JPH0262776U - - Google Patents
Info
- Publication number
- JPH0262776U JPH0262776U JP14211788U JP14211788U JPH0262776U JP H0262776 U JPH0262776 U JP H0262776U JP 14211788 U JP14211788 U JP 14211788U JP 14211788 U JP14211788 U JP 14211788U JP H0262776 U JPH0262776 U JP H0262776U
- Authority
- JP
- Japan
- Prior art keywords
- copper layer
- power supply
- wiring board
- printed wiring
- supply wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 8
- 229910052802 copper Inorganic materials 0.000 claims description 8
- 239000010949 copper Substances 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229920003217 poly(methylsilsesquioxane) Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14211788U JPH0262776U (un) | 1988-10-31 | 1988-10-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14211788U JPH0262776U (un) | 1988-10-31 | 1988-10-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0262776U true JPH0262776U (un) | 1990-05-10 |
Family
ID=31407790
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14211788U Pending JPH0262776U (un) | 1988-10-31 | 1988-10-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0262776U (un) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5368870A (en) * | 1976-12-01 | 1978-06-19 | Oki Electric Ind Co Ltd | Multilayer board |
| JPS57133698A (en) * | 1981-02-12 | 1982-08-18 | Nippon Electric Co | Ceramic multilayer circuit |
| JPS60177696A (ja) * | 1984-02-23 | 1985-09-11 | 日本電気株式会社 | 複合セラミツク基板 |
-
1988
- 1988-10-31 JP JP14211788U patent/JPH0262776U/ja active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5368870A (en) * | 1976-12-01 | 1978-06-19 | Oki Electric Ind Co Ltd | Multilayer board |
| JPS57133698A (en) * | 1981-02-12 | 1982-08-18 | Nippon Electric Co | Ceramic multilayer circuit |
| JPS60177696A (ja) * | 1984-02-23 | 1985-09-11 | 日本電気株式会社 | 複合セラミツク基板 |
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