JPH021566U - - Google Patents
Info
- Publication number
- JPH021566U JPH021566U JP264489U JP264489U JPH021566U JP H021566 U JPH021566 U JP H021566U JP 264489 U JP264489 U JP 264489U JP 264489 U JP264489 U JP 264489U JP H021566 U JPH021566 U JP H021566U
- Authority
- JP
- Japan
- Prior art keywords
- guide pin
- dispenser
- nozzle
- moved
- solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 5
- 239000006071 cream Substances 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000001179 sorption measurement Methods 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図は本考案の一実施例の正面図、第２図は
吸着チヤツク駆動部を断面で示す側面図、第３図
はデイスペンサユニツトの上下機構の側面図、第
４図は同上の平面図、第５図はノズルとガイドピ
ンの高さ関係を示す正面図、第６図は同上のクリ
ームハンダ塗布時を示す正面図、第７図は同上の
ＩＣセツト時を示す正面図、第８図ａ〜ｅはノズ
ルとガイドピンの軌跡図、第９図はノズルに対す
るガイドピンが取りうる位置を示す説明図である
。
Ａ…基板、１…吸着チヤツク、２…ＩＣ、３…
吸盤、４…軸、５…スリーブ、７…ＤＣサーボモ
ータ、９…ネジ軸、１２…連結ユニツト、１７…
モータ、２０…固定ガイド枠、２５…デイスペン
サユニツト、２６…シリンダ、３１…ノズル、３
５…ガイドピン、３６…回転盤。
Fig. 1 is a front view of an embodiment of the present invention, Fig. 2 is a side view showing a section of the suction chuck drive section, Fig. 3 is a side view of the vertical mechanism of the dispenser unit, and Fig. 4 is a plan view of the same. Figure 5 is a front view showing the height relationship between the nozzle and guide pin, Figure 6 is a front view showing the same as above when applying cream solder, Figure 7 is a front view showing same as above when IC is set, and Figure 8 is a front view showing the same as above when applying the cream solder. Figures a to e are trajectory diagrams of the nozzle and the guide pin, and Figure 9 is an explanatory diagram showing possible positions of the guide pin with respect to the nozzle. A...Substrate, 1...Adsorption chuck, 2...IC, 3...
Suction cup, 4... Shaft, 5... Sleeve, 7... DC servo motor, 9... Screw shaft, 12... Connection unit, 17...
Motor, 20... Fixed guide frame, 25... Dispenser unit, 26... Cylinder, 31... Nozzle, 3
5...Guide pin, 36...Rotary disk.
Claims (1)
イスペンサと、前記ノズルの周囲を回動可能にデ
イスペンサに支承され、基板上を摺擦するガイド
ピンと、該ガイドピンをノズルの周囲を回動させ
る駆動手段と、前記デイスペンサと共にガイドピ
ンを上下に移動させると共に、ガイドピンが摺擦
する基板の高さに応じてデイスペンサを上下させ
る上下手段とを備え、かつ、前記ノズルに対し前
記ガイドピンを初期位置において所定角度をもつ
て移動させると共に１辺のハンダ塗布が終了した
後に、前記ガイドピンを必要に応じて回転させ移
動するようにしたことを特徴とするハンダ塗布装
置。 a dispenser equipped with a nozzle capable of delivering cream solder; a guide pin rotatably supported by the dispenser around the nozzle and sliding on the substrate; and a driving means for rotating the guide pin around the nozzle. The guide pin is moved up and down together with the dispenser, and the dispenser is moved up and down according to the height of the substrate that the guide pin rubs. 1. A solder applicator according to claim 1, wherein said guide pin is rotated and moved as necessary after solder application on one side is completed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP264489U JPH021566U (en) | 1989-01-17 | 1989-01-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP264489U JPH021566U (en) | 1989-01-17 | 1989-01-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH021566U true JPH021566U (en) | 1990-01-08 |
Family
ID=31203591
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP264489U Pending JPH021566U (en) | 1989-01-17 | 1989-01-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH021566U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5030636A (en) * | 1973-07-19 | 1975-03-26 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55118698A (en) * | 1979-03-05 | 1980-09-11 | Matsushita Electric Ind Co Ltd | Device for mounting electronic part |
| JPS57190664A (en) * | 1982-03-04 | 1982-11-24 | Matsushita Electric Ind Co Ltd | Apparatus for coating viscous material |
-
1989
- 1989-01-17 JP JP264489U patent/JPH021566U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55118698A (en) * | 1979-03-05 | 1980-09-11 | Matsushita Electric Ind Co Ltd | Device for mounting electronic part |
| JPS57190664A (en) * | 1982-03-04 | 1982-11-24 | Matsushita Electric Ind Co Ltd | Apparatus for coating viscous material |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5030636A (en) * | 1973-07-19 | 1975-03-26 |
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