JPH0249704Y2 - - Google Patents
Info
- Publication number
- JPH0249704Y2 JPH0249704Y2 JP17390985U JP17390985U JPH0249704Y2 JP H0249704 Y2 JPH0249704 Y2 JP H0249704Y2 JP 17390985 U JP17390985 U JP 17390985U JP 17390985 U JP17390985 U JP 17390985U JP H0249704 Y2 JPH0249704 Y2 JP H0249704Y2
- Authority
- JP
- Japan
- Prior art keywords
- lead wire
- capacitor
- fitting groove
- metal terminal
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 41
- 239000003990 capacitor Substances 0.000 claims description 36
- 229910052751 metal Inorganic materials 0.000 claims description 25
- 239000002184 metal Substances 0.000 claims description 25
- 229910052782 aluminium Inorganic materials 0.000 claims description 13
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 13
- 238000007789 sealing Methods 0.000 claims description 6
- 239000003792 electrolyte Substances 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 238000005452 bending Methods 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17390985U JPH0249704Y2 (zh) | 1985-11-11 | 1985-11-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17390985U JPH0249704Y2 (zh) | 1985-11-11 | 1985-11-11 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6282727U JPS6282727U (zh) | 1987-05-27 |
| JPH0249704Y2 true JPH0249704Y2 (zh) | 1990-12-27 |
Family
ID=31111812
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17390985U Expired JPH0249704Y2 (zh) | 1985-11-11 | 1985-11-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0249704Y2 (zh) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0325393Y2 (zh) * | 1985-11-13 | 1991-06-03 |
-
1985
- 1985-11-11 JP JP17390985U patent/JPH0249704Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6282727U (zh) | 1987-05-27 |
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