JPH033739U - - Google Patents
Info
- Publication number
- JPH033739U JPH033739U JP6387489U JP6387489U JPH033739U JP H033739 U JPH033739 U JP H033739U JP 6387489 U JP6387489 U JP 6387489U JP 6387489 U JP6387489 U JP 6387489U JP H033739 U JPH033739 U JP H033739U
- Authority
- JP
- Japan
- Prior art keywords
- bond
- applicator
- smooth
- extension part
- air
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L24/743—Apparatus for manufacturing layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L2224/743—Apparatus for manufacturing layer connectors
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Coating Apparatus (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Die Bonding (AREA)
Description
図は本考案の実施例を示すものであつて、第１
図はボンドの塗布装置の全体斜視図、第２図は底
面図、第３図ａ，ｂ，ｃは作業図、第４図ａ，ｂ
，ｃ及び第５図は従来手段の作業状態の正面図で
ある。
１……塗布具、２……駆動装置、３……送気装
置、４……ケース、６……吐出部、７……延出部
、８……平滑部。
The figure shows an embodiment of the present invention.
The figure is an overall perspective view of the bond applicator, Figure 2 is a bottom view, Figure 3 a, b, and c are working views, and Figure 4 a, b.
, c and FIG. 5 are front views of the conventional means in a working state. DESCRIPTION OF SYMBOLS 1... Applicator, 2... Drive device, 3... Air supply device, 4... Case, 6... Discharge part, 7... Extension part, 8... Smooth part.
Claims (1)
下方向に移動させる駆動装置とを備え、上記塗布
具が、ボンドを貯溜するケースと、このケースの
下部に設けられた横長の吐出部と、この吐出部か
ら前方に延出する延出部と、この延出部の先端部
に垂設されて、基板に吐出されたボンドの上面を
平滑する平滑部とから成り、かつ上記ケースに空
気圧を加える送気装置を設けたことを特徴とする
ボンドの塗布装置。 A bond applicator, a drive device for moving the applicator horizontally and vertically; It consists of an extension part that extends forward from the discharge part, and a smooth part that is vertically installed at the tip of the extension part to smooth the upper surface of the bond discharged onto the substrate, and applies air pressure to the case. A bond application device characterized by being provided with an air supply device for adding air.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6387489U JPH033739U (en) | 1989-05-31 | 1989-05-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6387489U JPH033739U (en) | 1989-05-31 | 1989-05-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH033739U true JPH033739U (en) | 1991-01-16 |
Family
ID=31594312
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6387489U Pending JPH033739U (en) | 1989-05-31 | 1989-05-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH033739U (en) |
-
1989
- 1989-05-31 JP JP6387489U patent/JPH033739U/ja active Pending