JPH0248428A - Glaze composition for ceramic base plate - Google Patents
Glaze composition for ceramic base plateInfo
- Publication number
- JPH0248428A JPH0248428A JP19844988A JP19844988A JPH0248428A JP H0248428 A JPH0248428 A JP H0248428A JP 19844988 A JP19844988 A JP 19844988A JP 19844988 A JP19844988 A JP 19844988A JP H0248428 A JPH0248428 A JP H0248428A
- Authority
- JP
- Japan
- Prior art keywords
- glaze
- glaze composition
- composition
- base plate
- heat resistance
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000203 mixture Substances 0.000 title claims abstract description 29
- 239000000919 ceramic Substances 0.000 title claims abstract description 6
- 239000000758 substrate Substances 0.000 claims description 18
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 abstract description 12
- 230000005499 meniscus Effects 0.000 abstract description 9
- 239000010408 film Substances 0.000 abstract description 3
- 239000010409 thin film Substances 0.000 abstract description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract 4
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 abstract 4
- QVQLCTNNEUAWMS-UHFFFAOYSA-N barium oxide Inorganic materials [Ba]=O QVQLCTNNEUAWMS-UHFFFAOYSA-N 0.000 abstract 2
- ODINCKMPIJJUCX-UHFFFAOYSA-N calcium oxide Inorganic materials [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 abstract 2
- 229910052681 coesite Inorganic materials 0.000 abstract 2
- 229910052593 corundum Inorganic materials 0.000 abstract 2
- 229910052906 cristobalite Inorganic materials 0.000 abstract 2
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 abstract 2
- 239000000377 silicon dioxide Substances 0.000 abstract 2
- 235000012239 silicon dioxide Nutrition 0.000 abstract 2
- 229910052682 stishovite Inorganic materials 0.000 abstract 2
- IATRAKWUXMZMIY-UHFFFAOYSA-N strontium oxide Inorganic materials [O-2].[Sr+2] IATRAKWUXMZMIY-UHFFFAOYSA-N 0.000 abstract 2
- 229910052905 tridymite Inorganic materials 0.000 abstract 2
- 229910001845 yogo sapphire Inorganic materials 0.000 abstract 2
- 239000011324 bead Substances 0.000 abstract 1
- 230000002035 prolonged effect Effects 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 6
- 239000011521 glass Substances 0.000 description 5
- 238000004031 devitrification Methods 0.000 description 4
- 238000000206 photolithography Methods 0.000 description 4
- 238000010304 firing Methods 0.000 description 3
- 230000007261 regionalization Effects 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000007704 transition Effects 0.000 description 2
- 239000001856 Ethyl cellulose Substances 0.000 description 1
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 description 1
- KKCBUQHMOMHUOY-UHFFFAOYSA-N Na2O Inorganic materials [O-2].[Na+].[Na+] KKCBUQHMOMHUOY-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 229920001249 ethyl cellulose Polymers 0.000 description 1
- 235000019325 ethyl cellulose Nutrition 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Landscapes
- Glass Compositions (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明はサーマルプリンタヘッドに用いられるセラミッ
ク基板用のグレーズ組成物の改良に関するものである。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to improvements in glaze compositions for ceramic substrates used in thermal printer heads.
（従来の技術）
サーマルプリンタヘッド用の基板としては、アルミナ賞
の基板の表面にグレーズと呼ばれるガラスを施釉したグ
レーズ基板が用いられ、その表面に回路がフォトリソグ
ラフ法により形成される。(Prior Art) As a substrate for a thermal printer head, a glaze substrate is used, in which the surface of an alumina substrate is coated with glass called glaze, and a circuit is formed on the surface by photolithography.
このためのグレーズ組成物は８００’Ｃ以上の高温で導
体、抵抗体等を焼付けても回路パターンの崩れが生じな
いように十分な耐熱性を存することが求められ、またグ
レーズ基板の端部が１０〜２０ ｐ ｍの高さに盛上が
るメニスカスと呼ばれる現象を起こしにくいものである
ことが求められる。The glaze composition for this purpose is required to have sufficient heat resistance so that the circuit pattern does not collapse even if conductors, resistors, etc. are baked at high temperatures of 800'C or higher, and the edges of the glaze substrate are The material is required to be resistant to the phenomenon called meniscus, which bulges to a height of 10 to 20 pm.
