JPH0265167A - Ic lead cutting device - Google Patents
Ic lead cutting deviceInfo
- Publication number
- JPH0265167A JPH0265167A JP21580188A JP21580188A JPH0265167A JP H0265167 A JPH0265167 A JP H0265167A JP 21580188 A JP21580188 A JP 21580188A JP 21580188 A JP21580188 A JP 21580188A JP H0265167 A JPH0265167 A JP H0265167A
- Authority
- JP
- Japan
- Prior art keywords
- cutting
- cut
- external frame
- saddle
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000000694 effects Effects 0.000 description 2
- 230000002950 deficient Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Abstract
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明はＩＣのリード切断装置に関するものである。[Detailed description of the invention] [Industrial application field] The present invention relates to an IC lead cutting device.
従来、この種のリード切断装置は第３図及び第４図に示
すように、切断鞍３にＩＣＩを位置させ、該ＩＣＩの表
面を押さえて、ＩＣＩのまわりに形成された外部フレー
ム２を切断刃４にて切断していた。Conventionally, this type of lead cutting device positions an ICI in a cutting saddle 3, presses the surface of the ICI, and cuts an external frame 2 formed around the ICI, as shown in FIGS. 3 and 4. It was cut with blade 4.
上述した従来の切断装置はＩＣＩのまわりに形成された
外部フレーム２に接続する外部リード先端を切断する方
式のため、切断後、リード端子１ａの先端部の外部フレ
ーム２ｂはＩＣＩから切り離されて落下するが、ＩＣ１
の前後方向に形成されているコ字形の外部フレーム２ａ
は切断鞍３の表面上に残り落下しないので、ＩＣＩの滑
走の妨げになり、装置の稼働が不安定になる。また、切
断鞍３上に残った外部フレーム２ａ上に次のＩＣＩが滑
走してきて乗り上げた場合、リード端子１ａの切断寸法
がばらついたり、リード端子１ａの斜め切れが発生し、
品質の低下あるいは不良品を発生させるという欠点があ
る。The conventional cutting device described above cuts the tip of the external lead connected to the external frame 2 formed around the ICI, so after cutting, the external frame 2b at the tip of the lead terminal 1a is separated from the ICI and falls. However, IC1
A U-shaped external frame 2a formed in the front-back direction of
Since it remains on the surface of the cutting saddle 3 and does not fall, it obstructs the sliding of the ICI and makes the operation of the device unstable. Furthermore, if the next ICI slides onto the external frame 2a remaining on the cutting saddle 3 and rides on it, the cutting dimensions of the lead terminal 1a may vary or the lead terminal 1a may be cut diagonally.
This method has the drawback of reducing quality or producing defective products.
本発明の目的は前記課題を解決したＩＣのリード切断装
置を提供することにある。An object of the present invention is to provide an IC lead cutting device that solves the above problems.
上述した従来のＩＣのリード切断装置に対し１本発明は
切断後に切断鞍上に残った外部フレームを吸引除去する
という相違点を有する。The present invention differs from the conventional IC lead cutting apparatus described above in that the external frame remaining on the cutting saddle is removed by suction after cutting.
前記目的を達成するため１本発明は切断鞍上にＩＣを載
置し、該ＩＣのリード端子間を連結する外部フレームを
切断するリード切断装置において、前記切断鞍上に切り
落とされた外部フレームを該切断鞍上から吸引除去する
機構を装備したものである。In order to achieve the above object, the present invention provides a lead cutting device that places an IC on a cutting saddle and cuts an external frame connecting lead terminals of the IC. It is equipped with a mechanism for suction removal from above the cutting saddle.
次に、本発明について図面を参照して説明する。 Next, the present invention will be explained with reference to the drawings.
第１図は本発明の一実施例を示す斜視図である。FIG. 1 is a perspective view showing an embodiment of the present invention.
