JPH0261613A - Producing device for electronic component - Google Patents

Abstract

PURPOSE:To prevent discharging at the time of detaching the electronic component by setting a conductor continuously on the contact surface of a stage so that the confrontation gap between the electronic component and a conveyance path increases gradually and removing the potential of the electronic component by an electrostatic discharger arranged opposite the conveyance path. CONSTITUTION:This device has the stage 12 made of a conductive material for machining the flat plate type electronic component 11 in contact and a taking-out conveyance mechanism 14 for moving the electronic component 11 contacting the stage along the contact surface of the stage 12. Further, the conductor 15 is provided opposite the conveyance path 14a of the conveyance mechanism 14, and this conductor 15 is so set that the surface facing the conveyance path 14a is nearly in level with the contact surface of the stage 12 at the end part on the side of the stage 12 and the gap of confrontation with the conveyance path 14a increases with the distance form the stage 12. Further, the electrostatic discharger 17 for discharging the electronic component 11 passing through the conveyance path 14a electrostatically is provided. Consequently, when the electronic component is take away from the stage, the electronic component is prevented effectively from rising in voltage and being discharged owing to static electricity without decreasing the production efficiency.

Description

DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Industrial Application Field) The present invention relates to an electronic component manufacturing apparatus that takes measures to eliminate static electricity.

(Prior Art) In the manufacturing process of electronic components, the occurrence of defects due to v9tH often becomes a problem. For example, transparent Ti for LCD display
In the vJu board, a plurality of transparent electrodes are formed in a predetermined shape (display shape) on a substrate such as a glass plate, and then the surface thereof is coated with an alignment film. The plurality of transparent electrodes are electrically insulated from each other, each having an individual electrode terminal led out to the edge of the substrate, and when used as a liquid crystal display, electricity for display is transmitted through the electrode terminal. A signal is input.

By the way, an alignment process is performed in the manufacturing process of this transparent electrode substrate. In this alignment process, a transparent electrode substrate on which a transparent electrode and an alignment film are formed as described above is set on a stage, and an O-ra wrapped with cloth is rotated to rub the transparent electrode substrate. 2 rubbing processing is performed.

When the above rubbing process is performed, the transparent electrode substrate will have several thousand to
Tens of thousands of pounds of static electricity are charged. Here, when the plurality of transparent electrodes are charged with static electricity due to a time difference in potential generation or a difference in area, a large potential difference occurs between the transparent electrodes,
Discharge may occur between the transparent electrodes during the rubbing process. When this discharge occurs, the alignment film in the vicinity is destroyed, resulting in partial alignment failure and greatly reducing the quality of the liquid crystal display.

As a countermeasure against this discharge, it is conceivable to make the stage a single conductor. In other words, when a conductive stage is used, the capacitance between the transparent electrode on the transparent electrode substrate and the stage increases, so the rubbing process reduces the static electricity that is the same as when using a dielectric stage. Even if this occurs, the potential difference between each transparent electrode becomes small, making it difficult for discharge to occur during the rubbing process.

However, even if a 1-body stage is used in this way, the capacitance between each transparent electrode decreases during the rubbing process and when the transparent electrode substrate is removed from the stage. The potential difference increases rapidly and a discharge occurs.

To prevent electrical discharge associated with removal from this stage,
It is necessary to neutralize static electricity by blowing ionized air onto the transparent electrode substrate to be removed from the stage. However, performing the removal work while blowing ionized air in this manner significantly reduces work efficiency and reduces productivity.

(Problem to be Solved by the Invention) As described above, even if a conductor is used as a processing stage for electronic parts that are charged with static electricity, when removing the electronic parts from this stage immediately after the predetermined processing, the electronic parts A large potential difference occurs within the component, and this potential difference causes a discharge.

SUMMARY OF THE INVENTION An object of the present invention is to provide an electronic component manufacturing apparatus that can prevent electrical discharge when removing an electronic component from a conductive stage without reducing productivity.

