JPH07122159B2 - Stripping device for plating equipment - Google Patents

Description

The present invention relates to a stripping apparatus used in combination with a plating apparatus, and is suitable as a solder stripping apparatus used in a solder plating apparatus.

[Conventional technology]

In an electroplating device, a cathode current must be applied to an object to be plated, and a wire is adopted as one means for this to form a movement path of the endless wire for the cathode in the horizontal direction in the plating tank and to make the object vertical. The present applicant has previously proposed a technique in which the endless wire is brought into contact with the endless wire, and the endless wire is moved in a plating tank to perform a plating treatment therebetween.
(See JP-A-63-33599).

[Problems to be Solved by the Invention]

In the conventional technique as described above, the endless wire for the cathode is inevitably plated, so that it is difficult to cause the cathode current to flow to the target object unless the deposit (metal) of the endless wire is separated from the endless wire. Therefore, it is conceivable to combine the peeling device with the plating device and peel off the deposit while passing the endless wire. However, the stripping apparatus must be provided with a plurality of processing tanks corresponding to the stripping process independently, and even if an endless wire is passed through each of the independent tanks, it is impossible to simply pass the endless wires. Furthermore, since the wire is used as an "endless wire", in order to maintain and manage the endless wire, the endless wire must be removed from the stripping device when necessary.

[Means for Solving the Problems]

Therefore, in the present invention, the peeling tank is used to remove the deposits on the endless wire. However, a part of the wheel group that suspends the endless wire is, so to speak, independent of the peeling tank and faces the peeling tank. When it is necessary to maintain and manage the endless wire by combining the upper and lower mechanisms, the entire stripping tank is lowered while part of the wheel group is left as it is, and part of the wheel group is suspended to the endless wire. The part can be exposed to the outside.

Then, in a peeling tank in which a plurality of independent tanks are connected in series, the endless wire is moved in and out of each independent tank by making the wheels face the entrance / exit side and the inside of each independent tank. I decided to support the peeling process.

[Action]

As the endless wire moves in the plating tank, a cathode current is applied to the contacting object to plate the object, and the part of the endless wire that comes out of the plating tank is suspended by the wheel group. In the stripping tank, each independent tank is guided from the entrance side to enter the inside, then exits from the exit side, enters the independent tank of the next process, passes through the inside, and exits from the exit side. ) Is peeled off and the peeled part is guided again into the plating tank, and such treatment is sequentially and continuously performed in accordance with the suspension and movement of the endless wire.

If you want to care for the endless wire for maintenance, lower the entire stripping tank through the vertical mechanism and only the stripping tank descends while the wheels facing the stripping tank remain in that position. Therefore, the wheel group and the portion of the endless wire suspended around the wheel group are completely exposed to the outside. Therefore, the endless wire was properly cared for, and the whole peeling tank was returned to the original state by raising and lowering it again with the vertical mechanism, and the endless wire was moved to the peeling tank after the plating tank to always remove the deposits. So to speak, the new endless wire is used to plate the object in the plating tank.

〔Example〕

Next, embodiments will be described with reference to the drawings. Figure 1 shows a solder plating device 1 as a "plating device" and a "plating tank".
And the solder plating bath 2 is shown. If the whole of the solder plating apparatus 1 is described in the order of steps, 3 is a load section, and the IC lead frame (hereinafter, referred to as a frame) 4 after resin molding as an "object" is sequentially supplied to the pretreatment step section 5.
The pretreatment process unit 5 includes an electrolytic degreasing unit 6, a water washing unit 7, an oxide film removing unit 8, a water washing unit 9, a chemical polishing unit 10, a water washing unit 11, and an activation unit.
The treatment tanks 12, 12, and the pickling portion 13 are sequentially arranged in this order, and the frame 4 is moved horizontally in the treatment tanks of these steps. The frame 4 moves vertically in the solder plating tank 2,
Further, the endless wire 17 is formed so as to be placed on the endless wire 17 forming the moving path 16 in the horizontal direction and is in contact with the endless wire. Next to the solder plating tank 15,
As the post-treatment process unit 18, a recovery unit 19, a water washing unit 20, a neutralization unit 21,
The treatment tanks are successively arranged in the order of each process of the water washing section 22, the water washing section 23, the warm pure water washing sections 24 and 25, the dehydration section 26, the air blow section 27, and the drying section 28. Finally, the treated frame 4 is connected from the line. There is an unloading section 29 to take out.

A peeling tank 30 [directly to the solder plating tank 2] is attached to such a solder plating apparatus 1. In the stripping tank 30, independent baths 31, 32, 33, 34 for performing treatments in the order of washing with water, stripping, washing with water and pickling are connected in series.

The wheel group 35 around which the endless wire 17 is suspended includes a pair of first wheels 36 for forming a “forward path” in the solder plating tank 15, a pair of second wheels 37 for forming a “return path”, and then a second wheel 37. 3 between solder plating tank 15 and peeling tank 30
Intermediate wheels 38, 39, 40 arranged at various locations, inside wheel of peeling tank 30, that is, inner wheel 41 of independent tank for washing 31, upper wheel 43 on partition wall 42, pair of inner wheels of independent tank for peeling 32
44, an upper wheel 46 on the partition wall 45, an internal wheel 47 of the independent washing tank 33, an upper wheel 49 on the partition wall 48, and an internal wheel 50 of the independent pickling tank 34.
Various functions are added to each of the wheels forming the wheel group 35. That is, the pair of first wheels 36 is an electrode wheel for the cathode, and the intermediate wheel 38 is a drive wheel and is connected to one of the second wheels 37 and the upper wheel 43 via a chain 51. The other intermediate wheels 39, 40 are tension applying wheels, and their positions are largely changed when the endless wire 17 is detached or hung from the wheel group 35. Further, the inner wheels 41 and 47 are electrode wheels for peeling processing.