図において、本発明はＩＣＩが送り込まれる切断鞍３と
、ＩＣＩのリード端子１ａの先端部相互間を連結する外
部フレーム２ｂを切断する切断刃４と、ＩＣＩの前後方
向に切断された外部フレーム２ａを上方に吸引するエア
ーダクト５とからなる。In the figure, the present invention includes a cutting saddle 3 into which the ICI is sent, a cutting blade 4 that cuts the external frame 2b that connects the tips of the lead terminals 1a of the ICI, and an external frame 2a that cuts the ICI in the front-rear direction. and an air duct 5 that sucks the air upward.
第１図、第２図に示すように、リード成形後のＩＣ１，
が切断鞍３上に送り込まれると、ＩＣ１の表面を押さえ
て切断刃４の往復運動によりＩＣＩのリード端子１ａの
先端に形成されている外部フレーム２ｂを切断する。同
時にＩＣＩの前後方向に形成されたコの字形の外部フレ
ーム２ａを切断し、その切断された外部フレーム２ａを
エアーダクト５により上方に吸引除去する。As shown in Figures 1 and 2, IC1 after lead forming,
When the blade is fed onto the cutting saddle 3, the surface of the IC 1 is pressed and the cutting blade 4 reciprocates to cut the external frame 2b formed at the tip of the lead terminal 1a of the ICI. At the same time, the U-shaped external frame 2a formed in the front-rear direction of the ICI is cut, and the cut external frame 2a is sucked upward and removed by the air duct 5.
以上説明したように本発明は吸引ダクトを使用すること
により、切断後のコ字形外部フレームを切断鞍から除去
することができ、外部フレーム残りによるＩＣの引っか
かりもなく、またリードの切断寸法のバラツキもなくな
り、製品品質を確保できるという効果がある。As explained above, the present invention uses a suction duct to remove the U-shaped external frame after cutting from the cutting saddle, eliminates the possibility that the IC will be caught by the remaining external frame, and eliminates variations in the cut dimensions of the leads. This has the effect of ensuring product quality.
第１図、第２図は本発明の実施例を示す斜視図、第３図
、第４図は従来装置の例を示す斜視図である。
１・・・ＩＣ２ａ、２ｂ・・・外部フレーム３・・・切
断鞍 ４・・・切断刃５・・・エアーダクト
特許出願人 九州日本電気株式会社
／
第２図
地４図1 and 2 are perspective views showing an embodiment of the present invention, and FIGS. 3 and 4 are perspective views showing examples of conventional devices. 1... IC2a, 2b... External frame 3... Cutting saddle 4... Cutting blade 5... Air duct Patent applicant Kyushu NEC Co., Ltd. / Figure 2 Map 4
Claims (1)
を連結する外部フレームを切断するリード切断装置にお
いて、前記切断鞍上に切り落とされた外部フレームを該
切断鞍上から吸引除去する機構を装備したことを特徴と
するＩＣのリード切断装置。(1) In a lead cutting device that places an IC on a cutting saddle and cuts an external frame connecting lead terminals of the IC, the external frame cut off on the cutting saddle is removed by suction from above the cutting saddle. An IC lead cutting device characterized by being equipped with a mechanism for cutting.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21580188A JPH0265167A (en) | 1988-08-30 | 1988-08-30 | Ic lead cutting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21580188A JPH0265167A (en) | 1988-08-30 | 1988-08-30 | Ic lead cutting device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0265167A true JPH0265167A (en) | 1990-03-05 |
Family
ID=16678477
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP21580188A Pending JPH0265167A (en) | 1988-08-30 | 1988-08-30 | Ic lead cutting device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0265167A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102015001886A1 (en) | 2014-02-20 | 2015-08-20 | Fanuc Corporation | Gas laser device that performs an improved commissioning process |
-
1988
- 1988-08-30 JP JP21580188A patent/JPH0265167A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102015001886A1 (en) | 2014-02-20 | 2015-08-20 | Fanuc Corporation | Gas laser device that performs an improved commissioning process |
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