JP2000034596A - Plating treatment device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a pusher type plating treatment device which enables the shortening of the assembly and installation period and the lowering of the height of the entire device. SOLUTION: A pre-treatment means 11 and a post-treatment means 19 are of a spray system and are provided with plating liq. transiently filling means 71, 72, with which a plating liq. in plating means 13, 14 is transiently filled between the pre-treatment means 11 and the plating means 13 and between the post-treatment means 19 and the plating means 14. The plating liq. transiently filling means 71, 72 are provided with a tank 83, which is disposed on a moving locus of an object to be plated, an opening and closing means 78, 79, which are arranged between the tank 83 and the plating means 13, 14 and between the tank 83 and the pre-treatment means 11 or the post-treatment means 19 and a liq. discharging means, which discharges the plating liq. in the tank 83.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a plating apparatus, and more particularly to a plating apparatus, in which an object to be plated is horizontally moved along a plurality of linearly arranged electrodes by pressing the object with a pusher. The present invention relates to a pusher type plating apparatus for performing a plating process.

[0002]

2. Description of the Related Art Plating apparatuses include a carrier type and a pusher type. The carrier type plating apparatus carries out plating by transporting an object to be plated by a carrier and sequentially immersing the object in a plating solution in a plurality of plating tanks.

[0003] This carrier type plating apparatus is
The plating thickness can be adjusted by changing the time for immersing the object to be plated in the plating solution, and the plating thickness can be made relatively thick, so that it is suitable for decorative plating and corrosion-resistant plating.

On the other hand, a pusher type plating apparatus arranges a plurality of electrodes in a U-shape in a plating layer,
A plating process is performed by pressing an object to be plated with a pusher and horizontally moving the object along an electrode. This pusher type plating apparatus is suitable for precision plating of a printed circuit board or the like, because it can perform plating on a large number of objects to be plated under the same conditions.

[0005]

However, in a conventional pusher type plating apparatus, the pre-processing apparatus and the post-processing apparatus are still of a carrier type,
Here, since elevator equipment is required to raise and lower the substrate, the height of the equipment is increased, and the configuration of the elevator equipment is complicated. Was.

SUMMARY OF THE INVENTION An object of the present invention is to solve such problems, and to provide a pusher-type plating apparatus capable of reducing the height of the apparatus and shortening the assembly and installation work period. To provide.

[0007]

The present invention is a plating apparatus, and is configured as follows to solve the above-mentioned technical problem. That is, the plating apparatus of the present invention comprises: a plating means for performing plating on the object to be plated by horizontally moving the object to be plated along electrodes linearly arranged in a plating tank; and plating the object to be plated. Pre-processing means arranged before the plating means for performing pre-processing, post-processing means arranged after the plating means for performing post-plating processing on the object to be plated, and In a plating apparatus including a pre-processing unit, a pusher unit that horizontally moves through the plating unit and the post-processing unit, the pre-processing unit and the post-processing unit are spray types, and the pre-processing unit and the plating unit A plating solution temporary filling means for temporarily filling a plating solution in the plating means, and between the post-processing means and the plating means, During the filling means,
A tank disposed on a movement locus of the object to be plated, an opening / closing unit disposed between the tank and the plating unit, and between the tank and the pre-processing unit or the post-processing unit, and the tank And a drainage means for discharging the plating solution therein.

In this plating apparatus, the opening / closing means on both sides of the plating liquid temporary filling means are appropriately opened and closed, and the draining means is used to empty the plating liquid temporary filling means or to fill the plating liquid. can do.

When the plating solution temporary filling means is empty, the object to be plated in the pretreatment means is horizontally moved by the pusher means and sent into the plating solution temporary filling means. After the plating solution is filled in the plating means, the object to be plated can be moved horizontally by the pusher means and sent into the plating means.

Similarly, on the post-processing means side, the object to be plated is horizontally moved without leaking the plating solution in the plating means, and the plating means, the plating solution temporary filling means,
They can be sent in the order of post-processing means.

[0011]

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view of a plating apparatus according to the present invention.

