JPH0262760U - - Google Patents

Info

Publication number

JPH0262760U

JPH0262760U JP14229488U JP14229488U JPH0262760U JP H0262760 U JPH0262760 U JP H0262760U JP 14229488 U JP14229488 U JP 14229488U JP 14229488 U JP14229488 U JP 14229488U JP H0262760 U JPH0262760 U JP H0262760U

Authority

JP

Japan

Prior art keywords

product board

board part

substrate

solder

printed wiring

Prior art date

1988-10-31

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• 238000007747 plating Methods 0.000 claims description 4
• 229910000679 solder Inorganic materials 0.000 claims 3
• 239000000758 substrate Substances 0.000 claims 3
• 230000003014 reinforcing effect Effects 0.000 claims 2
• 238000000926 separation method Methods 0.000 claims 2
• RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
• 239000011889 copper foil Substances 0.000 description 1

Cited By (6)