JPH0262741U - - Google Patents
Info
- Publication number
- JPH0262741U JPH0262741U JP14131788U JP14131788U JPH0262741U JP H0262741 U JPH0262741 U JP H0262741U JP 14131788 U JP14131788 U JP 14131788U JP 14131788 U JP14131788 U JP 14131788U JP H0262741 U JPH0262741 U JP H0262741U
- Authority
- JP
- Japan
- Prior art keywords
- constant voltage
- integrated circuit
- signal pad
- circuit device
- current source
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010586 diagram Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/02—Bonding areas ; Manufacturing methods related thereto
- H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L24/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0555—Shape
- H01L2224/05552—Shape in top view
- H01L2224/05554—Shape in top view being square
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Semiconductor Integrated Circuits (AREA)
- Design And Manufacture Of Integrated Circuits (AREA)
Description
第１図は本考案のチツプ概略平面図、第２図は
、従来のチツプ概略平面図、第３図は、ＥＣＬ回
路構成図である。
１，２，３，７，８，９，１０，１１，１６，
１７，１８，２２，２３，２４，２５，２６……
信号パツド、４，６，１９，２１……電源パツド
、５，２０……電源配線、１２，２７……定電流
源用定電圧配線、１３，２８……定電流源用定電
圧発生回路、１４，１５……定電流源用定電圧取
り出し配線、Ｇ１……基準ベース電圧発生回路、
Ｇ２……定電流源用定電圧発生回路、Ｑ１，Ｑ２
，Ｑ３……回路構成トランジスタ、Ｒ１，Ｒ２…
…コレクタ抵抗、ＩＣＳ……定電流源。
FIG. 1 is a schematic plan view of a chip according to the present invention, FIG. 2 is a schematic plan view of a conventional chip, and FIG. 3 is an ECL circuit configuration diagram. 1, 2, 3, 7, 8, 9, 10, 11, 16,
17, 18, 22, 23, 24, 25, 26...
Signal pad, 4, 6, 19, 21... Power supply pad, 5, 20... Power supply wiring, 12, 27... Constant voltage wiring for constant current source, 13, 28... Constant voltage generation circuit for constant current source, 14, 15... Constant voltage extraction wiring for constant current source, G1... Reference base voltage generation circuit,
G2... Constant voltage generation circuit for constant current source, Q1, Q2
, Q3...Circuit configuration transistor, R1, R2...
...Collector resistance, ICS... Constant current source.
Claims (1)
パツドに取り出す接続配線により任意の信号パツ
ドに出力することを特徴とする集積回路装置。 An integrated circuit device characterized in that a constant voltage generated within the integrated circuit device is output to an arbitrary signal pad through connection wiring that takes out the constant voltage to the signal pad.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14131788U JPH0262741U (en) | 1988-10-28 | 1988-10-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14131788U JPH0262741U (en) | 1988-10-28 | 1988-10-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0262741U true JPH0262741U (en) | 1990-05-10 |
Family
ID=31406271
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14131788U Pending JPH0262741U (en) | 1988-10-28 | 1988-10-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0262741U (en) |
-
1988
- 1988-10-28 JP JP14131788U patent/JPH0262741U/ja active Pending