JPH0640587Y2 - Laser processing equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Industrial field of application) The present invention is directed to a laser on the inner surface of a groove formed in an annular shape on the peripheral surface of a cylindrical workpiece as it is fed and rotated. The present invention relates to a laser processing device that irradiates light to perform heat treatment.

(Prior Art) In recent years, for example, heat treatment (quenching) by laser light has been performed on both inner side surfaces of a ring groove of a cylinder piston of an engine that face each other. As an apparatus for performing such heat treatment, there is an apparatus including a rotary table 1 and a processing head 2 for irradiating a laser beam as shown in FIG. This is a system in which a cylindrical piston 3 is set at a predetermined position on the rotary table 1 and then the rotary table 1 feeds and rotates the piston 3 about its axis a while the piston 3 is annularly formed on the circumferential surface of the piston 3. The inner side surface 4a of the ring groove 4 formed in the above is irradiated with laser light obliquely from the processing head 2 for quenching.

Thus, in this case, both inner surfaces of the ring groove 4 facing each other
In order to quench the 4a and 4b, it is necessary to quench the one inner surface 4a and then switch the laser beam irradiation to the other inner surface 4b. As a configuration for this, it is conceivable that the machining head 2 side is fixed, that is, the irradiation position of the laser light is constant, and the piston 3 side (rotary table 1 side) is moved, but in this case, one inner surface 4a After the quenching is finished, in order to make the other inner surface 4b face the laser beam, the operator must invert the piston 3 and set it again each time, so there is a drawback that automation is difficult. Therefore, conventionally, the position of the piston 3 is kept constant and the machining head 2 side is moved to switch the laser light irradiation position.

(Problems to be solved by the invention) However, in the case of moving the processing head 2 as described above, since the irradiation mode of the laser beam changes depending on the position of the processing head 2, the quenching widths on both inner side surfaces 4a, 4b are There was a drawback that the quenching depth was different and uniform quenching was not possible.

The present invention has been made in view of the above circumstances, and an object thereof is to provide a laser processing apparatus capable of performing uniform heat treatment on both inner side surfaces of a groove portion of a workpiece which face each other.

[Structure of the Invention] (Means for Solving the Problems) A laser processing apparatus of the present invention includes a feed rotating device that supports a work piece and feeds and rotates the work piece around its axis, and a feed rotation device. A turning table that rotates the device about a turning axis that is orthogonal to the axis of the workpiece, an XY table that moves the turning table on a plane that is orthogonal to the turning axis, and a predetermined inside surface of the groove of the workpiece. It is equipped with a processing head that irradiates laser light from an angle, and while the workpiece is rotated by a feed rotation device, one inner surface of the groove is irradiated with laser light from the processing head, and then the revolving table and XY
It is characterized in that the table is operated to move the other inner side surface of the groove portion to the irradiation position of the laser beam from the processing head.

(Operation) According to the above means, after performing heat treatment on one inner surface of the groove portion of the workpiece, the workpiece is rotated about the rotation axis by the rotation table and moved in plane by the XY table. , The other inner surface of the groove can be moved to the same laser light irradiation position. Since the irradiation mode of the laser light irradiated at this time is the same as that of the previous time and does not change, it is possible to automatically perform uniform heat treatment on both inner side surfaces of the groove.

(Embodiment) An embodiment in which the present invention is applied to a processing device for quenching the inner surface of a ring groove of a piston will be described with reference to Figs.
It will be described with reference to the drawings.

FIG. 1 shows a configuration of a main part of a laser processing apparatus 11 according to the present invention. The laser processing apparatus 11 is fixed to the processing table 12 and the processing table 12, which will be described in detail later. The processing head 13 is provided.
The processing head 13 includes a condenser lens 14, a bend mirror 15, etc., and is configured to output a laser beam 16 oscillated from a laser oscillator (not shown) in a substantially horizontal direction toward a predetermined position on the processing table 12. There is. On the other hand, 17 is a piston which is a work piece, which has a cylindrical shape as shown in FIGS. 2 and 3 and has, for example, 3
A groove portion 18 for mounting a book piston ring is formed in an annular shape.

Now, the processing table 12 is configured as follows. That is, 19 is an XY table, which is composed of an X-axis transfer device 20 and a Y-axis transfer device 21 provided on the X-axis transfer device 20 so as to be orthogonal thereto. X-axis transfer device
As is well known, 20 is fixedly provided in a substantially horizontal state, and a drive mechanism including a rail, a motor, a ball screw, and the like (not shown) is provided on the base 20a, and the Y-axis transfer device 21 is driven by this drive mechanism. It is designed to be moved along the rail in the X direction shown in FIG. Like the X-axis transfer device 20, the Y-axis transfer device 21 includes a rail and a drive mechanism (not shown) on the base 21a, and moves the moving body 22 along the rail to the X-axis.
It is designed to be moved in the Y direction which is orthogonal to the direction.
Thus, the XY table 19 can move the moving body 22 to any position on the XY plane. The X-axis transfer device 20 and the Y-axis transfer device 21 are covered with bellows-shaped covers 20b and 21b, respectively, to prevent foreign matter from entering the inside. Reference numeral 23 denotes a revolving table mounted on the upper surface of the moving body 22, which is configured such that a flat cylindrical revolving portion 23b on a base portion 23a fixed to the moving body 22 is rotated by a motor (not shown). There is. The turning axis Z, which is the center of rotation, is set to be orthogonal to the plane on which the moving body 22 of the XY table 19 moves. twenty four
Is a feed rotation device mounted on the revolving unit 23b of the revolving table 23, and has a chuck unit 25 on one side surface thereof. As shown in FIG. 1, the feed rotation device 24 is configured to support the piston 17 by gripping the chuck portion 25 while making the piston 17 substantially horizontal so that its axis A is orthogonal to the turning axis Z. The chuck portion 25 is rotated by a motor (not shown) so that the piston 17 is fed and rotated about its axis A. Thus, the processing table 12 can move and swivel the feed rotation device 24, and the piston 17 can be moved on a plane along the output direction of the laser light 16 with respect to the processing head 13, and The angle of the axis A with respect to the output direction can be freely changed.