FIG. 1 is a plan view of a pusher type plating apparatus 1 according to the present invention. This plating apparatus 1
The pretreatment means 11 performs a pre-plating process on the plating object 2 (FIG. 6), and the plating solution 42 in the plating means 13 and 14 with the pretreatment completed plating object 2 temporarily stopped.
Plating solution temporary filling means 71, 7 for temporarily filling (FIG. 5)
2, a plating tank 12 in which a predetermined amount of a plating solution 42 such as copper sulfate is stored, and a first plating means 13 and a second plating means 14 which are parallel to each other and perform plating on the workpiece 2. ing.

Further, the plating apparatus 1 can move the pretreatment means 11, the plating solution temporary filling means 71, the first plating means 13 or the second plating means 14 while holding the object 2 to be plated. A plurality of holding means 15, a first pusher means 16 and a second pusher means 17 for pressing these holding means 15 and moving them by a predetermined distance, and a holding means 15 discharged from the first plating means 13 2 is provided with a transfer means 18 for transferring to the plating means 14 and a post-processing means 19 for performing post-plating processing on the workpiece 2.

The pretreatment means 11 has a plurality of treatment tanks 73 arranged in series. Partition walls 74 in these processing tanks 73
Is provided with a notch 75 for allowing the plated object 2 to pass horizontally, as shown in FIG. This notch 75
Are also provided on both side walls of the pretreatment means 11. In each of the processing tanks 73, a plurality of spray pipes 76 are arranged in parallel at appropriate intervals, and the object to be plated 2 is degreased, washed with hot water, washed with water, by the processing liquid 76a ejected from the spray pipes 76. Pre-plating treatment such as acid activity (only some are shown) is performed.

The pretreatment means 11 and the first plating means 1
3, a plating solution temporary filling means 71 is interposed as shown in FIG. 3, and a first opening / closing door 78 is provided between the plating solution temporary filling means 71 and the first plating means 13. ing. The first opening / closing door 78 is automatically opened and closed at a predetermined timing by an automatic opening / closing means 80 provided at one end thereof, and a locking means 81 provided at the other end thereof.
Locked by. Note that the reference numeral 82 in the drawing is a packing.

Plating solution temporary filling means 71 and pretreatment means 1
A second opening / closing door 79 having a configuration similar to that of the above-described first opening / closing door 78 is provided between the first and second doors. Further, the plating solution temporary filling means 7 between the second plating means 14 and the post-processing means 19.
The first opening / closing door 78 and the second opening / closing door 79 are also provided on both sides of the second door 2.

As shown in FIG. 4, the plating solution temporary filling means 71 has a tank 83 having an open upper surface, and a storage tank 85 is provided below the tank 83. A drain valve 87 as a drainage unit is provided on a low wall 86 of the plating solution temporary filling unit 71, and a suction port of a pump 99 is connected to the storage tank 85. The discharge port of the pump 99 is connected to the upper side of the plating solution temporary filling means 71. The plating tank 12 of the first plating means 13 is connected to the suction pipe 100 of the pump 99.

As shown in FIG. 4, a suction port of a pump 101 is connected to the bottom side of each processing tank 73 of the above-mentioned preprocessing means 11, and a discharge port of this pump 101 is connected to a spray pipe in each processing tank 73. 76 is connected to the upper side.

Post-processing means 19 and post-processing means 19
Plating solution temporary filling means 7 between the first plating means 14 and the second plating means 14
Reference numeral 2 has substantially the same configuration as the above-described pretreatment unit 11 and plating solution temporary filling unit 71, and a detailed description thereof will be omitted.
In the post-processing means 19, post-plating processes such as water washing, rust prevention, water washing, and hot water washing (only some are shown) are performed on the plating target 2 after the plating process.

Next, the first plating means 13 and the second plating means 13 shown in FIG.
The plating means 14 will be described. First plating means 13
And the second plating means 14 have substantially the same configuration. Here, the first plating means 13 will be described. The first plating means 13 includes a first plating means 13 linearly arranged in the plating tank 12.
The plating process is performed by horizontally moving the plating object 2 along the positive electrode 20.

