JPH0261554B2 - - Google Patents
Info
- Publication number
- JPH0261554B2 JPH0261554B2 JP15780087A JP15780087A JPH0261554B2 JP H0261554 B2 JPH0261554 B2 JP H0261554B2 JP 15780087 A JP15780087 A JP 15780087A JP 15780087 A JP15780087 A JP 15780087A JP H0261554 B2 JPH0261554 B2 JP H0261554B2
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- etching
- etching solution
- time
- potential difference
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000005530 etching Methods 0.000 claims description 61
- 238000000034 method Methods 0.000 claims description 16
- 229910052751 metal Inorganic materials 0.000 claims description 10
- 239000002184 metal Substances 0.000 claims description 10
- 238000004090 dissolution Methods 0.000 claims 1
- 230000005611 electricity Effects 0.000 claims 1
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 16
- 229910052697 platinum Inorganic materials 0.000 description 8
- 238000005259 measurement Methods 0.000 description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 239000003153 chemical reaction reagent Substances 0.000 description 3
- 229910021645 metal ion Inorganic materials 0.000 description 3
- 239000007788 liquid Substances 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 238000004448 titration Methods 0.000 description 2
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 238000009614 chemical analysis method Methods 0.000 description 1
- 229910001431 copper ion Inorganic materials 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000007726 management method Methods 0.000 description 1
- 238000004886 process control Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- ing And Chemical Polishing (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15780087A JPS644480A (en) | 1987-06-26 | 1987-06-26 | Method for measuring etching rate of liquid etchant |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15780087A JPS644480A (en) | 1987-06-26 | 1987-06-26 | Method for measuring etching rate of liquid etchant |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS644480A JPS644480A (en) | 1989-01-09 |
| JPH0261554B2 true JPH0261554B2 (enrdf_load_stackoverflow) | 1990-12-20 |
Family
ID=15657562
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15780087A Granted JPS644480A (en) | 1987-06-26 | 1987-06-26 | Method for measuring etching rate of liquid etchant |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS644480A (enrdf_load_stackoverflow) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4963781A (en) * | 1987-11-26 | 1990-10-16 | Matsushita Electric Industrial Co., Ltd. | Ultrasonic motor |
| US11015081B2 (en) | 2018-08-22 | 2021-05-25 | Polymer Solutions Group | Fine particle size boric acid/urea dispersion, method of use in engineered wood product manufacture, method of coating wood products and product therefrom |
-
1987
- 1987-06-26 JP JP15780087A patent/JPS644480A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS644480A (en) | 1989-01-09 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2759322B2 (ja) | 無電解めっき浴の制御方法 | |
| EP1203950B1 (en) | Plating bath analysis | |
| US4595462A (en) | Method for determining current efficiency in galvanic baths | |
| JP2008537782A (ja) | めっき浴およびエッチング浴を監視する方法 | |
| JPS6019455B2 (ja) | 有機レベリング剤の有効量を決定する方法 | |
| US4229264A (en) | Method for measuring the relative etching or stripping rate of a solution | |
| EP1471348A1 (en) | Electrochemical method for determining a quantity of an organic component in an electroplating bath | |
| JPH0261554B2 (enrdf_load_stackoverflow) | ||
| US5270659A (en) | Apparatus for measuring deposition speed of electroless plating | |
| JP3795769B2 (ja) | メッキ液の塩素濃度測定方法 | |
| JP2721024B2 (ja) | 金属洗浄液の分析方法及び装置 | |
| JPH1150269A (ja) | 銅又は銅合金の化学的溶解液の有効成分測定装置及び測定方法 | |
| US6899805B2 (en) | Automated chemical management system executing improved electrolyte analysis method | |
| CA2004607C (en) | Monitoring of pyrometallurgical processes | |
| JPH0343249Y2 (enrdf_load_stackoverflow) | ||
| EP0386679B1 (en) | Method of analyzing washings for metal and apparatus | |
| JPS6379053A (ja) | 金属材料の腐食試験方法 | |
| JPS6239086Y2 (enrdf_load_stackoverflow) | ||
| JP3069146B2 (ja) | 化学研磨液の研磨能力測定方法および装置、化学研磨液の管理方法および装置 | |
| JPS5938390A (ja) | 酸洗液の管理方法 | |
| OSTERYOUNG | Pulse Voltammetric Characterization of Biocorrosion Processes(Final Report, 1 Feb. 1993- 31 Jul. 1996) | |
| JPH04124280A (ja) | 無電解めっき析出速度測定装置 | |
| JPH04136189A (ja) | 金属エッチング方法 | |
| JPH0886826A (ja) | プリント配線板の故障時間推定方法及び推定装置 | |
| JPH0211786A (ja) | 酸の銅浴からの直流的銅析出の監視、制御方法及び装置 |