JPH0268469U - - Google Patents
Info
- Publication number
- JPH0268469U JPH0268469U JP14815288U JP14815288U JPH0268469U JP H0268469 U JPH0268469 U JP H0268469U JP 14815288 U JP14815288 U JP 14815288U JP 14815288 U JP14815288 U JP 14815288U JP H0268469 U JPH0268469 U JP H0268469U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- hybrid integrated
- substrate
- conductive sheet
- circuit according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims description 8
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- 239000004020 conductor Substances 0.000 claims 5
- 229910052782 aluminium Inorganic materials 0.000 claims 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 1
- 238000009413 insulation Methods 0.000 claims 1
- 239000007769 metal material Substances 0.000 claims 1
- 238000007789 sealing Methods 0.000 claims 1
Landscapes
- Structure Of Printed Boards (AREA)
- Casings For Electric Apparatus (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988148152U JPH0638438Y2 (ja) | 1988-11-14 | 1988-11-14 | 混成集積回路装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988148152U JPH0638438Y2 (ja) | 1988-11-14 | 1988-11-14 | 混成集積回路装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0268469U true JPH0268469U (de) | 1990-05-24 |
| JPH0638438Y2 JPH0638438Y2 (ja) | 1994-10-05 |
Family
ID=31419210
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988148152U Expired - Lifetime JPH0638438Y2 (ja) | 1988-11-14 | 1988-11-14 | 混成集積回路装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0638438Y2 (de) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013222829A (ja) * | 2012-04-17 | 2013-10-28 | Taiyo Yuden Co Ltd | 回路モジュール及びその製造方法 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS497453U (de) * | 1972-04-24 | 1974-01-22 | ||
| JPS5958709A (ja) * | 1983-08-22 | 1984-04-04 | 東レ株式会社 | 異方導電性シ−ト |
-
1988
- 1988-11-14 JP JP1988148152U patent/JPH0638438Y2/ja not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS497453U (de) * | 1972-04-24 | 1974-01-22 | ||
| JPS5958709A (ja) * | 1983-08-22 | 1984-04-04 | 東レ株式会社 | 異方導電性シ−ト |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013222829A (ja) * | 2012-04-17 | 2013-10-28 | Taiyo Yuden Co Ltd | 回路モジュール及びその製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0638438Y2 (ja) | 1994-10-05 |