[Structure of the invention]

(Means for Solving the Three Problems) The electronic component manufacturing apparatus according to the present invention includes a stage made of a conductive material for processing flat electronic components in close contact with each other, and an electronic component in close contact with the stage. It has a transport mechanism for taking out parts that moves the parts along the contact surface of the stage. Further, a conductor is provided so as to face the transport path of the transport mechanism. This conductor has a surface level facing the conveyance path that is approximately at the same level as the contact surface of the stage at the end of the stage, and is separated from the stage (2) so that the distance facing the conveyance path is widened. Further, a static eliminator is provided to eliminate static electricity from electronic components passing through the transport path of the transport mechanism.

(For f+) In the present invention, when removing an electronic component from the stage, the electronic component is moved along the close contact surface of the stage, and a conductor is provided continuously on the close contact surface of the stage. This 5! Since the P electric body is set so that the distance between it and the conveyance path of the electronic component gradually increases, a sudden electric potential is not generated in the electronic component when it is removed from the stage. Further, the electric potential of the electronic component tends to gradually increase as it moves along the conveyance path, but it is removed by a static eliminator placed opposite the conveyance path. As a result, the electric potential of the electronic component does not become monotonous, and discharge can be effectively prevented.

(Example) Hereinafter, one embodiment of the present invention will be described with reference to the drawings.

In FIG. 1, reference numeral 11 denotes a transparent electrode substrate for a plate-shaped electronic component, such as a liquid crystal display.As mentioned above, a plurality of transparent electrodes are arranged in a predetermined shape on a substrate made of a glass plate or the like, and the surface thereof is Covered with an alignment film. This transparent electrode substrate 11 is placed on a stage 12 made of a conductive material, and rubbed '3! The surface is rubbed by a roller 13 wrapped with a cleaning cloth or the like to perform a rubbing treatment.

Reference numeral 14 denotes a conveyance mechanism for taking out, which is composed of, for example, a belt conveyor composed of two round belts. This transport mechanism 14 is
The transparent electrode substrate 11 on the stage 12 is moved along the contact surface (upper surface in the figure) of the stage 12, and is transported at a constant speed (for example, 10100 II per second) to the take-out position on the right side in the figure. 15 is a plate-shaped conductor; Conveyance path 1 of the conveyance mechanism 14
It is provided below 4a so as to closely face it. Further, the conductor 15 is arranged so that the level of the surface 15a facing the conveyance path 14a (upper surface in the figure) is approximately the same level as the contact surface of the stage 12 at the end on the stage 12 side (left end in the figure). and is maintained at the same potential as the stage 12. Further, the level of the opposing surface 15a increases as the distance from the stage 12 increases.
The setting is such that there is a large gap between the two. For example, at a position 1m1III away from the stage 12, the transport path 14
10 from a! It is set so that it is m away. Reference numeral 17 denotes static eliminators, and a plurality of them are provided above the transport path 14a so as to face the transparent electrode substrate 11 in four directions.

In the above configuration, the transparent electrode substrate 11 is placed on a stage 12 made of a conductive material, and the O-ra 13 is wrapped with cloth or the like.
The surface is rubbed and rubbed. At this point, the transparent electrode substrate 11 is charged with a considerable amount of static electricity;
Since the stage 12 is made of a conductive material, the potential difference between the transparent electrodes will not increase during the rubbing process and cause discharge, and damage to the alignment layer (n) can be prevented.

When the transparent electrode substrate 11 is to be taken out from the stage 12 after the rubbing process, the transport mechanism 14 is operated to move the transparent electrode substrate 11 along the contact surface of the stage 12.

That is, by the operation of the transport mechanism 14, the transparent electrode substrate 1
1 initially moves on the contact surface of the stage 12, but after coming off the contact surface, it moves on the conveyance path 14a vJ1'.

Here, since the stage 12 is made of a conductive material, the voltage on the transparent electrode substrate 11 does not increase much as described above. Even if the transparent electrode substrate 11 comes off the stage 12, the s electric body 15 is
is provided, and the upper surface of the end on the stage 12 side is set at approximately the same level as the contact surface of the stage 12, so the voltage of the transparent electrode substrate 11 will not increase suddenly.

