す
る抵抗値を越えた場合でも、下層電極と−Ｅ層電極との
重なり合う部分にレーザ光線を照射して下層電極と上層
電極とを電気的に導通させることにより、上昇しすぎた
抵抗値を下げて所望する抵抗値を容易に得ることかでき
る。従って、従来のように絶縁性基板全体を不良扱いす
ることを回避できる。また、第２抵抗体か［−記第１抵
抗体と直列に接続されているため、レーザ光線の照射に
より抵抗値がドがり過ぎたときでも、第２抵抗体を第１
抵抗体と同様にトリミングすることにより、所望の抵抗
値を得ることかできる。(Function) According to the present invention, even if the desired resistance value is exceeded in the first trimming of the resistor, the laser beam is irradiated to the overlapping portion of the lower layer electrode and the -E layer electrode, and the lower layer electrode and the upper layer electrode By electrically connecting them, it is possible to lower the resistance value that has increased too much and easily obtain the desired resistance value. Therefore, it is possible to avoid treating the entire insulating substrate as defective as in the conventional case. In addition, since the second resistor is connected in series with the first resistor, even if the resistance value becomes too low due to laser beam irradiation, the second resistor can be connected to the first resistor.
A desired resistance value can be obtained by trimming the resistor in the same way as the resistor.
（実施例） 以下、本発明の一実施例を第１図（Ａ）。(Example) An embodiment of the present invention is shown in FIG. 1(A) below.
（Ｂ）、（Ｃ）及び第２図を参照して説明する。This will be explained with reference to (B), (C) and FIG.
ここで、同図（Ａ）は本発明に係る印刷抵抗体の平面図
、同図（Ｂ）は同図（Ａ）のＸ−Ｘ線に沿う断面図、同
図（Ｃ）は同図（Ａ）のＹ−Ｙ線に沿うレーザ照射前の
断面図、第２図は同図（Ａ）のＹ−Ｙ線に沿うレーザ照
射後の断面図である。Here, the same figure (A) is a plan view of the printed resistor according to the present invention, the same figure (B) is a cross-sectional view along the X-X line of the same figure (A), and the same figure (C) is the same figure ( A) is a cross-sectional view taken along line Y-Y before laser irradiation, and FIG. 2 is a cross-sectional view taken along line Y-Y in FIG. 2A after laser irradiation.
図中の１１は、例えばアルミナからなる絶縁性基板であ
る。この絶縁性基板Ｉｎには、一部が下層電極１２が形
成されている。前記絶縁性基板１１上には、−Ｌ層電極
１３が前記下層電極Ｉ２と絶縁ペーストよりなる変異層
１４を介してオーバラップして形成されている。ここで
、前記下層電極１２．変異層１４゜及び１１層電極１３
を総称して短絡回路と呼ぶ。また、前記変異層１４は、
レーザ照射により絶縁状態から導電状態に変化する性質
を有する。前記層電極１２゜１３は、絶縁性基板ｌｌ上
に例えば銀パラジウム系ペストあるいは銅系導体ペース
トなどの導電ペーストを印刷、焼成することにより形成
する。11 in the figure is an insulating substrate made of, for example, alumina. A lower layer electrode 12 is partially formed on this insulating substrate In. A −L layer electrode 13 is formed on the insulating substrate 11 so as to overlap with the lower layer electrode I2 via a variation layer 14 made of an insulating paste. Here, the lower layer electrode 12. Variation layer 14° and 11 layer electrode 13
are collectively called short circuits. Further, the variation layer 14 is
It has the property of changing from an insulating state to a conductive state by laser irradiation. The layer electrodes 12 and 13 are formed by printing and baking a conductive paste such as a silver-palladium paste or a copper-based conductive paste on an insulating substrate 11.
また、前記絶縁性基板ｌｌ上には、第１抵抗体１５が前
記下層・上層電極１２．１３と一部でオーバラップしな
がら前記短絡回路と並列に接続されている。Further, on the insulating substrate 11, a first resistor 15 is connected in parallel to the short circuit while partially overlapping with the lower and upper layer electrodes 12.13.