In the machining table 12 configured as described above, each mechanism is driven in accordance with a preset program by a control device (not shown) including a microcomputer or the like, and the chuck portion 25 grips the piston 17 and releases or feeds it. The feed rotation of the piston 17 by the rotating device 24, the turning angle of the feed rotating device 24 by the turning table 23, and the amount of movement of the turning table 23 by the XY table 19 are controlled. At the same time, the controller also controls the output of the laser light 16 from the processing head 13, and is configured to automatically perform quenching processing on the piston 17 by the laser light 16 as described later.

Next, the operation of the above configuration will be described with reference to FIGS. 2 and 3.

First, as shown in FIG. 1, the piston 17 is supported at its base end portion by the chuck portion 25 and is supported by the feed rotation device 24 with its axis A substantially horizontal. In this state, one inner surface 18a of one groove 18 is positioned so as to face the processing head 13 at a predetermined distance and a predetermined angle. As a result, the inner side surface 18a is arranged at a preset irradiation position of the laser beam 16 from the processing head 13 as shown in FIG. Next, the piston 17 is rotated at a constant speed about the axis A in the direction of arrow B in FIG. Processing head 13
From which laser light 16 is emitted. As a result, the entire circumference of the inner surface 18a of the groove portion 18 is irradiated with the laser light 16 from a predetermined angle at a constant intensity, and the entire inner surface 18a is uniformly quenched. When the quenching process on the inner side surface 18a is completed, the output of the laser beam 16 from the processing head 13 and the feed rotation by the feed rotation device 24 are stopped, and the piston 17 is in the direction along the axis A by the XY table 19. It moves in the direction of arrow C in FIG. 2 and the one inner surface 18a of the other groove 18 is similarly quenched.

After the quenching of one inner surface 18a of the groove 18 is completed, the piston 17 is moved by the XY table 19 in the direction of arrow D (see FIG. 2) and the turning table 23 is rotated by the angle θ.
The piston 17 is positioned by turning only (see FIG. 3). At this time, as shown in FIG. 3, the other inner side surface 18b of the groove 18 is arranged at the same irradiation position as the one inner side surface 18a. And piston as above
When the laser beam 17 is rotated, the laser beam 16
Is irradiated to uniformly quench the entire inner surface 18b. This quenching process is also sequentially performed on the inner side surfaces 18b of all the groove portions 18. In this case, the piston 17 is moved in the direction of arrow D and the turning table 23 is turned by the angle θ.
Move in the direction of arrow C and turn the turning table 23 180 °
You may make it turn.

According to this embodiment, the piston 17 supported by the feed rotation device 24 can be freely moved by the turning table 23 and the XY table 19 with respect to the angle and position with respect to the processing head 13. Therefore, with the machining head 13 fixed and the irradiation position of the laser light 16 kept constant, each surface of the groove portion 18 of the piston 17 can be irradiated with the laser light 16 for heat treatment. As a result, unlike the conventional one in which the piston 3 on the rotary table 1 has to be turned upside down, quenching can be performed on both inner side surfaces 18a, 18b of the groove portion 18 by automatic operation, and the laser light 16 Since the irradiation position of is fixed and its irradiation mode does not change,
Uniform quenching can be applied to all the inner surfaces 18a, 18b.

[Effects of the Invention] As is apparent from the above description, according to the laser processing apparatus of the present invention, the turning table and the XY table are operated after irradiating the laser beam on one inner surface of the groove portion of the workpiece. Since the other inner surface of the groove is moved to the irradiation position of the laser beam from the processing head, it is possible to perform a uniform heat treatment on both inner surfaces of the groove of the workpiece which are opposed to each other. Produce an effect.

[Brief description of drawings]

FIGS. 1 to 3 show an embodiment of the present invention. FIG. 1 is a perspective view of a main part of a laser processing apparatus, and FIG. 2 is a diagram showing one inner surface of a groove portion when laser light is irradiated. FIG. 4 is a top view showing the positional relationship between the laser light and the piston, FIG. 3 is a view corresponding to FIG. 2 when the other inner surface of the groove is irradiated with laser light, and FIG. 4 is a schematic front view showing a conventional example. It is a figure. In the drawing, 13 is a processing head, 16 is a laser beam, 17 is a piston (workpiece), 18 is a groove, 18a is one inner surface, 18b is the other inner surface, 19 is an XY table, 23 is a swivel table, 24 is a feed rotation device, A is an axis, and Z is a turning axis.

Claims (1)

[Scope of utility model registration request] 1. A heat treatment is performed by irradiating a cylindrical workpiece having an annular groove formed on a peripheral surface thereof, and irradiating both inner side surfaces of the groove of the workpiece facing each other with laser light. And a feed rotation device that supports the work piece and feeds and rotates the work piece about its axis, and a swing that rotates the feed rotation device about a turning axis that is orthogonal to the axis of the work piece. A table, an XY table for moving the swivel table on a plane orthogonal to the swivel axis, and a machining head for irradiating the inner surface of the groove of the workpiece with a laser beam from a predetermined angle, the workpiece. While irradiating the inner surface of the groove portion with the laser beam from the processing head while rotating by the feed rotating device, and then operating the turning table and the XY table to move the other inner surface of the groove portion to the processing head. Or A laser processing apparatus characterized in that the laser processing apparatus is configured to move to the irradiation position of the laser light.