JPH026166U - - Google Patents
Info
- Publication number
- JPH026166U JPH026166U JP264589U JP264589U JPH026166U JP H026166 U JPH026166 U JP H026166U JP 264589 U JP264589 U JP 264589U JP 264589 U JP264589 U JP 264589U JP H026166 U JPH026166 U JP H026166U
- Authority
- JP
- Japan
- Prior art keywords
- nozzle
- guide pin
- dispenser
- substrate
- cream solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 6
- 239000006071 cream Substances 0.000 claims description 5
- 239000000758 substrate Substances 0.000 claims description 4
- 238000001179 sorption measurement Methods 0.000 description 1
Landscapes
- Coating Apparatus (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第1図は本考案の一実施例の正面図、第2図は
吸着チヤツク駆動部を断面で示す側面図、第3図
はデイスペンサユニツトの上下機構の側面図、第
4図は同上の平面図、第5図はノズルとガイドピ
ンの高さ関係を示す正面図、第6図は同上のクリ
ームハンダ塗布時を示す正面図、第7図は同上の
ICセツト時を示す正面図、第8図はノズルとガ
イドピンの軌跡図である。
A……基板、1……吸着チヤツク、2……IC
、3……吸盤、4……軸、5……スリーブ、7…
…DCサーボモータ、9……ネジ軸、12……連
結ユニツト、17……モータ、20……固定ガイ
ド枠、25……デイスペンサユニツト、26……
シリンダ、31……ノズル、35……ガイドピン
、36……回転盤。
Fig. 1 is a front view of an embodiment of the present invention, Fig. 2 is a side view showing a section of the suction chuck drive section, Fig. 3 is a side view of the vertical mechanism of the dispenser unit, and Fig. 4 is a plan view of the same. Figure 5 is a front view showing the height relationship between the nozzle and guide pin, Figure 6 is a front view showing the same as above when applying cream solder, Figure 7 is a front view showing same as above when IC is set, and Figure 8 is a front view showing the same as above when applying the cream solder. The figure shows the trajectory of the nozzle and guide pin. A...Substrate, 1...Adsorption chuck, 2...IC
, 3... Suction cup, 4... Shaft, 5... Sleeve, 7...
...DC servo motor, 9...Screw shaft, 12...Connection unit, 17...Motor, 20...Fixed guide frame, 25...Dispenser unit, 26...
Cylinder, 31...nozzle, 35...guide pin, 36...rotating disk.
Claims (1)
イスペンサと、前記ノズルの周囲を回動可能にデ
イスペンサに支承され、基板上を摺擦するガイド
ピンと、該ガイドピンをノズルの周囲を回動させ
る駆動手段と、前記基板上にクリームハンダを塗
布する部分にノズルが位置すると前記デイスペン
サと共にガイドピンを下降させると共に、ガイド
ピンが摺擦する基板の高さに応じてデイスペンサ
を上下させる上下手段とを備え、且つ、前記ノズ
ルより送出されるクリームハンダはノズルが下降
した時に行われるようにしたことを特徴とするハ
ンダ塗布装置。 a dispenser equipped with a nozzle capable of delivering cream solder; a guide pin rotatably supported by the dispenser around the nozzle and sliding on the substrate; and a driving means for rotating the guide pin around the nozzle. When the nozzle is located at a portion where cream solder is to be applied on the substrate, the guide pin is lowered together with the dispenser, and the dispenser is moved up and down according to the height of the substrate that the guide pin rubs. A solder application device characterized in that cream solder is delivered from the nozzle when the nozzle is lowered.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP264589U JPH026166U (en) | 1989-01-17 | 1989-01-17 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP264589U JPH026166U (en) | 1989-01-17 | 1989-01-17 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH026166U true JPH026166U (en) | 1990-01-16 |
Family
ID=31203593
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP264589U Pending JPH026166U (en) | 1989-01-17 | 1989-01-17 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH026166U (en) |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS55118698A (en) * | 1979-03-05 | 1980-09-11 | Matsushita Electric Ind Co Ltd | Device for mounting electronic part |
JPS57190664A (en) * | 1982-03-04 | 1982-11-24 | Matsushita Electric Ind Co Ltd | Apparatus for coating viscous material |
-
1989
- 1989-01-17 JP JP264589U patent/JPH026166U/ja active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS55118698A (en) * | 1979-03-05 | 1980-09-11 | Matsushita Electric Ind Co Ltd | Device for mounting electronic part |
JPS57190664A (en) * | 1982-03-04 | 1982-11-24 | Matsushita Electric Ind Co Ltd | Apparatus for coating viscous material |
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