前記絶縁性基板１１上には一部か前記下層電極１２と平
行な電極１６が形成され、かかる電極１６と前記下層電
極配線層１３間には一部がこれらにオーバラップする第
２抵抗体１７か前記第１抵抗体１５と直列に形成されて
いる。An electrode 16 partially parallel to the lower electrode 12 is formed on the insulating substrate 11, and a second resistor 17 is disposed between the electrode 16 and the lower electrode wiring layer 13 and partially overlaps the electrode 16. or is formed in series with the first resistor 15.
こうした印刷抵抗体の抵抗１ＩＩｌｉを調整するときは
、次のようにして行う。第′３図を参照する。The resistance 1IIli of such a printed resistor is adjusted as follows. See Figure '3.
■まず、第１抵抗体１５をその端部から下層電極ｌ２の
長手方向に沿ってトリミングする（第３図の点Ｐ、より
開始）。この際、−度のトリミングにより設定した抵抗
値Ｒ（第′う図の点０．）か得られたときは、トリミン
グを終ｒする。(1) First, the first resistor 15 is trimmed from its end along the longitudinal direction of the lower electrode 12 (starting from point P in FIG. 3). At this time, when the set resistance value R (point 0 in Figure 1) is obtained by -degree trimming, the trimming is terminated.
■しかし、設定した抵抗値Ｒを越えて例えば点Ｐ２まで
トリミングした場合は、第２図に示す如く下層電極１２
と上層電極１３の重なり合う部分にレザ光線を照射して
両電極間の変異層１４を選択的に蒸発させて穴を明ける
とともに変異層１４を導電体１４ａに変え、更に下層電
極１２及び上層電極１３を溶融して両者間を電気的に導
通させる。この操作により、点Ｐ２まで」１昇した抵抗
値を第３図の点Ｐ３まで下げることができる。■However, if trimming exceeds the set resistance value R and reaches point P2, for example, as shown in FIG.
A laser beam is irradiated onto the overlapping portion of the upper layer electrode 13 to selectively evaporate the mutant layer 14 between the two electrodes to form a hole and change the mutant layer 14 into a conductor 14a. is melted to create electrical continuity between the two. By this operation, the resistance value, which has increased by 1 to point P2, can be lowered to point P3 in FIG.
■上記レーザ光線の照射により抵抗値か下がり過ぎたと
き（点Ｐ３）は、第２抵抗体１７を第１抵抗体１５と同
様にトリミングすることにより、所望の抵抗値Ｒを得る
（点０．）。このようにして所望する抵抗値を１１ｊる
。(2) If the resistance value drops too much due to the laser beam irradiation (point P3), the desired resistance value R is obtained by trimming the second resistor 17 in the same way as the first resistor 15 (point 0. ). In this way, the desired resistance value is determined by 11j.
しかして、上記実施例によれば、変異層１４及びこの変
異層１４を介して部分的にオーバラップする下層・」二
層電極１２．１３からなる短絡回路に並列に第１抵抗体
１５を接続するとともに、この第１抵抗体１５に直列に
第２抵抗体１７を接続し、しかも前記下層電極１２と上
層電極１３との重なり合う部分にレザ光線を照射して下
層電極１２と上層電極１３とを電気的に導通させる構成
となっているため、１回目の抵抗体１５のトリミングで
所望する抵抗値を越えた場合でも、下層電極１２と上層
電極１３との重なり合う部分にレーザ光線を照射して下
層電極１２と上層電極１３とを電気的に導通させること
により、上昇しすぎた抵抗値をドげて所望する抵抗値を
容品にｍることかできる。従って、従来のように絶縁性
基板全体を不良扱いすることを回避できる。According to the embodiment described above, the first resistor 15 is connected in parallel to the short circuit consisting of the variation layer 14 and the lower layer/double layer electrodes 12 and 13 which partially overlap each other via the variation layer 14. At the same time, a second resistor 17 is connected in series to the first resistor 15, and a laser beam is applied to the overlapping portion of the lower electrode 12 and the upper electrode 13 to separate the lower electrode 12 and the upper electrode 13. Since it is configured to be electrically conductive, even if the desired resistance value is exceeded in the first trimming of the resistor 15, the overlapping portion of the lower layer electrode 12 and the upper layer electrode 13 is irradiated with a laser beam to remove the lower layer. By electrically connecting the electrode 12 and the upper layer electrode 13, the resistance value that has increased too much can be reduced and the desired resistance value can be achieved in the product. Therefore, it is possible to avoid treating the entire insulating substrate as defective as in the conventional case.