The surface 15a of the conductor 15 facing the conveyance path 14a is set so that the distance between it and the conveyance path 14a increases as the distance from the stage 12 increases.As the transparent electrode substrate 11 moves to the right in the figure, The voltage of the transparent electrode substrate 11 tends to rise gradually. However, since a static eliminator 17 is provided on the transport path 14a and ionized air is blown against the transparent electrode substrate 11 passing through the transport path 14a to neutralize static electricity, the voltage 1 on the transparent electrode substrate 11 is rarely occurs.

This relationship is not shown in FIG. FIG. 2 shows the relationship between the conveyance distance from the stage 12 and the voltage generated on the transparent electrode substrate 11 as an electronic component during removal (Wi transfer). Curve (broken line) A shows the case where the conductor 15 is not provided. The curve (solid line) B shows the voltage change when the conductor 15 is provided.

As you can see from the diagram, song 1! In the case of JA, there is a sudden voltage increase immediately after the transparent electrode substrate 11 is separated from the stage 12, which causes discharge between the transparent electrodes and destroys the alignment layer.

On the other hand, in the example of curve B, is maintained at a constant value regardless of the conveyance path m. From this, even if the transparent electrode substrate 11 is taken out from the stage 12, the transparent lightning Ifi
A sudden voltage increase does not occur on the substrate 11, and therefore discharge and ripples caused by it can be reliably prevented.

Next, the above operation will be explained with reference to a comparative explanatory diagram of FIG.

Now, an electronic component has a structure having a plurality of conductive parts 20 (A, 8...) on the surface of a dielectric 19 with a dielectric constant ε1 and a thickness dl, and the areas of each are SA, SB... ...
shall be. When processing this electronic component while being grounded by a ground conductor 21 via a dielectric stage 18 with a dielectric constant ε2 and a thickness dl as shown in FIG. If the electric charge is charged, the ground potential EA of Δ is as follows.

Here, as shown in FIG. 3 (2), if the stage 18 itself is a grounded conductor, the above values will be different, and from the difference between equations (1) and (2), △ and B. The ground potential is also lower than when the ASS voltage difference dielectric stage 18 is used.

Therefore, as described above, by using the conductor stage 12 during processing, a plurality of pairs of conductor parts ii!
! Since the potential and the potential difference between these conductor portions are unlikely to increase, it is highly effective in preventing discharge damage during machining. Further, when removing from the stage 12 after processing, the continuous 8I electric body 1 facing the substrate 11 is moved along the conveyance path 14a.
Static electricity is removed while gradually increasing the distance 11d between the two. Since this corresponds to a gradual increase in d2 in equation (1), the ground potentials of A and B as well as the mutual potential difference are gradually increased while being eliminated, making it possible to prevent mTa discharge.

〔Effect of the invention〕

As described above, according to the present invention, when an electronic component is taken out from a stage made of a conductive material, voltage increase in the electronic component due to static electricity and discharge due to the voltage increase can be effectively prevented without reducing production efficiency.

[Brief explanation of the drawing]

FIG. 1 is a side view showing an embodiment of the electronic component manufacturing apparatus according to the present invention, and FIG. 2 shows the relationship between the conveyance distance and the voltage generated in the electronic component when taking out the electronic component from the stage in FIG. A characteristic diagram for explaining by comparison with an example, FIG. 3(2)(c) is a comparative explanatory diagram. DESCRIPTION OF SYMBOLS 11... Electronic component, 12... Stage, 14... Transport mechanism, 14a -- Transport path, 15... IP conductor 15a.
Opposite surface, 17...Static eliminator.

Claims (1)

[Claims] (1) A stage made of a conductive material for processing flat electronic components in close contact with each other, a transport mechanism for taking out the electronic components that are in close contact with the stage and moving them along the contact surface of the stage, and this transport mechanism. It is provided to face the conveyance path of the mechanism, and the level of the surface facing the conveyance path is approximately the same level as the contact surface of the stage at the end on the stage side, and the level of the surface facing the conveyance path is approximately the same level as the contact surface of the stage as it moves away from the stage. An electronic component manufacturing apparatus comprising: a conductor set such that a facing interval is widened; and a static eliminator provided to face an electronic component on a conveyance path of the conveyance mechanism.