JPH0270439U - - Google Patents

Info

Publication number
JPH0270439U
JPH0270439U JP1988087677U JP8767788U JPH0270439U JP H0270439 U JPH0270439 U JP H0270439U JP 1988087677 U JP1988087677 U JP 1988087677U JP 8767788 U JP8767788 U JP 8767788U JP H0270439 U JPH0270439 U JP H0270439U
Authority
JP
Japan
Prior art keywords
bonding
detection means
tool
wire
pressure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1988087677U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988087677U priority Critical patent/JPH0270439U/ja
Publication of JPH0270439U publication Critical patent/JPH0270439U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Description

【図面の簡単な説明】
第１図は本考案の一実施例にかかるワイヤボン
デイング装置の概略説明図、第２図は同実施例に
おけるワイヤボンデイング前の状態の概略説明図
、第３図及び第４図はそれぞれ従来のワイヤボン
デイング装置の概略説明図である。 １……ボンデイングツール、３……駆動機構、
６……金属細線、２２……圧力センサ（圧力検出
手段）、４３……リード、４２……半導体ペレツ
ト、４２ａ……電極。
補正 平１．１２．２０ 図面の簡単な説明を次のように補正する。 明細書第１０頁下から第８行の「及び第４図は
それぞれ」を、「は」に訂正する。

Claims (1)

  1. 【実用新案登録請求の範囲】 ボンデイングツールより供給される金属細線で
    リードと半導体ペレツトの電極とを超音波ボンデ
    イングするワイヤボンデイング装置において、 上記ボンデイングツールによるボンデイング時
    のボンデイング圧を検出する圧力検出手段と、該
    圧力検出手段によつて検出されるボンデイング圧
    に対してボンデイングツールを上下動させる駆動
    機構とを備えたことを特徴とするワイヤボンデイ
    ング装置。
JP1988087677U 1988-06-30 1988-06-30 Pending JPH0270439U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988087677U JPH0270439U (ja) 1988-06-30 1988-06-30

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988087677U JPH0270439U (ja) 1988-06-30 1988-06-30

Publications (1)

Publication Number Publication Date
JPH0270439U true JPH0270439U (ja) 1990-05-29

Family

ID=31312278

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988087677U Pending JPH0270439U (ja) 1988-06-30 1988-06-30

Country Status (1)

Country Link
JP (1) JPH0270439U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008021839A (ja) * 2006-07-13 2008-01-31 Shinkawa Ltd ワイヤボンディング装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008021839A (ja) * 2006-07-13 2008-01-31 Shinkawa Ltd ワイヤボンディング装置
JP4679454B2 (ja) * 2006-07-13 2011-04-27 株式会社新川 ワイヤボンディング装置

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