また、上記第１抵抗体１５と直列に第２抵抗体１７が接
続されているため、レーザ光線の照射により抵抗値が下
がり過ぎたときでも、第２抵抗体Ｌ７を第１抵抗体１５
と同様にトリミングすることにより、所望の抵抗値Ｒを
得ることができる。Furthermore, since the second resistor 17 is connected in series with the first resistor 15, even when the resistance value decreases too much due to laser beam irradiation, the second resistor L7 is connected to the first resistor 15.
By trimming in the same manner as above, a desired resistance value R can be obtained.
［発明の効＋Ａ！：］
以ト詳述した如く本発明によれは、印刷抵抗体の抵抗値
が所望する抵抗値を越えた場合でも、絶縁性基板全体を
不良にすることなく抵抗値の調整が可能な歩留りの高い
印刷抵抗体を提供できる。[Efficacy of invention +A! :] As described in detail below, the present invention provides a high-yield method that allows the resistance value to be adjusted without making the entire insulating substrate defective even when the resistance value of the printed resistor exceeds the desired resistance value. A high quality printed resistor can be provided.
第１図（Ａ）は本発明に係る印刷抵抗体の平面図、同図
（Ｂ）は同図（Ａ）のＸ−Ｘ線に沿うｌｌｉ面図、同図
（Ｃ）は同図（Ａ）のＹ−Ｙ線に沿うレーザ照射後の断
面図、第２図は同図（Ａ）のＹ−Ｙ線に沿うレーザ照射
後の断面図、第３図は本発明に係る印刷抵抗体の抵抗値
とトリミング量との関係を示す説明図、第４図は従来の
印刷抵抗体の説明図である。
１１・・・絶縁性基板、１２・・下層電極、１３・・・
」二層電極、１４・・・変異層、１５・・第１抵抗体、
１６・・電極、１７・第２抵抗体。
出願人代理人 弁理士 鈴ｔ１．武ＣＳα
浦戚竿FIG. 1(A) is a plan view of a printed resistor according to the present invention, FIG. 2 is a cross-sectional view of the printed resistor according to the present invention after laser irradiation along the Y-Y line of FIG. FIG. 4 is an explanatory diagram showing the relationship between resistance value and trimming amount, and FIG. 4 is an explanatory diagram of a conventional printed resistor. 11... Insulating substrate, 12... Lower layer electrode, 13...
"Two-layer electrode, 14... Variation layer, 15... First resistor,
16. Electrode, 17. Second resistor. Applicant's agent Patent attorney Suzu t1. Take CSα Ura Kaikan
Claims (1)
に印刷形成され，レーザ照射により絶縁体から導電体に
変異する変異層、及びこの変異層上に設けられた上層電
極からなる短絡回路と、この短絡回路に並列に接続され
た第１抵抗体と、この第１抵抗体に直列に接続された第
２抵抗体とを具備することを特徴とする印刷抵抗体。A short circuit consisting of a lower layer electrode provided on an insulating substrate, a variant layer printed on this lower layer electrode that changes from an insulator to a conductor by laser irradiation, and an upper layer electrode provided on this variant layer. , a first resistor connected in parallel to the short circuit, and a second resistor connected in series to the first resistor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63224335A JPH0272601A (en) | 1988-09-07 | 1988-09-07 | Printed resistor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63224335A JPH0272601A (en) | 1988-09-07 | 1988-09-07 | Printed resistor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0272601A true JPH0272601A (en) | 1990-03-12 |
Family
ID=16812146
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63224335A Pending JPH0272601A (en) | 1988-09-07 | 1988-09-07 | Printed resistor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0272601A (en) |
-
1988
- 1988-09-07 JP JP63224335A patent/JPH0272601A/en active Pending
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