JPH0252118A - 極細径複合線材の製造方法 - Google Patents

極細径複合線材の製造方法

Info

Publication number
JPH0252118A
JPH0252118A JP63204466A JP20446688A JPH0252118A JP H0252118 A JPH0252118 A JP H0252118A JP 63204466 A JP63204466 A JP 63204466A JP 20446688 A JP20446688 A JP 20446688A JP H0252118 A JPH0252118 A JP H0252118A
Authority
JP
Japan
Prior art keywords
stock
composite
outer layer
diameter
wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP63204466A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0530524B2 (enExample
Inventor
Kazuyuki Nakasuji
中筋　和行
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Steel Corp
Original Assignee
Sumitomo Metal Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Metal Industries Ltd filed Critical Sumitomo Metal Industries Ltd
Priority to JP63204466A priority Critical patent/JPH0252118A/ja
Publication of JPH0252118A publication Critical patent/JPH0252118A/ja
Publication of JPH0530524B2 publication Critical patent/JPH0530524B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/0115—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/43—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45147—Copper (Cu) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45163—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than 1550°C
    • H01L2224/45169—Platinum (Pt) as principal constituent
    • H10W72/0116—
    • H10W72/50—
    • H10W72/522—
    • H10W72/551—
    • H10W72/552—
    • H10W72/5522—
    • H10W72/5524—
    • H10W72/555—

Landscapes

  • Metal Rolling (AREA)
  • Metal Extraction Processes (AREA)
  • Wire Bonding (AREA)
JP63204466A 1988-08-16 1988-08-16 極細径複合線材の製造方法 Granted JPH0252118A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP63204466A JPH0252118A (ja) 1988-08-16 1988-08-16 極細径複合線材の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63204466A JPH0252118A (ja) 1988-08-16 1988-08-16 極細径複合線材の製造方法

Publications (2)

Publication Number Publication Date
JPH0252118A true JPH0252118A (ja) 1990-02-21
JPH0530524B2 JPH0530524B2 (enExample) 1993-05-10

Family

ID=16491001

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63204466A Granted JPH0252118A (ja) 1988-08-16 1988-08-16 極細径複合線材の製造方法

Country Status (1)

Country Link
JP (1) JPH0252118A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005145012A (ja) * 2003-11-19 2005-06-09 Honda Motor Co Ltd 金属部材の製造方法
US7969021B2 (en) 2000-09-18 2011-06-28 Nippon Steel Corporation Bonding wire for semiconductor device and method for producing the same

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6346738A (ja) * 1986-08-14 1988-02-27 Kobe Steel Ltd 半導体素子用ボンデイングワイヤ及びその製造方法
JPS6388848A (ja) * 1986-10-02 1988-04-19 Hitachi Cable Ltd 複合線の製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6346738A (ja) * 1986-08-14 1988-02-27 Kobe Steel Ltd 半導体素子用ボンデイングワイヤ及びその製造方法
JPS6388848A (ja) * 1986-10-02 1988-04-19 Hitachi Cable Ltd 複合線の製造方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7969021B2 (en) 2000-09-18 2011-06-28 Nippon Steel Corporation Bonding wire for semiconductor device and method for producing the same
JP2013080960A (ja) * 2000-09-18 2013-05-02 Nippon Steel Sumikin Materials Co Ltd 半導体用ボンディングワイヤおよびその製造方法
JP2005145012A (ja) * 2003-11-19 2005-06-09 Honda Motor Co Ltd 金属部材の製造方法

Also Published As

Publication number Publication date
JPH0530524B2 (enExample) 1993-05-10

Similar Documents

Publication Publication Date Title
JPH0252118A (ja) 極細径複合線材の製造方法
JP2001040462A (ja) チタンまたはチタン合金細径線材の製造方法
JP3242521B2 (ja) チタン合金リングの製造方法
JPH0857533A (ja) クラッドバーおよびその製造方法
US5004143A (en) Method of manufacturing clad bar
JP3266053B2 (ja) 自由鍛造用金敷
JP6316698B2 (ja) 内面螺旋溝付管およびその製造方法と熱交換器
JPH026087A (ja) 貴金属クラッドチタン線材の製造方法
JPH02142682A (ja) 多芯構造複合材料の製造方法
JPS6336903A (ja) 複合材の製造方法
JPS6343719A (ja) 複合材の製造方法
JPH026086A (ja) 貴金属クラッドチタン線材の製造方法
JP2504118B2 (ja) クラッド棒鋼の製造方法
JPH0688049B2 (ja) 内面平滑性に優れた継目無管の製造方法
JPH0246939A (ja) 複合線材の製造方法
JP2021065930A (ja) Ｐｔ合金パイプの製造方法
JP6316696B2 (ja) 内面螺旋溝付管およびその製造方法と熱交換器
JPS63303640A (ja) スパイラルフィン付金属管の製造方法
JPH08117920A (ja) 管のアプセット加工方法
JPS61137623A (ja) ステンレス繊維の製造法
JPS6284883A (ja) Ｔｉ系金属とＮｉ系金属のクラツド材の製造方法
JPH0310401B2 (enExample)
JPH02112886A (ja) クラッドチタン線材の製造方法
JPH0413041B2 (enExample)
JP2004298899A (ja) 内面溝付管の製造装置及び製造方法