JPH0270447U - - Google Patents

Info

Publication number
JPH0270447U
JPH0270447U JP1988150469U JP15046988U JPH0270447U JP H0270447 U JPH0270447 U JP H0270447U JP 1988150469 U JP1988150469 U JP 1988150469U JP 15046988 U JP15046988 U JP 15046988U JP H0270447 U JPH0270447 U JP H0270447U
Authority
JP
Japan
Prior art keywords
circuit board
recess
placement
utility
sides
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1988150469U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988150469U priority Critical patent/JPH0270447U/ja
Publication of JPH0270447U publication Critical patent/JPH0270447U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15151—Shape the die mounting substrate comprising an aperture, e.g. for underfilling, outgassing, window type wire connections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/15165—Monolayer substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Die Bonding (AREA)
JP1988150469U 1988-11-18 1988-11-18 Pending JPH0270447U (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988150469U JPH0270447U (fr) 1988-11-18 1988-11-18

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988150469U JPH0270447U (fr) 1988-11-18 1988-11-18

Publications (1)

Publication Number Publication Date
JPH0270447U true JPH0270447U (fr) 1990-05-29

Family

ID=31423644

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988150469U Pending JPH0270447U (fr) 1988-11-18 1988-11-18

Country Status (1)

Country Link
JP (1) JPH0270447U (fr)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0845968A (ja) * 1994-08-04 1996-02-16 Nec Corp 半導体パッケージ
JPH08167678A (ja) * 1994-12-09 1996-06-25 Sony Corp 半導体装置
JP2818975B2 (ja) * 1992-06-23 1998-10-30 ミンテック コーポレーション 界面活性剤を含有する中空繊維膜とその製造法
JP4489137B1 (ja) * 2009-01-20 2010-06-23 パナソニック株式会社 回路モジュール及び電子機器

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2818975B2 (ja) * 1992-06-23 1998-10-30 ミンテック コーポレーション 界面活性剤を含有する中空繊維膜とその製造法
JPH0845968A (ja) * 1994-08-04 1996-02-16 Nec Corp 半導体パッケージ
JPH08167678A (ja) * 1994-12-09 1996-06-25 Sony Corp 半導体装置
JP4489137B1 (ja) * 2009-01-20 2010-06-23 パナソニック株式会社 回路モジュール及び電子機器
JP2010171082A (ja) * 2009-01-20 2010-08-05 Panasonic Corp 回路モジュール及び電子機器

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