JPH0262734U - - Google Patents
Info
- Publication number
- JPH0262734U JPH0262734U JP13993388U JP13993388U JPH0262734U JP H0262734 U JPH0262734 U JP H0262734U JP 13993388 U JP13993388 U JP 13993388U JP 13993388 U JP13993388 U JP 13993388U JP H0262734 U JPH0262734 U JP H0262734U
- Authority
- JP
- Japan
- Prior art keywords
- lead
- metal conductor
- semiconductor device
- integrated
- center
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000919 ceramic Substances 0.000 claims description 6
- 239000004065 semiconductor Substances 0.000 claims description 4
- 239000004020 conductor Substances 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims description 2
- 239000011295 pitch Substances 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988139933U JPH0755003Y2 (ja) | 1988-10-28 | 1988-10-28 | 半導体素子用セラミックパッケージ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988139933U JPH0755003Y2 (ja) | 1988-10-28 | 1988-10-28 | 半導体素子用セラミックパッケージ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0262734U true JPH0262734U (de) | 1990-05-10 |
| JPH0755003Y2 JPH0755003Y2 (ja) | 1995-12-18 |
Family
ID=31403649
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988139933U Expired - Lifetime JPH0755003Y2 (ja) | 1988-10-28 | 1988-10-28 | 半導体素子用セラミックパッケージ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0755003Y2 (de) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007242743A (ja) * | 2006-03-07 | 2007-09-20 | Hitachi Ltd | 鉛フリーはんだを用いたリード付き電子部品 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60142546A (ja) * | 1983-12-29 | 1985-07-27 | Matsushita Electronics Corp | 半導体集積回路用パツケ−ジ |
| JPS62232949A (ja) * | 1986-04-02 | 1987-10-13 | Nec Corp | 半導体装置用パツケ−ジ |
-
1988
- 1988-10-28 JP JP1988139933U patent/JPH0755003Y2/ja not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60142546A (ja) * | 1983-12-29 | 1985-07-27 | Matsushita Electronics Corp | 半導体集積回路用パツケ−ジ |
| JPS62232949A (ja) * | 1986-04-02 | 1987-10-13 | Nec Corp | 半導体装置用パツケ−ジ |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007242743A (ja) * | 2006-03-07 | 2007-09-20 | Hitachi Ltd | 鉛フリーはんだを用いたリード付き電子部品 |
| JP4595835B2 (ja) * | 2006-03-07 | 2010-12-08 | 株式会社日立製作所 | 鉛フリーはんだを用いたリード付き電子部品 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0755003Y2 (ja) | 1995-12-18 |