JPH026626Y2 - - Google Patents
Info
- Publication number
- JPH026626Y2 JPH026626Y2 JP12252487U JP12252487U JPH026626Y2 JP H026626 Y2 JPH026626 Y2 JP H026626Y2 JP 12252487 U JP12252487 U JP 12252487U JP 12252487 U JP12252487 U JP 12252487U JP H026626 Y2 JPH026626 Y2 JP H026626Y2
- Authority
- JP
- Japan
- Prior art keywords
- cylindrical
- dielectric
- conductor
- cable
- coaxial
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004020 conductor Substances 0.000 claims description 48
- 230000001012 protector Effects 0.000 claims description 5
- 238000005452 bending Methods 0.000 description 8
- 239000003989 dielectric material Substances 0.000 description 3
- 238000002788 crimping Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000013011 mating Effects 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000007665 sagging Methods 0.000 description 1
- 239000011265 semifinished product Substances 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Coupling Device And Connection With Printed Circuit (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12252487U JPH026626Y2 (no) | 1987-08-12 | 1987-08-12 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12252487U JPH026626Y2 (no) | 1987-08-12 | 1987-08-12 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6427983U JPS6427983U (no) | 1989-02-17 |
JPH026626Y2 true JPH026626Y2 (no) | 1990-02-16 |
Family
ID=31370537
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12252487U Expired JPH026626Y2 (no) | 1987-08-12 | 1987-08-12 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH026626Y2 (no) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5059481B2 (ja) * | 2007-05-08 | 2012-10-24 | 株式会社オートネットワーク技術研究所 | シールドコネクタ |
-
1987
- 1987-08-12 JP JP12252487U patent/JPH026626Y2/ja not_active Expired
Also Published As
Publication number | Publication date |
---|---|
JPS6427983U (no) | 1989-02-17 |
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