JPH0261092A - Peeling apparatus for plating equipment - Google Patents

Abstract

PURPOSE:To quickly peel metallic deposit stuck on an endless wire for a cathode by constituting the title peeling apparatus freely ascendingly and descendingly so that one part of a wheel group hanging and turning the above-mentioned wire is exposed to the outside together with a peeling tank. CONSTITUTION:An endless wire 17 is brought into contact with an object 4 while it is moved in a plating tank and cathodic current is caused to flow to the object 4 and plating treatment is performed. The wire 17 drawn from the plating tank is sent into the each independent tank of a peeling tank 30 from the inlet side via a wheel group 35 and furthermore supplied to the independent tank of the ensuing stage from the outlet side. It is repeated that the wire is passed through the inside and sent from the outlet side. In the meantime, deposit on the wire is peeled and the wire 17 is reguided into the plating tank. When repair for maintenance control of the wire 17 is necessitated, the tank 30 whole body is lowered via an ascending and descending mechanism. While the wheel group 35 in the tank 30 is allowed to remain in the position thereof, only the tank 30 is lowered. Then both the wheel group 35 and the wire 17 are partically exposed thoroughly to the outside and repair of the wire 17 is performed and thereafter the tank 30 whole body is returned and raised to return to the original state.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a stripping device used in combination with a plating device, and is suitable as a solder stripping device used in a solder plating device.

[Prior Art] In an electroplating apparatus, a cathode current must be passed through the object to be plated, and a wire is used as a means for this purpose to form an endless path for the cathode wire to move horizontally in the plating tank. The applicant has previously proposed a technique in which the object is moved in a plating tank in a vertical state while being brought into contact with the endless wire, and the plating process is performed during that time. (
(See Japanese Patent Application Laid-open No. 63-33599).

[Problem to be solved by the invention] In the above-mentioned conventional technology, since plating inevitably adheres to the endless wire for the cathode, if the deposits (metal) on the endless wire are not peeled off from the endless wire, the cathode current cannot be affected. It becomes difficult to flush things. Therefore, it is conceivable to combine a peeling device with a plating device and peel off the deposits while passing an endless wire through the plating device. However, the stripping device must be provided with a plurality of processing tanks that correspond to the stripping process independently, and even if the endless wire were to be passed through each independent tank, it would be impossible to simply pass the endless wire through the individual tanks. Furthermore, since the wire is used as an "endless wire",
In order to maintain and manage the endless wire, it is necessary to remove the endless wire from the stripping device when necessary.

[Means to solve the problem]

Therefore, in this invention, a stripping tank is used to remove the deposits from the endless wire, but a part of the wheel group around which the endless wire is suspended is made independent of the stripping tank and faces into the stripping tank. When necessary for maintenance and management of the endless wire, a part of the wheel group is lowered as a whole and a part of the endless wire suspended there is removed. part can be exposed to the outside.

In a stripping tank where multiple independent tanks are arranged in series, wheels are installed at the inlet and outlet sides and inside of each independent tank, allowing the endless wire to move in and out of each independent tank. We decided to make it compatible with the peeling process.

[For production]

The endless wire moves through the plating tank and applies cathode current to the objects it comes in contact with, plating the objects, and then the part of the endless wire that comes out of the plating tank is suspended around a group of wheels. It is guided into each independent tank of the stripping tank from the inlet side, enters the inside, then comes out from the outlet side, enters the independent tank of the next process, passes through the inside, and exits from the outlet side. During this process, endless wire deposits are removed. The (metal) is peeled off, and the peeled portion is guided into the plating tank again, and this process is performed sequentially and continuously in accordance with the hanging and movement of the endless wire.

If you wish to perform maintenance on the endless wire, you can lower the entire stripping tank using the up-and-down mechanism, and only the stripping tank will be lowered, leaving the wheels facing the stripping tank in the same position. As a result, the wheel group and the portion of the endless wire suspended therein are completely exposed to the outside. Therefore, after taking appropriate care of the endless wire, the entire stripping tank was returned to its original state using the vertical mechanism, and the endless wire was moved to the stripping tank following the plating tank, so that the deposits were always peeled off. The new endless wire is used to plate the objects in the plating bath.

〔Example〕

Next, embodiments will be described with reference to the drawings. Figure 1 shows a solder plating device 1 as r plating device J and a plating tank
A solder plating tank 2 is shown. If we describe the entire solder plating equipment 1 in order of process, 3 is the load section.
An IC lead frame (hereinafter referred to as a frame) 4 after resin molding as a target object j is sequentially supplied to a pretreatment process section 5.

The pretreatment process section 5 includes an electrolytic degreasing section 6, a water washing section 7, an oxide film removal section 8, a water washing section 9, a chemical polishing section 10, a water washing section 11, an activation section 12, a water washing section 13, and a pickling section 14. Processing tanks are arranged in series in the order of the steps, and the frame 4 is moved horizontally in the processing tanks of each of these steps. The frame 4 is arranged to move vertically in the solder plating tank 2, and comes into contact with the endless wire 17 in such a way as to ride on the endless wire 17 forming a horizontal movement path 16. That's what I do. Next to the solder plating tank 15, there is a recovery section 19 as a post-processing section 18,
Processing tanks are successively arranged in the order of each process: a water washing section 20, a neutralization section 21, a water washing section 22, a water washing section 23, a warm pure water washing section 24, 25, a dehydration section 26, an air blow section 27, and a drying section 28.
Finally, there is an unloading section 29 that takes out the processed frames 4 from the line.

A stripping tank 30 is attached to such a solder plating apparatus 1 (in contrast to the solder coating tank 2 directly). The stripping tank 30 is connected with independent tanks 31, 32, 33, and 34 for carrying out processing in the order of water washing, stripping, water washing, and pickling.

