JPH0252861B2 - - Google Patents
Info
- Publication number
- JPH0252861B2 JPH0252861B2 JP59099680A JP9968084A JPH0252861B2 JP H0252861 B2 JPH0252861 B2 JP H0252861B2 JP 59099680 A JP59099680 A JP 59099680A JP 9968084 A JP9968084 A JP 9968084A JP H0252861 B2 JPH0252861 B2 JP H0252861B2
- Authority
- JP
- Japan
- Prior art keywords
- multilayer
- inorganic material
- alumina
- thermal conductivity
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H10W70/692—
-
- H10W70/05—
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59099680A JPS60245154A (ja) | 1984-05-19 | 1984-05-19 | 半導体装置実装用多層基板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59099680A JPS60245154A (ja) | 1984-05-19 | 1984-05-19 | 半導体装置実装用多層基板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60245154A JPS60245154A (ja) | 1985-12-04 |
| JPH0252861B2 true JPH0252861B2 (cg-RX-API-DMAC10.html) | 1990-11-14 |
Family
ID=14253743
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59099680A Granted JPS60245154A (ja) | 1984-05-19 | 1984-05-19 | 半導体装置実装用多層基板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60245154A (cg-RX-API-DMAC10.html) |
-
1984
- 1984-05-19 JP JP59099680A patent/JPS60245154A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60245154A (ja) | 1985-12-04 |
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