That is, the first plating means 13 includes a plurality of first positive electrodes 20 arranged in two rows in a straight line, and a position above the plating tank 12 at a position between the two rows of first positive electrodes 20. The guide rail-shaped long first placed on the near side of the paper)
And a negative electrode 21. The first negative electrode 21 extends beyond the plating solution temporary filling means 71 and the pretreatment means 11. The first positive electrode 20 can be configured by inserting a plurality of copper balls into a rectangular tube formed of, for example, a titanium plate having many holes.

The interval between the two rows of the first positive electrodes 20 is set according to the thickness of the plating applied to the workpiece 2 and can be arbitrarily adjusted. Also, the first negative electrode 2
Numeral 1 is a long flat plate formed in a guide rail shape as shown in FIG. The first cathode 21 is provided with the holding means 1.
5 is slidably locked.

The holding means 15 includes a frame 25 and the frame 2
5 is provided with a power supply connection part 26 provided on the upper side and a locking part 27 provided on the upper side of the power supply connection part 26.
As shown in FIG. 6, the frame portion 25 includes vertical frames 30, 30 on both sides formed of, for example, stainless steel channels, and a long main bar 31 formed of a highly conductive plate material such as copper.
And a long horizontal frame 32 formed of a plate material having high insulating properties are formed in a quadrilateral having an appropriate size.

The vertical frames 30, 30 are coated with, for example, a resin. The power supply connection portion 26 includes a power supply bar 33 formed of a highly conductive plate material such as copper, and a copper power supply plate 34 fixed to the upper side of the power supply bar 33. The lower end of the power supply bar 33 is fixed to the main bar 31 of the frame 25.

The locking portion 27 includes top bars 35, 35 made of a highly conductive plate material such as copper,
For example, stainless steel guides 36, 36 provided on the outer side surfaces of both ends of the top bar 35, and, for example, a stainless steel claw receiving part 3 fixed to both center side surfaces of the top bars 35, 35
7 and 37 and a pressing portion 38 made of, for example, copper and fixed between the claw receiving portions 37 and 37 on both sides. The top bars 35 are fixed to both sides of the power supply bar 33 of the power supply connection portion 26 as shown in FIG. The lower side of the guide 36 protrudes from the lower end surface of the top bar 35.

The holding means 15 is provided with a plurality of locking portions 40 at appropriate positions of the frame portion 25 as shown in FIG. 6, and as shown by a two-dot chain line in FIG. A plurality of objects 2 can be attached to the locking portion 40. Further, a frame-shaped copper jig (not shown) is attached to the main bar 31.
, And the object to be plated 2 can be attached to the copper jig. By doing so, it is possible to hold various large and small plated objects 2.

The holding means 15 is slidably suspended by placing the top bar 35 on the first negative electrode 21 as shown in FIG. At this time, since the first negative electrode 21 is sandwiched between the guide 36 and the power supply plate 34, it is possible to prevent the holding means 15 from accidentally falling off.

The horizontal frame 32 of the frame 25 of the holding means 15
Is movably inserted with a slight gap between the guide rails 41 provided at predetermined intervals in the plating tank 12. Therefore, it is possible to prevent the holding means 15 from rattling. Further, since the holding means 15 is locked outside the first negative electrode 21, the holding means 15 can be easily removed from the outside of the plating tank 12 at the time of maintenance or the like.

When plating the object 2 to be plated,
A current is applied between the first positive electrode 20 and the first negative electrode 21. Then, as shown in FIG. 6, the current flows through the power supply plate 34, the power supply bar 33, the main bar 31, the locking portion 40, the workpiece 2, and the plating solution 42 of the holding unit 15. As a result, the plating metal in the plating solution 42, in this example, copper, adheres to a predetermined position of the plating object 2 and the plating process is performed.

A plurality of holding means 15 are continuously suspended from the first negative electrode 21. And these holding means 15
Are arranged at a predetermined interval.
For example, the frame 2
5 and slides on the first negative electrode 21.
Then, the holding means 15 in front of the pressed holding means 15 is also pressed, and all the holding means 15 on the first negative electrode 21 slide and move by one width. The first pusher means 16 is capable of moving vertically and horizontally.

