JPH02714U - - Google Patents
Info
- Publication number
- JPH02714U JPH02714U JP7844488U JP7844488U JPH02714U JP H02714 U JPH02714 U JP H02714U JP 7844488 U JP7844488 U JP 7844488U JP 7844488 U JP7844488 U JP 7844488U JP H02714 U JPH02714 U JP H02714U
- Authority
- JP
- Japan
- Prior art keywords
- metallized
- lead wire
- metallized surface
- film capacitor
- capacitor element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000003990 capacitor Substances 0.000 claims description 8
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 7
- 239000011104 metalized film Substances 0.000 claims 2
- 238000010586 diagram Methods 0.000 description 3
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Description
第1図は通常用いられているコンデンサ素子の
メタリコン面とリード線の接続状態を示す説明図
、第2図は偏平より線を用いたリード線とコンデ
ンサ素子のメタリコン面との接続状態を示す説明
図、第3図はコンデンサ素子のメタリコン面を立
体的に拡げたときのリード線とメタリコン面の接
続状態を示す説明図。第4図は本考案のコンデン
サ素子のメタリコン面とリード線の接続状態を示
す説明図である。
1……コンデンサ素子、2……メタリコン面、
3……リード線、4……半田付け、5……接合部
材。
Figure 1 is an explanatory diagram showing the connection between the metallcon surface of a capacitor element and the lead wire, which are commonly used, and Figure 2 is an explanatory diagram showing the connection between the lead wire using a flat stranded wire and the metallcon surface of the capacitor element. FIG. 3 is an explanatory view showing the state of connection between the lead wire and the metallized surface of the capacitor element when the metallized surface of the capacitor element is expanded three-dimensionally. FIG. 4 is an explanatory diagram showing the state of connection between the metallcon surface of the capacitor element of the present invention and the lead wire. 1... Capacitor element, 2... Metallicon surface,
3... Lead wire, 4... Soldering, 5... Joining member.
Claims (1)
ン面にリード線を接続する場合に、リード線に加
わる外力が接合部材の直角の折曲部分を通つてメ
タリコン面に伝達されるような構造の接合部材を
介してリード線をメタリコン面に接合するように
した金属化フイルムコンデンサ。 When a lead wire is connected to the metallized surface of the end of a metallized film capacitor element, the external force applied to the lead wire is transmitted to the metallized surface through a right-angled bent portion of the jointed member through a joining member having a structure. A metallized film capacitor whose lead wires are bonded to the metallized surface.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1988078444U JPH0635459Y2 (en) | 1988-06-14 | 1988-06-14 | Metallized film capacitors |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1988078444U JPH0635459Y2 (en) | 1988-06-14 | 1988-06-14 | Metallized film capacitors |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH02714U true JPH02714U (en) | 1990-01-05 |
JPH0635459Y2 JPH0635459Y2 (en) | 1994-09-14 |
Family
ID=31303367
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1988078444U Expired - Lifetime JPH0635459Y2 (en) | 1988-06-14 | 1988-06-14 | Metallized film capacitors |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0635459Y2 (en) |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4211568Y1 (en) * | 1964-09-16 | 1967-06-28 | ||
JPS62120334U (en) * | 1986-01-22 | 1987-07-30 |
-
1988
- 1988-06-14 JP JP1988078444U patent/JPH0635459Y2/en not_active Expired - Lifetime
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4211568Y1 (en) * | 1964-09-16 | 1967-06-28 | ||
JPS62120334U (en) * | 1986-01-22 | 1987-07-30 |
Also Published As
Publication number | Publication date |
---|---|
JPH0635459Y2 (en) | 1994-09-14 |
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