JPH025491Y2 - - Google Patents
Info
- Publication number
- JPH025491Y2 JPH025491Y2 JP1984027081U JP2708184U JPH025491Y2 JP H025491 Y2 JPH025491 Y2 JP H025491Y2 JP 1984027081 U JP1984027081 U JP 1984027081U JP 2708184 U JP2708184 U JP 2708184U JP H025491 Y2 JPH025491 Y2 JP H025491Y2
- Authority
- JP
- Japan
- Prior art keywords
- flat package
- circuit
- terminal
- terminals
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000758 substrate Substances 0.000 claims description 17
- 239000003990 capacitor Substances 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 239000004020 conductor Substances 0.000 description 16
- 238000010586 diagram Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000009977 dual effect Effects 0.000 description 1
Landscapes
- Multi-Conductor Connections (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984027081U JPS60141153U (ja) | 1984-02-27 | 1984-02-27 | 混成回路 |
| US06/701,211 US4656442A (en) | 1984-02-27 | 1985-02-13 | Hybrid circuit device |
| IT8547722A IT1180736B (it) | 1984-02-27 | 1985-02-25 | Dispositivo a circuito ibrido |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984027081U JPS60141153U (ja) | 1984-02-27 | 1984-02-27 | 混成回路 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60141153U JPS60141153U (ja) | 1985-09-18 |
| JPH025491Y2 true JPH025491Y2 (US07902200-20110308-C00004.png) | 1990-02-09 |
Family
ID=30523695
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1984027081U Granted JPS60141153U (ja) | 1984-02-27 | 1984-02-27 | 混成回路 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60141153U (US07902200-20110308-C00004.png) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58369B2 (ja) * | 1976-07-15 | 1983-01-06 | 株式会社クボタ | 合成樹脂フロ−トのブロ−成形方法 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58369U (ja) * | 1981-06-26 | 1983-01-05 | 株式会社日立製作所 | 配線間接続用金具 |
| JPS5889953U (ja) * | 1981-12-14 | 1983-06-17 | 東光株式会社 | 混成回路 |
-
1984
- 1984-02-27 JP JP1984027081U patent/JPS60141153U/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58369B2 (ja) * | 1976-07-15 | 1983-01-06 | 株式会社クボタ | 合成樹脂フロ−トのブロ−成形方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60141153U (ja) | 1985-09-18 |