このようなグレーズ組成物としては従来から多くのもの
が特許出願されている。例えば特公昭６０−５５４５３
号公報には、ＳｉＪ、Ｒ，Ｏ，、ＣａＯ１Ｂａｄ、 ５
ｒＯ２Ａ ／ ｚｏｚを特定の割合で含有させたグレー
ズ組成物が開示されている。しかしこのグレーズ組成物
は実質的な転移点が６９０℃であるために８００℃以上
の高温焼成を行うと回路パターンが崩れるおそれがある
。また特公昭６１−２４３４５号公報には５ｉＯｚ、Ａ
１．０３、Ｃａｂ、 ＢａＯ１Ｂ２０３、ＺｎＯを特
定の割合で含有させたグレーズ組成物が開示されており
、更に特開昭６２−９６３４４号公報にはＳｉＪ、Ａ
Ｉｌ、０．、Ｃａｂ、 Ｂａｄ、 ＳｒＯ，ｐｒｏｓを
特定の割合で含有させたグレーズ組成物が開示されてい
る。しかしこれらのグレーズ組成物は基板の端部に１０
〜２０μ鋼のグレーズ層の盛上がり（メニスカス）が生
ずるためにその部分を回路として使用できず、また回路
パターン形成時のマスク合せやフォトリソグラフの精度
が悪くなるという欠点があった・
（発明が解決しようとする課題）
本発明は上記した従来の欠点を解決して、８００℃以上
の高温焼成に耐える耐熱性を備え、またメニスカスをほ
とんどゼロとすることができるうえ、アルミナ基板と熱
膨張係数が揃ったセラミック基板用のグレーズ組成物を
提供するために完成されたものである。Patent applications have been filed for many such glaze compositions. For example, special public service No. 60-55453
The publication includes SiJ, R, O, CaO1Bad, 5
A glaze composition containing a specific ratio of rO2A/zoz is disclosed. However, since this glaze composition has a substantial transition point of 690°C, there is a risk that the circuit pattern will collapse if it is fired at a high temperature of 800°C or higher. In addition, 5iOz, A
A glaze composition containing 1.03, Cab, BaO1B203, and ZnO in a specific ratio is disclosed, and furthermore, JP-A-62-96344 contains SiJ, A
Il, 0. , Cab, Bad, SrO, and pros in specific proportions are disclosed. However, these glaze compositions are
- There was a drawback that the 20 μ steel glaze layer had a protrusion (meniscus) that made it impossible to use that part as a circuit, and that the precision of mask alignment and photolithography during circuit pattern formation deteriorated (Solved by the invention) The present invention solves the above-mentioned conventional drawbacks, has heat resistance that can withstand high-temperature firing of 800°C or more, can reduce meniscus to almost zero, and has a thermal expansion coefficient similar to that of an alumina substrate. It was completed to provide a complete glaze composition for ceramic substrates.
（課題を解決するための手段）
本発明は重量比でＳｉ０□４５〜６０％、ＡＩ！２０．
５〜１２％、ＣａＯ５〜］、５％、ｔ（ａｏ １５〜３
０％、ＳｒＯＯ，５〜５％、Ｔｉ０ｚ Ｏ，５〜５％、
ＭｇＯ０，５〜５％を含有することを特徴とするもので
ある。(Means for Solving the Problems) The present invention has a weight ratio of Si0□45 to 60% and AI! 20.
5-12%, CaO5-], 5%, t(ao 15-3
0%, SrOO, 5-5%, Ti0zO, 5-5%,
It is characterized by containing 0.5 to 5% MgO.