As described above, the holding means 15 in the first plating means 13 moves at a predetermined timing between the two rows of the first positive electrodes 20 by a predetermined distance, thereby plating the object 2 to be plated. The thickness gradually increases. Then, when it passes through the inside of the first plating means 13 to the end, the plating thickness of the object to be plated 2 becomes a predetermined thickness. The holding means 15 pushed out from the first plating means 13 is received by the transfer means 18 as shown in FIG.

The transfer means 18 is a first plating means 1
A receiving means for receiving the object to be plated 2 discharged from the first plating means 13, wherein the object to be plated 2 discharged from the third plating means 3 is passed through the plating tank 12 and transferred to the second plating means 14; The first plating means 1 on the plate 2
A third plating means for performing plating treatment under the same conditions as in No. 3, and a reciprocation in which the receiving means and the third plating means are linearly reciprocated between the discharge side of the first plating means 13 and the supply side of the second plating means. Moving means.

That is, as shown in FIG. 7, the transfer means 18 includes a hanging part 51, a third plating means 52 attached to the hanging part 51, and a reciprocating means 53.
And are provided. The suspension portion 51 is formed in a rectangular frame shape by appropriately combining, for example, stainless steel channels, plate members, and the like.

The third plating means 52 is composed of a plurality of third positive electrodes 55 attached to the bottom plate 54 of the hanging portion 51 and a third negative electrode 56 provided above the third positive electrode 55. ing. The third positive electrode 55 is connected to the first plating unit 13.
The first positive electrode 20 is arranged in two rows in a straight line, and the distance between adjacent third positive electrodes 55 is the same as the distance between the first positive electrodes 20. When the transfer means 18 is moved toward the first plating means 13, the third positive electrode 55
Are aligned with the respective columns of the first positive electrode 20 of the first plating means 13.

The third negative electrode 56 is attached to the inner surface of the hanging portion 51, in this example, to the left inner surface via a bracket 57 and an insulating material 58. This third negative electrode 56
Is arranged at the same height as the first negative electrode 21 of the first plating means 13 as shown in FIG. 8, and functions as a receiving means.

Then, the transfer means 18 is the first plating means 1
3 side, the first negative electrode 21 and the third
The negative electrode 56 is aligned with the negative electrode 56, and a slight gap is formed therebetween. As a result, the holding means 15 pushed out from the first negative electrode 21 makes the first negative electrode 21
It is possible to smoothly transfer to the third positive electrode 55 without inadvertently falling out of the gap with the negative electrode 56.

The bottom plate 54 of the suspension unit 51 is further provided with a guide rail 59 for guiding the horizontal frame 32 of the holding means 15. Thus, it is possible to prevent the holding means 15 from rattling while the transfer means 18 is moving.

As shown in FIG. 8, the reciprocating means 53 comprises a motor 60, four guide wheels 61,
It has two rotating shafts 62 connecting the two guided wheels 61, 61, a bearing 63 supporting the rotating shaft 62, and a gear 64 fitted to one of the rotating shafts 62. The motor 60 and the bearing 63 are fixed to the upper surface of the suspension 51. Then, a pinion 65 (FIG. 7) attached to the rotation shaft 60 </ b> A of the motor 60 is engaged with the gear 64.

On the other hand, above the plating tank 12, for example, two rails 66 and 67 formed of channels are provided horizontally at appropriate intervals. These races 66, 6
7 is held in the plating tank 12 by supporting portions 68 and 69. The rails 66 and 67 extend over the entire width including the first plating means 13 and the second plating means 14, as shown in FIG. On these rails 66, 67,
Guided wheels 61 of reciprocating means 53 are mounted.

When the object 2 to be plated in the holding means 15 is transferred from the first plating means 13 to the second plating means 14, or when the transfer means 18 is transferred from the second plating means 14 side to the first plating means.
When returning to the plating means 13 side, the motor 60 is rotated in a predetermined direction. Then, the rotation shaft 62 and the guide-equipped wheels 61 attached thereto rotate, and the transfer means 18 moves between the discharge side of the first plating means 13 and the supply side of the second plating means 14.

