JPH0259857U

JPH0259857U -

Info

Publication number: JPH0259857U
Application number: JP13648788U
Authority: JP
Priority date: 1988-10-19
Filing date: 1988-10-19
Publication date: 1990-05-01

Description

[Brief explanation of the drawing]

第１図はこの考案によるハンダ付け装置の一実
施例を示した概略的な正面図、第２図は同実施例
の加熱手段の内部構造を概略的に示した模式図、
第３図は電子部品の各リードに対して同時に熱を
照射する状態を示した説明図、第４図は制御手段
のブロツク線図である。図中、１は基台、２は電子部品、２ａはリード
、３は基板、４は加熱手段、５，１５は支持アー
ム、６，１４は送りネジ軸、７，１３はモータ、
１０は光源、１２は集光レンズ、１６は温度セン
サー、１８はＣＰＵである。 FIG. 1 is a schematic front view showing an embodiment of a soldering device according to this invention, and FIG. 2 is a schematic diagram schematically showing the internal structure of the heating means of the same embodiment.
FIG. 3 is an explanatory diagram showing a state in which heat is irradiated simultaneously to each lead of an electronic component, and FIG. 4 is a block diagram of the control means. In the figure, 1 is a base, 2 is an electronic component, 2a is a lead, 3 is a board, 4 is a heating means, 5 and 15 are support arms, 6 and 14 are feed screw shafts, 7 and 13 are motors,
10 is a light source, 12 is a condensing lens, 16 is a temperature sensor, and 18 is a CPU.

Claims

[Claims for Utility Model Registration] (1) It has a heating means including a light source such as a halogen lamp and its condensing lens, and heat is applied from the light source to the lead portion of electronic components such as ICs and memories through the condensing lens. A soldering device for soldering the leads to predetermined positions on a board by irradiating the parts, the main moving means for rough adjustment moving the entire heating means toward and away from the electronic components, and the condenser lens. It has a sub-moving means for fine adjustment to move along the optical axis, and a control means for controlling each of these moving means, and the main and sub-moving means control the entire heating means and the condensing lens. A soldering device characterized in that the temperature of the lead portion is controlled to a predetermined temperature by moving the lead portion. (2) The soldering device according to claim 1, wherein the main and sub-moving means both include feed screw shafts rotated by a motor. (3) The control means includes a temperature sensor that detects the temperature of the lead portion, and a CPU that compares the detected temperature from this temperature sensor with a set temperature, and controls the main and sub-moving means as appropriate based on the comparison.
2. The soldering apparatus according to claim 1, further comprising a processing section comprising a processing section such as a processing section.