JPH0260292U - - Google Patents
Info
- Publication number
- JPH0260292U JPH0260292U JP13934788U JP13934788U JPH0260292U JP H0260292 U JPH0260292 U JP H0260292U JP 13934788 U JP13934788 U JP 13934788U JP 13934788 U JP13934788 U JP 13934788U JP H0260292 U JPH0260292 U JP H0260292U
- Authority
- JP
- Japan
- Prior art keywords
- board
- circuit board
- radiator
- heat dissipation
- heatsink
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000017525 heat dissipation Effects 0.000 claims description 7
- 230000008878 coupling Effects 0.000 claims 2
- 238000010168 coupling process Methods 0.000 claims 2
- 238000005859 coupling reaction Methods 0.000 claims 2
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13934788U JPH0260292U (zh) | 1988-10-26 | 1988-10-26 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13934788U JPH0260292U (zh) | 1988-10-26 | 1988-10-26 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0260292U true JPH0260292U (zh) | 1990-05-02 |
Family
ID=31402520
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13934788U Pending JPH0260292U (zh) | 1988-10-26 | 1988-10-26 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0260292U (zh) |
-
1988
- 1988-10-26 JP JP13934788U patent/JPH0260292U/ja active Pending
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