Above the second plating means 14 and on the supply side, a second pusher means 17 is arranged as shown in FIG. When the transfer means 18 moves to the discharge side of the second plating means 14, the third negative electrode 5 of the transfer means 18 is moved.
6 (FIG. 8) is pressed by the second pusher means 17 to slide and move, and is supplied to the second plating means 14.

The second plating means 14 includes a second positive electrode 22 corresponding to the first positive electrode 20 of the first plating means 13 and a second negative electrode 23 corresponding to the first negative electrode 21.
Each part including these is configured similarly to the first plating means 13. The second negative electrode 23 extends to the plating solution temporary filling means 72 and beyond the post-processing means 19.

Then, the holding means 15 pushed out from the transfer means 18 moves to the second negative electrode 23 of the second plating means 14. At this time, the holding means 15 is arranged outside the second negative electrode 23 as shown in FIG. by this,
For example, when performing maintenance, the holding means 15 can be easily removed from the outside of the plating tank 12.

Next, the operation of the plating apparatus 1 will be described. As shown in FIG. 6, the object 2 to be plated is
Is applied to the first negative electrode 21 in front of the pretreatment means 11 in FIG. Next, the holding means 15
Is sent to the pre-processing means 11 by the first pusher means 16, where it is pre-processed.

At this time, the plating solution temporary filling means 71
The first opening / closing door 78 between the first plating means 13 and the first plating means 13 is closed, and the plating solution temporary filling means 71 is empty. Then, when the pre-processing of the object to be plated 2 is completed, the pre-processing means 1
1 and the second opening / closing door 79 between the plating solution temporary filling means 71
Is opened, and the holding means 15 in the preprocessing means 11 is sent into the plating solution temporary filling means 71.

Next, the second opening / closing door 79 is closed, and the plating solution 42 in the first plating means 13 is filled in the plating solution temporary filling means 71 by the pump 99 (FIG. 4). Thereafter, the first opening / closing door 78 is opened. Next, the holding means 15 in the plating liquid temporary filling means 71 is sent to the first plating means 13. Next, the first opening / closing door 78 is closed, and the plating solution 42 in the plating solution temporary filling means 71 is discharged.

In the first plating means 13, as shown in FIG. 6, when the holding means 15 is suspended between the first negative electrodes 21 and passes between two rows of the first positive electrodes 20. The plating object 2 is subjected to a plating process. Plated object 2
Is determined according to the distance between the opposing first positive electrodes 20 in each row, and the smaller the distance, the thicker the plating thickness. This plating apparatus 1
As described above, the plating thickness can be arbitrarily set by adjusting the interval between the two rows of the first positive electrodes 20.

The holding means 15 in the first plating means 13
The first pusher means 16 is intermittently pressed and moved by a predetermined distance at a predetermined timing at a predetermined timing, and when passing through the inside of the first plating means 13, plating is performed on the workpiece 2 by a predetermined thickness. . Then, the holding means 15 at the tip of the first negative electrode 21 is pushed out of the first negative electrode 21 by the operation of the first pusher means 16 and received by the third negative electrode 56 of the transfer means 18 as shown in FIG. It is.

The transfer means 18 moves to the supply side of the second plating means 14 at a predetermined timing after receiving the holding means 15. At this time, in the transfer unit 18, the plating target 2 of the holding unit 15 is plated by the third plating unit 52. Here, since the distance between the two rows of the third positive electrodes 55 and the distance between the third positive electrodes 55 in each row are the same as those of the first positive electrodes 20 of the first plating means 13, the first plating means The plating is performed under the same conditions as in the step 13.

After the transfer means 18 moves to the second plating means 14 side, the second pusher means 17 operates at a predetermined timing as shown in FIG.
6 (FIG. 8).
It moves to the negative electrode 23. And the second pusher means 17
As a result, it is intermittently pressed at a predetermined timing and moves by a predetermined distance.

