JPH0261604A - Structure for fixing rod lens - Google Patents
Structure for fixing rod lensInfo
- Publication number
- JPH0261604A JPH0261604A JP21313388A JP21313388A JPH0261604A JP H0261604 A JPH0261604 A JP H0261604A JP 21313388 A JP21313388 A JP 21313388A JP 21313388 A JP21313388 A JP 21313388A JP H0261604 A JPH0261604 A JP H0261604A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- tin
- rod lens
- gold
- antimony
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims abstract description 49
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 16
- 229910052751 metal Inorganic materials 0.000 claims abstract description 16
- 239000002184 metal Substances 0.000 claims abstract description 16
- 229910052718 tin Inorganic materials 0.000 claims abstract description 15
- 239000000463 material Substances 0.000 claims abstract description 13
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 9
- 239000000956 alloy Substances 0.000 claims abstract description 9
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 claims abstract description 8
- 229910052787 antimony Inorganic materials 0.000 claims abstract description 6
- 239000000919 ceramic Substances 0.000 claims abstract description 4
- 238000007740 vapor deposition Methods 0.000 claims abstract description 3
- 229910001128 Sn alloy Inorganic materials 0.000 claims description 10
- 238000000034 method Methods 0.000 claims description 5
- 229910001020 Au alloy Inorganic materials 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 abstract description 13
- 239000010931 gold Substances 0.000 abstract description 13
- 230000003287 optical effect Effects 0.000 abstract description 12
- 229910052737 gold Inorganic materials 0.000 abstract description 11
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 abstract description 8
- 230000005496 eutectics Effects 0.000 abstract description 6
- 230000008018 melting Effects 0.000 abstract description 6
- 238000002844 melting Methods 0.000 abstract description 6
- 229910052759 nickel Inorganic materials 0.000 abstract description 4
- 239000010935 stainless steel Substances 0.000 abstract description 4
- 229910001220 stainless steel Inorganic materials 0.000 abstract description 4
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 abstract description 2
- 229910052804 chromium Inorganic materials 0.000 abstract description 2
- 239000011651 chromium Substances 0.000 abstract description 2
- 150000002739 metals Chemical class 0.000 abstract description 2
- 239000011135 tin Substances 0.000 abstract 1
- 239000004065 semiconductor Substances 0.000 description 7
- 238000003466 welding Methods 0.000 description 5
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 description 4
- 239000013307 optical fiber Substances 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- GVFOJDIFWSDNOY-UHFFFAOYSA-N antimony tin Chemical compound [Sn].[Sb] GVFOJDIFWSDNOY-UHFFFAOYSA-N 0.000 description 3
- 239000000835 fiber Substances 0.000 description 3
- JVPLOXQKFGYFMN-UHFFFAOYSA-N gold tin Chemical compound [Sn].[Au] JVPLOXQKFGYFMN-UHFFFAOYSA-N 0.000 description 3
- 229910001245 Sb alloy Inorganic materials 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 230000001186 cumulative effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 240000007594 Oryza sativa Species 0.000 description 1
- 235000007164 Oryza sativa Nutrition 0.000 description 1
- 229910000978 Pb alloy Inorganic materials 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000010943 off-gassing Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 235000009566 rice Nutrition 0.000 description 1
- 238000012216 screening Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
Landscapes
- Optical Couplings Of Light Guides (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は光フアイバ通信、光計測機器等に用いる光部品
の製造に関し、特に光学系にロッドレンズを使用する光
部品の構造に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to the manufacture of optical components used in optical fiber communications, optical measuring instruments, etc., and particularly to the structure of optical components that use rod lenses in optical systems.
従来、この稲のロッドレンズの固定には、接着剤や鉛と
錫の合金半田を用いていた。Conventionally, adhesives or lead-tin alloy solder were used to fix rice rod lenses.
しかし、接着剤は湿度に対して弱く、又ガラス転移点温
度が比較的低いためこれを用いた光部品の使用可能環境
温度範囲はかなり制限を受け、又アウトガスの問題もあ
ることから信頼性に欠けるという問題がある。一方、鉛
と錫の合金半田は広く一般に使用されているがクリープ
量が大きい。However, since adhesives are sensitive to humidity and have a relatively low glass transition point, the environmental temperature range in which optical components using them can be used is considerably limited, and there is also the problem of outgassing, which reduces reliability. There is a problem with missing parts. On the other hand, alloy solders of lead and tin are widely used, but have a large amount of creep.