And the upper wheels 43, 46, 49 arranged at the inlet / outlet positions of the independent tanks 31, 32, 33, 34 and the inner wheels 41, 44, 47, 50 arranged at the internal positions are the peeling tanks. Separately provided for 30.

Next, a description will be given of the vertical mechanism 52 to be combined with the peeling tank 30. A threaded hole 54 is provided in the edge portion 53 of the peeling tank 30.
Ball screw 55 is inserted in. The upper and lower ends of the ball screw 55 are supported by bearings 56, and the chain wheel is provided below.
57 A rotary drive system 61 is formed by a chain 58 suspended there, a drive wheel 59, a motor 60 connected to the drive wheel 59, and the like. Reference numeral 62 denotes a pair of guide bars, which engage with the guides 63 of the peeling tank 30 to guide the "falling" and the "returning rising".

The ball screw 55 and the guide bar 62 are provided as a pair on both sides of the peeling tank 30, and the ball screw 55 on both sides is simultaneously rotated by the operation of the motor 60 via the drive wheel 59, the chain 58 and the chain wheel 57. When the ball screw 55 is rotated through the screw hole 54, the ball screw 55 descends or returns and rises.
Then, when the peeling tank 30 reaches the lowest position, the upper wheels 43, 46, 49 and the inner wheels 4 which are left in the original positions are retained.
1, 44, 47 and 50 are exposed to the outside together with the part of the endless wire 17 suspended there. Therefore, if the positions of the intermediate wheels 39 and 40 are changed, the endless wire 17 can be easily detached and suspended from the wheel group 35.

〔effect〕

Since the stripping apparatus for the plating apparatus according to the present invention has the contents as described above, even if the adhered substance (metal) is attached to the endless wire used as the cathode in the plating tank, the stripping tank can always be quickly operated. Since it peels off from the endless wire, not only can the cathode current be made to flow through the object efficiently at all times, but the endless wire is placed inside the peeling tank at the inlet / outlet side and inside of each independent tank. Depending on the wheel group, it can be introduced into each independent tank without hindrance according to the peeling process and can be derived from it, and of the wheel group that suspends the endless wire, the wheel to be combined with the peeling device is independent of the peeling tank. Since it is provided, the wheels do not hinder the lowering and returning of the peeling tank via the vertical mechanism, and when the peeling tank descends, the wheels are suspended there. There are a number of effects that it is easy to do is exchange other maintenance management of the endless wire repair because it exposed the endless wire to the outside.

[Brief description of drawings]

FIG. 1 is a schematic side view showing the whole of a solder plating apparatus as a plating apparatus, and FIG. 2 is a schematic side view showing a suspension state of an endless wire with respect to a wheel group and a peeling tank. FIG. 3 is a schematic perspective view of the endless wire and the stripping tank shown in FIG. 2, and FIG. 4 is a partially enlarged perspective view showing a combination state of the vertical mechanism with the stripping tank. 1 …… plating device (solder plating device) 2 …… plating tank (solder plating tank) 4 …… object (frame) 17 …… endless wire 30 …… peeling tank 35 …… wheel group 52 …… upper and lower mechanism 61… … Rotation drive system

Claims (5)

[Claims] Claim: What is claimed is: 1. A plating apparatus for a plating apparatus, wherein a moving path of a cathode endless wire is formed in a horizontal direction in a plating tank, and an object moving in the plating tank is plated while being in contact with the endless wire. A peeling device, which has a peeling tank in which a plurality of independent tanks are arranged in series according to the peeling process, and a part of the wheel group on which the above endless wire is suspended is used as an inlet / outlet side of each independent tank. Separately separates the vertical tank that separates the peeling tank from the inside and separates the entire peeling tank so as to expose a part of the wheel group facing the inside of each independent tank to the outside. A stripping device for plating equipment that is installed in a bath. 2. The plating bath is a solder plating bath, the plating device is a solder plating device, and the object is a resin-molded product.
The peeling device for a plating device according to claim 1, which is an IC lead frame. 3. The plating apparatus according to claim 1 or 2, wherein the stripping tank is a series of a plurality of independent baths for washing, stripping, washing with water, pickling, etc. from the entry side to the exit side of the endless wire. Peeling device. 4. The plating apparatus according to claim 3, wherein a plurality of wheels arranged inside each of the independent tanks and above the partition wall between the independent tanks constitute a part of a wheel group. Peeling device. 5. An up-and-down mechanism, a plurality of ball screws inserted into screw holes provided at the edge of the stripping tank, a rotary drive system for rotating these ball screws, and a plurality of guides for lowering and returning of the stripping tank. The stripping device for a plating apparatus according to any one of claims 1 to 4, further comprising: