JPS61205145U - - Google Patents
Info
- Publication number
- JPS61205145U JPS61205145U JP8981786U JP8981786U JPS61205145U JP S61205145 U JPS61205145 U JP S61205145U JP 8981786 U JP8981786 U JP 8981786U JP 8981786 U JP8981786 U JP 8981786U JP S61205145 U JPS61205145 U JP S61205145U
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- integrated circuit
- mounting portions
- registration request
- positions corresponding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 description 2
- 239000004020 conductor Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8981786U JPS61205145U (de) | 1986-06-12 | 1986-06-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8981786U JPS61205145U (de) | 1986-06-12 | 1986-06-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61205145U true JPS61205145U (de) | 1986-12-24 |
Family
ID=30644255
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8981786U Pending JPS61205145U (de) | 1986-06-12 | 1986-06-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61205145U (de) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012064914A (ja) * | 2010-09-16 | 2012-03-29 | Samsung Electro-Mechanics Co Ltd | 放熱基板及びその製造方法 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS50143072A (de) * | 1974-05-08 | 1975-11-18 |
-
1986
- 1986-06-12 JP JP8981786U patent/JPS61205145U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS50143072A (de) * | 1974-05-08 | 1975-11-18 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012064914A (ja) * | 2010-09-16 | 2012-03-29 | Samsung Electro-Mechanics Co Ltd | 放熱基板及びその製造方法 |