本発明のグレーズ組成物は、耐熱性を増加させるために
Ｎａ２Ｏ、Ｋ２Ｏ等のアルカリ成分及びＢ２Ｏ３の含を
量をゼロとするとともに、これによる溶解性と清澄性の
低下をＣａｂ、 ＢａＯの増量により補った点に第１の
特徴がある。これによって屈伏点を７９０℃と従来品よ
りも大幅に向上させることができ、しかも従来のグレー
ズ組成物と変わりのない溶融性を維持することができる
。また本発明のグレーズ組成物はＢａＯを比較的多量に
含有させるとともに、５ｒＯ１ＴｉＯ□、ＭｇＯをバラ
ンス良く含有させることによって基板との間の表面張力
を低下させた点に第２の特徴があり、これによって基板
の端部におけるグレーズの盛上がりを従来の１０〜２０
μｍから０〜３μｍと大幅に減少させることができる。In the glaze composition of the present invention, in order to increase heat resistance, the content of alkaline components such as Na2O and K2O and B2O3 is reduced to zero, and the resulting decrease in solubility and clarity is reduced by increasing the amount of Cab and BaO. The first feature lies in the supplementary points. As a result, the yield point can be significantly improved to 790° C. compared to conventional products, and it is possible to maintain the same melting properties as conventional glaze compositions. The second feature of the glaze composition of the present invention is that it contains a relatively large amount of BaO and also contains 5rO1TiO□ and MgO in a well-balanced manner, thereby reducing the surface tension with the substrate. The glaze build-up at the edge of the substrate can be reduced by 10 to 20
It can be significantly reduced from μm to 0 to 3 μm.
以下に各成分の含有率の限定理由を示す。The reasons for limiting the content of each component are shown below.
ＳｉＯ□はガラス構造を形成するための主成分であり、
その含有率が６０％を越えると熱膨張係数が小さくなり
すぎてアルミナ基板の熱膨張係数との差が大きくなり、
逆に４５％未満ではグレーズの耐熱性が不十分となり本
発明の目的が達成できない。SiO□ is the main component for forming the glass structure,
If the content exceeds 60%, the coefficient of thermal expansion becomes too small and the difference with the coefficient of thermal expansion of the alumina substrate becomes large.
On the other hand, if it is less than 45%, the heat resistance of the glaze will be insufficient and the object of the present invention cannot be achieved.
Ａ ｌ 、０．は、グレーズの化学的耐久性を向上させ
るとともに失透を防止してガラスの作業温度範囲を広め
る役割を持つ成分であって、１２％を越えると溶融が困
難化するとともにグレーズの焼成温度も高くなりすぎて
平滑なグレーズ面が得られず、逆に５％未満ではグレー
ズ焼成時に失透が発生し易くなる。Al, 0. is a component that improves the chemical durability of the glaze, prevents devitrification, and widens the working temperature range of the glass.If it exceeds 12%, it becomes difficult to melt and the firing temperature of the glaze becomes high. If it becomes too much, a smooth glazed surface cannot be obtained, and conversely, if it is less than 5%, devitrification tends to occur during glaze firing.
ＣａＯはＢａＯとともに溶融性と清澄性を向上させる効
果を持つとともに、熱膨張係数を増大させる効果を有す
るが、１５％を越えると失透し易くなり、逆に５％未満
では熱膨張係数を増大させる効果がなく、アルミナ基板
と熱膨張係数を揃えることが困難となる。CaO, along with BaO, has the effect of improving meltability and clarity, as well as increasing the coefficient of thermal expansion; however, if it exceeds 15%, it tends to devitrify, and conversely, if it is less than 5%, it increases the coefficient of thermal expansion. This makes it difficult to match the coefficient of thermal expansion with the alumina substrate.
ＢａＯはＣａＯと同様の効果を持つほか、アルミナ基板
との間の表面張力を低下させる効果を持つ。ＢａＯは３
０％を越えると失透が発生し易くなり、逆に１５％未満
となると表面張力を低下させる効果が小さくなってメニ
スカスが大となる。BaO has the same effect as CaO, and also has the effect of lowering the surface tension with the alumina substrate. BaO is 3
When it exceeds 0%, devitrification tends to occur, and when it is less than 15%, the effect of lowering surface tension becomes small and the meniscus becomes large.
５ｒＯ１ＴｉＯ□、ＭｇＯは上記の主成分に添加するこ
とによって表面張力を低下させるための成分であり、０
．５％未満ではメニスカスを減少させる効果が不十分で
あり、逆に数値限定の上限値以上に添加すると失透の発
生を促進してしまう。5rO1TiO□, MgO are components to lower the surface tension by adding them to the above main components, and 0
．． If it is less than 5%, the effect of reducing the meniscus is insufficient, and conversely, if it is added above the upper limit of the numerical limit, it will promote the occurrence of devitrification.
