JPH0263536U - - Google Patents
Info
- Publication number
- JPH0263536U JPH0263536U JP14283988U JP14283988U JPH0263536U JP H0263536 U JPH0263536 U JP H0263536U JP 14283988 U JP14283988 U JP 14283988U JP 14283988 U JP14283988 U JP 14283988U JP H0263536 U JPH0263536 U JP H0263536U
- Authority
- JP
- Japan
- Prior art keywords
- step motor
- positioning
- rotary cam
- cam
- pellets
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000008188 pellet Substances 0.000 claims description 4
- 210000000078 claw Anatomy 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
Landscapes
- Die Bonding (AREA)
Description
第1図は本願考案の一実施例を概略的に示す斜
視図、第2図は回転カムの形状を示す平面図、第
3図は位置決め爪の作動例説明図、第4図は本願
考案を適用した位置決め装置のペレツトボンデイ
ング装置における配置例の説明図である。
1…位置決め装置、3…位置決めステージ、4
,5…位置決め爪、14,15…カムフオロア、
16,18…回転カム、22,23…ステージモ
ータ、24,25…プーリ、16,17…無端索
条(無端ベルト)。
Fig. 1 is a perspective view schematically showing an embodiment of the present invention, Fig. 2 is a plan view showing the shape of the rotating cam, Fig. 3 is an explanatory diagram of an example of the operation of the positioning pawl, and Fig. 4 is a perspective view schematically showing an embodiment of the present invention. FIG. 3 is an explanatory diagram of an example of the arrangement of the applied positioning device in the pellet bonding device. 1...Positioning device, 3...Positioning stage, 4
, 5... positioning claw, 14, 15... cam follower,
16, 18... Rotating cam, 22, 23... Stage motor, 24, 25... Pulley, 16, 17... Endless cable (endless belt).
Claims (1)
つて移動しうるように支持した二個またはそれ以
上の位置決め爪にそれぞれカムフオロアを取付け
るとともに、上記カムフオロアに当接し、垂直方
向の軸回りに回転することにより上記位置決め爪
を往復動させる回転カムを設ける一方、制御手段
によつて回転制御されるステツプモータを設ける
とともに、上記回転カムの軸と上記ステツプモー
タの出力軸とにそれぞれ取付けたプーリ間に無端
索条を掛け回すことにより、上記ステツプモータ
で回転カムを駆動するように構成したことを特徴
とする、半導体ペレツトの位置決め装置。 A cam follower is attached to each of two or more positioning claws that are supported so as to be movable toward the pellet loading section at the center of the positioning stage, and the pellets are brought into contact with the cam follower and rotated around a vertical axis. A rotary cam for reciprocating the positioning pawl is provided, and a step motor whose rotation is controlled by a control means is provided, and an endless cable is provided between the pulleys attached to the shaft of the rotary cam and the output shaft of the step motor, respectively. 1. A positioning device for semiconductor pellets, characterized in that the step motor is configured to drive a rotary cam by rotating the step motor.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1988142839U JPH087631Y2 (en) | 1988-11-01 | 1988-11-01 | Semiconductor pellet positioning device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1988142839U JPH087631Y2 (en) | 1988-11-01 | 1988-11-01 | Semiconductor pellet positioning device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0263536U true JPH0263536U (en) | 1990-05-11 |
JPH087631Y2 JPH087631Y2 (en) | 1996-03-04 |
Family
ID=31409127
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1988142839U Expired - Lifetime JPH087631Y2 (en) | 1988-11-01 | 1988-11-01 | Semiconductor pellet positioning device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH087631Y2 (en) |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS615531A (en) * | 1984-06-20 | 1986-01-11 | Akita Denshi Kk | Semiconductor assembling device |
JPS61115331A (en) * | 1984-11-12 | 1986-06-02 | Oki Electric Ind Co Ltd | Ic assembling apparatus |
JPS61163646A (en) * | 1985-01-16 | 1986-07-24 | Nec Corp | Lifting gear for tool of tape bonding device |
JPS6225430A (en) * | 1985-07-26 | 1987-02-03 | Matsushita Electric Ind Co Ltd | Chip bonding device |
-
1988
- 1988-11-01 JP JP1988142839U patent/JPH087631Y2/en not_active Expired - Lifetime
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS615531A (en) * | 1984-06-20 | 1986-01-11 | Akita Denshi Kk | Semiconductor assembling device |
JPS61115331A (en) * | 1984-11-12 | 1986-06-02 | Oki Electric Ind Co Ltd | Ic assembling apparatus |
JPS61163646A (en) * | 1985-01-16 | 1986-07-24 | Nec Corp | Lifting gear for tool of tape bonding device |
JPS6225430A (en) * | 1985-07-26 | 1987-02-03 | Matsushita Electric Ind Co Ltd | Chip bonding device |
Also Published As
Publication number | Publication date |
---|---|
JPH087631Y2 (en) | 1996-03-04 |
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