At this time, the plating object 2 is plated by the second positive electrode 22 and the second negative electrode 23. Like the first plating means 13, the second plating means 14 can adjust the plating thickness by changing the interval between the two rows of the second positive electrodes 22.

The holding means 15 which has been subjected to the plating process by the second plating means 14 is sent to the post-processing means 19 via the plating solution temporary filling means 72. In this case, similarly to the above, the first door 78 and the second door 7
The plating solution 9 is opened and closed at a predetermined timing, and the plating solution in the plating solution temporary filling means 72 is filled or discharged. Then, the holding unit 15 having completed the post-processing is sent from the post-processing unit 19 to the outside.

By providing a transfer means (not shown) between the pre-processing means 11 and the post-processing means 19, it is possible to automatically return the post-processing holding means 15 to the pre-processing means 11. it can.

As described above, this plating apparatus 1
The object to be plated 2 is conveyed by a pusher method, and the pretreatment means 1
1 between the first plating means 13 and the second plating means 1
Between the plating solution 4 and the post-processing means 19;
1 and 72 are provided.
Since the first opening and closing door 78 and the second opening and closing door 79 which open and close at predetermined timings are provided on both sides of the first and second 72, the object to be plated 2 can be pre-processed by the pusher method without leaking the plating solution 42. To the post-processing means 19.

As a result, since it is not necessary to raise and lower the object to be plated 2, elevator equipment having a complicated structure as in the prior art is not required, and the assembling and installation time can be greatly reduced. Height can be reduced.

[0056]

As described above, according to the plating apparatus of the present invention, the distance between the pre-processing unit and the plating unit is
A plating liquid temporary filling means is provided between the plating processing means and the post-processing means, and opening and closing means are provided on both sides of the plating liquid temporary filling means, so that the plating liquid in the plating means is not leaked to the outside, and The object can be horizontally moved consistently from the pre-processing means to the post-processing means by the pusher means.

Accordingly, since it is not necessary to elevate and lower the object to be plated as in the prior art, an elevator facility having a complicated configuration is not required, and the assembling and installation time can be greatly reduced, and the height of the entire apparatus can be reduced. Can be lowered.

[Brief description of the drawings]

FIG. 1 is a plan view showing a plating apparatus according to the present invention.

FIG. 2 is a sectional view taken along line AA of FIG.

FIG. 3 is a plan view showing a plating solution temporary filling means of the plating apparatus according to the present invention.

FIG. 4 is a sectional view taken along line BB of FIG. 3;

FIG. 5 is a sectional view taken along the line CC of FIG. 1;

FIG. 6 is a sectional view taken along line DD of FIG. 5;

FIG. 7 is a sectional view taken along the line EE of FIG. 1;

FIG. 8 is a sectional view taken along line FF of FIG. 7;

FIG. 9 is a sectional view taken along line GG of FIG. 1;

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Plating apparatus 2 Object to be plated 11 Pretreatment means 12 Plating tank 13 First plating means 14 Second plating means 16 First pusher means 17 Second pusher means 19 Post-processing means 20 First positive electrode 21 First negative electrode 55 Third positive electrode 56 Third positive electrode 71, 72 Plating solution temporary filling means 78 First open / close door (Open / close means) 79 Second open / close door (Open / close means) 83 Tank 87 Drain valve (Drainage means)

Claims (1)

[Claims] 1. A plating means for plating an object to be plated by horizontally moving the object to be plated along electrodes linearly arranged in a plating tank, and a plating pretreatment for the object to be plated. Pre-processing means disposed before the plating means, and post-processing means disposed after the plating means to perform post-plating processing on the object to be plated,
In a plating apparatus comprising a pusher means for horizontally moving the object to be plated through the pre-processing means, the plating means and the post-processing means, the pre-processing means and the post-processing means are of a spray type,
A plating solution temporary filling unit for temporarily filling a plating solution in the plating unit, between the pre-processing unit and the plating unit, and between the post-processing unit and the plating unit; Means, a tank disposed on the movement locus of the object to be plated, between the tank and the plating means, and opening and closing means disposed between the tank and the pre-processing means or post-processing means, And a drainage means for discharging the plating solution in the tank.