即ち重力等による荷重が半田接合部に常にかかった場合
、半田が時間とともに歪んでいく訳であるが、鉛と錫の
合金半田はこの歪量が大きいためロッドレンズをこの半
田で、固定した場合、ロッドレンズの位置が時間と供に
変化していくことになり光学系の安定性を確保すること
ができないという問題がある。本発明の目的はロッドレ
ンズを安定に固定できる構造を提供することにある。In other words, if a load due to gravity etc. is constantly applied to the solder joint, the solder will become distorted over time, but lead and tin alloy solder has a large amount of distortion, so if the rod lens is fixed with this solder. However, there is a problem in that the position of the rod lens changes over time, making it impossible to ensure the stability of the optical system. An object of the present invention is to provide a structure that can stably fix a rod lens.
本発明のロッドレンズの固定構造は、側面に蒸着等の方
法により金属膜を設けたロッドレンズを、金属或いはセ
ラミックに金属膜を設けた保持部材に半田材を用いて固
定するロッドレンズの固定構造において、前記半田材と
して金と錫の合金半田或いはアンチモンと錫の合金半田
を用いている。The rod lens fixing structure of the present invention is a rod lens fixing structure in which a rod lens having a metal film provided on the side surface by a method such as vapor deposition is fixed to a holding member having a metal or ceramic film provided with a metal film using a solder material. In this case, an alloy solder of gold and tin or an alloy solder of antimony and tin is used as the solder material.
次に、本発明について図面を参照して説明する。 Next, the present invention will be explained with reference to the drawings.
第１図は本発明の実施例の基本構成の縦断面図である。FIG. 1 is a vertical sectional view of the basic configuration of an embodiment of the present invention.
図において、側面に蒸着によりクロム。In the figure, chromium is deposited on the sides.
ニッケル、金の金属膜２を設けたロッドレンズ１は、内
面にニッケル、金の金属膜４を設けたステンレス鋼のパ
イプ状の保持部材５に、融点２８０℃の金と錫の共晶半
田３により固定されている。A rod lens 1 provided with a metal film 2 of nickel and gold has a stainless steel pipe-shaped holding member 5 provided with a metal film 4 of nickel and gold on the inner surface, and a eutectic solder 3 of gold and tin with a melting point of 280°C. Fixed by
ここでは保持部材５としてパイプ状のものを用いたが、
これに限るものではなく、又素材もステンレス鋼を用い
たが他の金属やセラミックであってもかまわない。又ロ
ッドレンズに金属膜を設ける方法も、スパッタ法でもか
まわないし、勿論金属膜の構成も本実施例と異なっても
かまわない。Here, a pipe-shaped member was used as the holding member 5, but
The material is not limited to this, and although stainless steel is used, other metals or ceramics may be used. Also, the method of providing the metal film on the rod lens may be a sputtering method, and of course the structure of the metal film may also be different from this embodiment.
又半田材も金と錫の共晶半田に限るものでなく、配分比
が異なってもかまわないし、アンチモンと錫の合金半田
の場合もある。Furthermore, the solder material is not limited to eutectic solder of gold and tin, but may have a different distribution ratio, or may be an alloy solder of antimony and tin.
次に金と錫の合金半田とアンチモンと錫の合金半田のク
リープ量が鉛と錫の合金半田に比べて小さいことを実証
した結果について述べる。Next, we will discuss the results of demonstrating that the amount of creep of gold-tin alloy solder and antimony-tin alloy solder is smaller than that of lead-tin alloy solder.
本命明の具体的実施例を第２図に示す。本実施例はロッ
ドレンズを２個使用した単一モードファイバ付半導体レ
ーザモジュールである。A concrete example of the present invention is shown in FIG. This embodiment is a semiconductor laser module with a single mode fiber using two rod lenses.
半導体レーザ６とフォトダイオード７を固定したステム
８には、透明窓９を備えた円筒状キャップｌＯが抵抗溶
接により固定され気密容器を形成している。一端が球面
加工され、側面に金属膜を設けた第１のロッドレンズ１
１が保持部材１２に半田固定され、光軸調整後保持部材
１２とキャップ１０をレーザ溶接により一体化固定して
いる。A cylindrical cap lO having a transparent window 9 is fixed to the stem 8 to which the semiconductor laser 6 and photodiode 7 are fixed by resistance welding to form an airtight container. A first rod lens 1 with one end spherically processed and a metal film provided on the side surface
1 is fixed to the holding member 12 by soldering, and after optical axis adjustment, the holding member 12 and the cap 10 are integrally fixed by laser welding.
この後、円筒状保持部材１３がステム８に嵌合されレー
ザ溶接により固定される。側面に金属膜を設けた第２の
ロッドレンズ１５が円筒状保持部材１６に第１のロッド
レンズ１１と同様に半田固定され光フアイバ端末１４に
レーザ溶接により固定される。この第２のロッドレンズ
１５と一体化された光フアイバ端末は光軸調整後部材１
７を介して保持部材１３にレーザ溶接固定される。この
半導体レーザモジュールでは第１のロッドレンズｌｌと
第２のロッドレンズ１５の２ケ所で半田付を行っている
。Thereafter, the cylindrical holding member 13 is fitted onto the stem 8 and fixed by laser welding. A second rod lens 15 having a metal film on its side surface is soldered to the cylindrical holding member 16 in the same manner as the first rod lens 11, and is fixed to the optical fiber terminal 14 by laser welding. The optical fiber terminal integrated with this second rod lens 15 is the member 1 after optical axis adjustment.
It is fixed to the holding member 13 via 7 by laser welding. In this semiconductor laser module, soldering is performed at two locations: the first rod lens ll and the second rod lens 15.
第２図ではこの２ケ所に半田固定部に使用する半田材を
鉛と錫の共晶半田（融点１８３℃）、アンチモンと錫の
半田（融点２４０℃）、金と錫の共晶半田（融点２８０
℃）の３種類を用いている。In Figure 2, the solder materials used for these two solder fixing parts are lead and tin eutectic solder (melting point 183°C), antimony and tin solder (melting point 240°C), and gold and tin eutectic solder (melting point 240°C). 280
℃) are used.
第２図の半導体レーザモジュールを用いて温度サイクル
試験に投入し寿命を比較する実験を行った。An experiment was conducted using the semiconductor laser module shown in FIG. 2 by subjecting it to a temperature cycle test to compare its lifespan.
温度サイクル試験は文献（「半田固定光回路部品のスク
リーニング法に関する一考案」 三富他。The temperature cycle test was carried out in the literature ("A Idea of a Screening Method for Solder-Fixed Optical Circuit Components" by Mitomi et al.).
電子通信学会論文誌’８６／３ Ｖｏｌ、Ｊ６９二Ｃ
隘３．ＰＰ２９７−３０３）に示されている様に半田ク
リープに対する加速試験になるため比較的短時間で比較
することができる。−１０℃〜−６０℃の１サイクル３
時間の温度サイクルを１０００回印加し、その過程での
変化偏向より寿命を推定した。尚結合損失が１ｄＢ劣化
（増加）した点を寿命と仮定した。Journal of the Institute of Electronics and Communication Engineers '86/3 Vol. J692C
3. As shown in PP297-303), this is an accelerated test for solder creep, so it can be compared in a relatively short time. -10℃~-60℃ 1 cycle 3
A time temperature cycle was applied 1000 times, and the life was estimated from the change in deflection during the process. The life span was assumed to be the point at which the coupling loss deteriorated (increased) by 1 dB.
第３図は累積故障率と温度サイクル数の関係を示す。な
お、横、軸と縦軸は対数で表わしている。FIG. 3 shows the relationship between cumulative failure rate and number of temperature cycles. Note that the horizontal axis and vertical axis are expressed in logarithms.
５０％が故障するサイクル数で比較すると、鉛−錫半田
のものが約１７００回であるのに対し、金−錫半田並び
にアンチモン−錫半田では約６８００回と４倍も長寿命
化している。この結果から明らかな様に金−錫半田並び
にアンチモン−錫半田のクリープ量は鉛−錫半田に比べ
て十分小さく、ロッドレンズの固定にこれらの半田を用
いることでロッドレンズを用いた光部品の信頼性を向上
させることが可能となる。Comparing the number of cycles at which 50% of the products fail, lead-tin solder has a lifespan of approximately 1,700 cycles, while gold-tin solder and antimony-tin solder have a lifespan of approximately 6,800 cycles, which is four times longer. As is clear from these results, the amount of creep of gold-tin solder and antimony-tin solder is sufficiently smaller than that of lead-tin solder, and by using these solders to fix rod lenses, it is possible to fix optical components using rod lenses. It becomes possible to improve reliability.
このクリープが小さくなることの原因としては、使用温
度範囲に比べ融点が十分高いこともその一因であるが、
半田材に使われる元素め性質及び元素間の相性の様なも
のが大きな要因となる。One reason for this reduction in creep is that the melting point is sufficiently high compared to the operating temperature range.
The major factors are the properties of the elements used in the solder material and the compatibility between them.
以上説明したように本発明は、ロッドレンズを固定する
時の半田材として金と錫の合金半田、或いはアンチモン
と錫の合金半田を用いることにより、クリープを低減す
ることが可能となり、結果的にロッドレンズを用いた光
部品の信頼性を向上することができる効果がある。As explained above, the present invention makes it possible to reduce creep by using gold and tin alloy solder or antimony and tin alloy solder as the solder material when fixing the rod lens. This has the effect of improving the reliability of optical components using rod lenses.
第１図は本発明の基本構成の縦断面図、第２図は本発明
を適用した単一モードファイバ付半導体レーザモジュー
ルの縦断面図、第３図は第２図の単一モードファイバ付
半導体レーザモジュールの温度サイクル試験における累
積故障率と温度サイクル数の関係図である。
ｌ・・・・・・＋ｊラッドンズ、２・・・・・・金属膜
、３・・・・・・金と錫の合金半田（アンチモンと錫の
合金半田）、４・・・・・・金属膜、５・・・・・・保
持部材、６・・・・・・半導体レーザ、７・・・・・・
フォトダイオード、８・・・・・・ステム、９・・・・
・・透明窓、１０・・・・・・キャップ、１１・・・・
・・ロッドレンズ、１２・・・・・・保持部材、１３・
・・・・・保持部材、１４・・・・・・光フアイバ端末
、１５・・・・・・ロッドレンズ、１６・・・・・・保
持部材、１７・・・・・・部材。
代理人 弁理士 内 原 晋
Ｉ−・・口・・ｌド゛レジ人
２−金濠候
３−一一牟Ｙ多ルの冶金半田
（アンナモンン啓４の合金半田）
４・−一４トノ龜耳夫
５−一一ノ＃づブト（η′１９［
ＡＬ度デイクル４文
〔回〕
茅 ３ 凹FIG. 1 is a vertical cross-sectional view of the basic configuration of the present invention, FIG. 2 is a vertical cross-sectional view of a semiconductor laser module with a single mode fiber to which the present invention is applied, and FIG. 3 is a semiconductor laser module with a single mode fiber of FIG. FIG. 3 is a relationship diagram between the cumulative failure rate and the number of temperature cycles in a temperature cycle test of a laser module. 1...+j Raddons, 2...Metal film, 3...Gold and tin alloy solder (antimony and tin alloy solder), 4...Metal Film, 5... Holding member, 6... Semiconductor laser, 7...
Photodiode, 8... Stem, 9...
...Transparent window, 10...Cap, 11...
...Rod lens, 12...Holding member, 13.
... Holding member, 14 ... Optical fiber terminal, 15 ... Rod lens, 16 ... Holding member, 17 ... Member. Agent Patent Attorney Susumu Uchihara I-...l Registrar 2-Kinhorori 3-Ichimu Ytaru's metallurgical solder (Annamon Kei 4's alloy solder) 4.-14 Tonokaku Mimio 5-11 #zubuto (η'19 [AL degree daykle 4 sentences [times] 茅 3 concave
Claims (1)
を金属或いはセラミックに金属膜を設けた保持部材に半
田材を用いて固定したロッドレンズの固定構造において
、前記半田材が金と錫の合金半田或いはアンチモンと錫
の合金半田であることを特徴とするロッドレンズの固定
構造。In a rod lens fixing structure in which a rod lens having a metal film provided on the side surface by a method such as vapor deposition is fixed to a holding member having a metal film provided on metal or ceramic using a solder material, the solder material is an alloy of gold and tin. A rod lens fixing structure characterized by solder or an alloy solder of antimony and tin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21313388A JPH0261604A (en) | 1988-08-26 | 1988-08-26 | Structure for fixing rod lens |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21313388A JPH0261604A (en) | 1988-08-26 | 1988-08-26 | Structure for fixing rod lens |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0261604A true JPH0261604A (en) | 1990-03-01 |
Family
ID=16634123
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP21313388A Pending JPH0261604A (en) | 1988-08-26 | 1988-08-26 | Structure for fixing rod lens |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0261604A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03112710U (en) * | 1990-03-02 | 1991-11-18 | ||
| US6518518B1 (en) | 1999-01-27 | 2003-02-11 | Ngk Spark Plug Co., Ltd. | Resin substrate |
| JP2007298643A (en) * | 2006-04-28 | 2007-11-15 | Nippon Telegr & Teleph Corp <Ntt> | Optical element module and method for manufacturing the same |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6338907A (en) * | 1986-08-04 | 1988-02-19 | Oki Electric Ind Co Ltd | Optical multiplexing/demultiplexing module |
-
1988
- 1988-08-26 JP JP21313388A patent/JPH0261604A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6338907A (en) * | 1986-08-04 | 1988-02-19 | Oki Electric Ind Co Ltd | Optical multiplexing/demultiplexing module |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03112710U (en) * | 1990-03-02 | 1991-11-18 | ||
| US6518518B1 (en) | 1999-01-27 | 2003-02-11 | Ngk Spark Plug Co., Ltd. | Resin substrate |
| US7291791B2 (en) | 1999-01-27 | 2007-11-06 | Ngk Spark Plug Co., Ltd. | Resin substrate |
| JP2007298643A (en) * | 2006-04-28 | 2007-11-15 | Nippon Telegr & Teleph Corp <Ntt> | Optical element module and method for manufacturing the same |
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