JPH0272556U - - Google Patents
Info
- Publication number
- JPH0272556U JPH0272556U JP15128188U JP15128188U JPH0272556U JP H0272556 U JPH0272556 U JP H0272556U JP 15128188 U JP15128188 U JP 15128188U JP 15128188 U JP15128188 U JP 15128188U JP H0272556 U JPH0272556 U JP H0272556U
- Authority
- JP
- Japan
- Prior art keywords
- lead
- wide
- width
- semiconductor device
- external
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 16
- 238000009795 derivation Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988151281U JPH0710498Y2 (ja) | 1988-11-22 | 1988-11-22 | 半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988151281U JPH0710498Y2 (ja) | 1988-11-22 | 1988-11-22 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0272556U true JPH0272556U (US08197722-20120612-C00042.png) | 1990-06-01 |
| JPH0710498Y2 JPH0710498Y2 (ja) | 1995-03-08 |
Family
ID=31425183
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988151281U Expired - Lifetime JPH0710498Y2 (ja) | 1988-11-22 | 1988-11-22 | 半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0710498Y2 (US08197722-20120612-C00042.png) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011029402A (ja) * | 2009-07-24 | 2011-02-10 | Daishinku Corp | リードタイプの電子部品及びリードフレーム |
| KR101016715B1 (ko) * | 2008-04-15 | 2011-02-25 | 미쓰비시덴키 가부시키가이샤 | 반도체장치 |
| JP2013162113A (ja) * | 2012-02-09 | 2013-08-19 | Fdk Corp | 巻線部品 |
| JP2018117019A (ja) * | 2017-01-17 | 2018-07-26 | 三菱電機株式会社 | 半導体装置 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58144850U (ja) * | 1982-03-24 | 1983-09-29 | 日本電気株式会社 | 多端子集積回路ケ−スの構造 |
-
1988
- 1988-11-22 JP JP1988151281U patent/JPH0710498Y2/ja not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58144850U (ja) * | 1982-03-24 | 1983-09-29 | 日本電気株式会社 | 多端子集積回路ケ−スの構造 |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101016715B1 (ko) * | 2008-04-15 | 2011-02-25 | 미쓰비시덴키 가부시키가이샤 | 반도체장치 |
| JP2011029402A (ja) * | 2009-07-24 | 2011-02-10 | Daishinku Corp | リードタイプの電子部品及びリードフレーム |
| JP2013162113A (ja) * | 2012-02-09 | 2013-08-19 | Fdk Corp | 巻線部品 |
| JP2018117019A (ja) * | 2017-01-17 | 2018-07-26 | 三菱電機株式会社 | 半導体装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0710498Y2 (ja) | 1995-03-08 |
