JPH025578Y2 - - Google Patents
Info
- Publication number
- JPH025578Y2 JPH025578Y2 JP1983049051U JP4905183U JPH025578Y2 JP H025578 Y2 JPH025578 Y2 JP H025578Y2 JP 1983049051 U JP1983049051 U JP 1983049051U JP 4905183 U JP4905183 U JP 4905183U JP H025578 Y2 JPH025578 Y2 JP H025578Y2
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- screw
- electronic component
- heat
- female screw
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 230000017525 heat dissipation Effects 0.000 claims description 11
- 238000001816 cooling Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1983049051U JPS59155795U (ja) | 1983-03-31 | 1983-03-31 | 電子機器用放熱装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1983049051U JPS59155795U (ja) | 1983-03-31 | 1983-03-31 | 電子機器用放熱装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS59155795U JPS59155795U (ja) | 1984-10-19 |
JPH025578Y2 true JPH025578Y2 (xx) | 1990-02-09 |
Family
ID=30179566
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1983049051U Granted JPS59155795U (ja) | 1983-03-31 | 1983-03-31 | 電子機器用放熱装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS59155795U (xx) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4507926B2 (ja) * | 2005-03-16 | 2010-07-21 | 富士通株式会社 | 放熱構造および放熱方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5759500B2 (xx) * | 1977-11-01 | 1982-12-15 | Giken Toreeteingu Kk | |
JPS5815358B2 (ja) * | 1977-12-23 | 1983-03-25 | 日立造船株式会社 | 船積長大製品の固縛方法 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5759500U (xx) * | 1980-09-26 | 1982-04-08 | ||
JPS5815358U (ja) * | 1981-07-24 | 1983-01-31 | 日立電子株式会社 | 放熱器 |
-
1983
- 1983-03-31 JP JP1983049051U patent/JPS59155795U/ja active Granted
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5759500B2 (xx) * | 1977-11-01 | 1982-12-15 | Giken Toreeteingu Kk | |
JPS5815358B2 (ja) * | 1977-12-23 | 1983-03-25 | 日立造船株式会社 | 船積長大製品の固縛方法 |
Also Published As
Publication number | Publication date |
---|---|
JPS59155795U (ja) | 1984-10-19 |
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