JPH0256460U - - Google Patents

Info

Publication number
JPH0256460U
JPH0256460U JP1988136213U JP13621388U JPH0256460U JP H0256460 U JPH0256460 U JP H0256460U JP 1988136213 U JP1988136213 U JP 1988136213U JP 13621388 U JP13621388 U JP 13621388U JP H0256460 U JPH0256460 U JP H0256460U
Authority
JP
Japan
Prior art keywords
integrated circuit
insulating
hybrid integrated
substrate
conductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1988136213U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0636592Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988136213U priority Critical patent/JPH0636592Y2/ja
Publication of JPH0256460U publication Critical patent/JPH0256460U/ja
Application granted granted Critical
Publication of JPH0636592Y2 publication Critical patent/JPH0636592Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Structure Of Printed Boards (AREA)
JP1988136213U 1988-10-19 1988-10-19 混成集積回路装置 Expired - Lifetime JPH0636592Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988136213U JPH0636592Y2 (ja) 1988-10-19 1988-10-19 混成集積回路装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988136213U JPH0636592Y2 (ja) 1988-10-19 1988-10-19 混成集積回路装置

Publications (2)

Publication Number Publication Date
JPH0256460U true JPH0256460U (enExample) 1990-04-24
JPH0636592Y2 JPH0636592Y2 (ja) 1994-09-21

Family

ID=31396510

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988136213U Expired - Lifetime JPH0636592Y2 (ja) 1988-10-19 1988-10-19 混成集積回路装置

Country Status (1)

Country Link
JP (1) JPH0636592Y2 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013110354A (ja) * 2011-11-24 2013-06-06 Keihin Corp 電子制御装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6241594U (enExample) * 1985-04-26 1987-03-12

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6241594U (enExample) * 1985-04-26 1987-03-12

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013110354A (ja) * 2011-11-24 2013-06-06 Keihin Corp 電子制御装置

Also Published As

Publication number Publication date
JPH0636592Y2 (ja) 1994-09-21

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