The wheel group 35 that suspends the endless wire 17 consists of a pair of first wheels 36 for forming an "outward path" in the soldering bath 15, and a pair of second wheels 37 for forming the "return path". Next, intermediate wheels 38.3 are placed at three locations between the solder plating tank 15 and the stripping tank 30.
9.40. Inside of the ff1l separation tank 30, that is, the independent tank 3 for water washing
1 inner wheel 41, upper wheel 4 on the partition wall 42
3. A pair of inner wheels 44 of the independent peeling tank 32, an upper wheel 46 on the partition wall 45, an inner wheel 47 of the independent water washing tank 33, an upper wheel 49 on the partition wall 48, and It consists of an internal wheel 50. Each of these wheels constituting the wheel group 35 is provided with various functions. That is, the pair of first boilers 36 are used as electrode wheels for the cathode, and the middle wheel 3 is used as a drive wheel and is connected to one of the second wheels 37 and the upper wheel 43 via a chain 51. The other intermediate wheels 39 and 40 are used as tensioning wheels, and are designed to change their position significantly when the endless wire 17 is removed from or hung from the wheel group 35. Furthermore, the inner wheels 41, 47 serve as electrode wheels for the stripping process.

The upper wheels 43.46.49 placed at the entrance and exit positions of each independent tank 31.32.33.34 and the internal wheels 41.44.47.50 placed at the inside positions are as follows:
It is provided separately and independently from the peeling tank 30.

Next, the vertical mechanism 52 combined with the peeling tank 30 will be described.A screw hole 54 is provided in the edge 53 of the peeling tank 30, and a ball screw 55 is inserted into the screw hole 54. Both upper and lower ends of the ball screw 55 are supported by bearings 56, and a chain 58 is suspended from a chain wheel 57 provided below.
A rotation drive system 61 is formed by a drive wheel 59, a motor 60 connected to the drive wheel 59, and the like. A pair of guide bars 62 engage with the guide 63 of the peeling tank 30 to guide its "downward" and "return-up".

A ball screw 55 and a guide bar 62 are provided as a pair on both sides of the peeling tank 30, and when the motor 60 is operated, the ball screws 55 on both sides are simultaneously rotated through a drive wheel 59, a chain 58, and a chain wheel 57.
0 is rotated by the ball screw 55 through the screw hole 54 and then lowered or returned to the upper position. When the peeling tank 30 reaches the lowest position, the upper wheel 4 remains in its original position.
3.46.49, internal wheel 41.44.47.50
The entire portion of the endless wire 17 suspended therein is exposed to the outside. Therefore, the intermediate wheel 39.
By changing the position of 40, the endless wire 17 can be easily removed and hung from the wheel group 35.

〔effect〕

Since the stripping device for plating equipment according to the present invention has the content as described above, even if there is deposits (metal) on the endless wire used as a cathode in the plating tank, it can always be quickly removed in the stripping tank. Of course, since it peels off from the endless wire, cathode current can always be efficiently passed through the target object! When passing the endless wire through the separation tank, a group of wheels are placed on the inlet and outlet sides and inside of each independent tank so that it can be introduced into and taken out from each independent tank without any trouble in accordance with the removal process. Moreover, among the wheel group that suspends the endless wire, the wheel that is combined with the stripping device is installed separately from the stripping tank, so the wheel becomes an obstacle when lowering and returning to raising the stripping tank via the vertical mechanism. Moreover, when the peeling tank is lowered, the endless wire suspended therewith together with the wheel can be exposed to the outside, which has many advantages such as making repair, replacement, and other maintenance of the endless wire easier.

[Brief explanation of the drawing]

FIG. 1 is a schematic side view showing the entire solder plating apparatus as a plating apparatus, and FIG. 2 is a schematic side view showing a state in which endless wires are suspended around a wheel group and a stripping tank. FIG. 3 is a schematic perspective view of the endless wire and peeling tank shown in FIG. 2, and FIG. 4 is a partially enlarged perspective view showing the combination of the vertical mechanism with respect to the peeling tank. l... Plating equipment (solder plating equipment) 2... Solder coating tank (solder coating tank) 4... Target object (frame) 17... Endless wire 30... Peeling tank 35... Wheel group 52 ... Vertical mechanism 61 ... Rotation drive system

Claims (5)

[Claims] (1) A stripping device for a plating machine that forms a moving path for an endless cathode wire in the plating tank in the horizontal direction, and applies plating to an object that moves within the plating tank while contacting the endless wire. The peeling tank has a plurality of independent tanks arranged in series according to the peeling process, and a part of the wheel group around which the endless wire is suspended is connected to the inlet and outlet sides and the inside of each independent tank. A vertical mechanism is installed in the peeling tank, which is placed separately from the peeling tank, and allows the entire peeling tank to be lowered and raised to expose a part of the wheel group facing the inside of each independent tank to the outside. Peeling device for plating equipment that is installed. (2) The peeling device for a plating device according to claim 1, wherein the plating tank is a solder plating tank, the plating device is a solder plating device, and the object is an IC lead frame after resin molding. (3) The stripping tank for a plating apparatus according to claim 1 or 2, wherein the stripping tank is a plurality of independent tanks for washing, stripping, washing, pickling, etc., arranged in series from the input side to the output side of the endless wire. Device. (4) The stripping device for a plating apparatus according to claim 3, wherein the plurality of wheels arranged inside each independent tank and above the partition wall between each independent tank constitute a part of a wheel group. Device. (5) The vertical mechanism includes a plurality of ball screws inserted into screw holes provided at the edge of the peeling tank, a rotation drive system that rotates these ball screws, and a plurality of guides that guide the descent and return rise of the peeling tank. A stripping device for a plating device according to any one of claims 1 to 4, comprising a bar.