（作用）
上記のような組成を持つ本発明のグレーズ組成物は、耐
熱性が高く後述する実施例のデータにも示されるように
屈伏点が８１０℃に達する。従って厚膜タイプのサーマ
ルプリンタヘッドに使用される場合には回路形成のため
の高温焼成時においても下地のグレーズ層の耐熱性が高
く、回路パターンの変形が生じない。また薄膜タイプの
サーマルプリンタヘッドに使用される場合には下地のグ
レーズ層の耐熱性が高いために高温で抵抗体をアニリン
グができ、完成品の寿命を長くすることができる。 次
に本発明のグレーズ組成物はアルミナ基板との間の表面
張力が小さく濡れ性が良好であるため、グレーズ端部の
盛上がり（メニスカス）を０〜３μｍと極めて小さくす
ることができる。(Function) The glaze composition of the present invention having the composition as described above has high heat resistance and has a yield point of 810° C. as shown in the data of Examples described below. Therefore, when used in a thick-film type thermal printer head, the underlying glaze layer has high heat resistance even during high-temperature baking for circuit formation, and the circuit pattern does not deform. Furthermore, when used in a thin film type thermal printer head, the underlying glaze layer has high heat resistance, so the resistor can be annealed at high temperatures, extending the life of the finished product. Next, since the glaze composition of the present invention has a low surface tension with the alumina substrate and good wettability, the bulge (meniscus) at the edge of the glaze can be made extremely small to 0 to 3 μm.
このようにグレーズ層の膜厚の均一部分が大きくなるた
めパターン形成面積を大きく使用することができるうえ
、パターン形成のフォトリソグラフ工程においてマスク
とグレーズ表面とを密着させることができ、精度を上げ
ることができる。In this way, since the uniform thickness of the glaze layer becomes larger, a larger area for pattern formation can be used, and the mask and glaze surface can be brought into close contact during the photolithography process of pattern formation, improving accuracy. Can be done.
以下に本発明の実施例を示す。Examples of the present invention are shown below.
（実施例）
次頁の表に示した酸化物組成となるように原料を調合し
、高純度のるつぼに入れて１４００〜１６００℃で溶融
し、急冷して得られたガラスをアルミナ製ボールミルで
微粉砕した。このようにして得られたガラスの微粉末を
エチルセルロースとα−チルピノール等の混合物である
ビヒクルと混合し、ペースト状とした。このペーストを
スクリーン印刷法でアルミナ基板上に印刷して所望の厚
みの膜を形成し、１２００〜１３００℃で焼成すること
によりグレーズ基板とした。(Example) Raw materials were prepared to have the oxide composition shown in the table on the next page, placed in a high-purity crucible, melted at 1400 to 1600°C, and rapidly cooled. The resulting glass was milled in an alumina ball mill. Finely ground. The glass fine powder thus obtained was mixed with a vehicle, which is a mixture of ethyl cellulose and α-tilpinol, to form a paste. This paste was printed on an alumina substrate by screen printing to form a film of desired thickness, and baked at 1200 to 1300°C to obtain a glazed substrate.
表中の１ｌｈｌと患２は本発明の実施例であり、阻３は
出願人会社が以前に開発したグレーズ組成物である。ま
た隘４と阻５も従来他社から市販されているグレーズ組
成物である。各グレーズ組成物の熱膨張係数、転移点、
屈伏点、メニスカスを測定した結果を表中に記入した。In the table, 1lhl and 2 are examples of the present invention, and 3 is a glaze composition previously developed by the applicant's company. In addition, No. 4 and No. 5 are also conventional glaze compositions commercially available from other companies. Thermal expansion coefficient and transition point of each glaze composition,
The results of measuring the yield point and meniscus are entered in the table.
表中の組成の単位はＭ量％、熱膨張係数の単位は１０−
．／℃である。The unit of composition in the table is M amount %, and the unit of thermal expansion coefficient is 10-
．． /℃.
（発明の効果）
以上に説明したとおり、本発明は従来にない新規な組成
とすることによって、アルミナ基板と熱膨張係数がほぼ
等しく、また耐熱型に優れるうえにメニスカスをほとん
どなくすることができるもので、このグレーズ組成物を
用いれば８００℃以上の高温焼成を行っても回路の崩れ
がなく、またフォトリソグラフによる回路形成の精度を
著しく向上させることができ、高性能のサーマルプリン
タヘッドを製造することが可能となる。よって本発明は
従来の問題点を一掃したセラミック基板用のグレーズ組
成物として、産業の発展に寄与するところは極めて大で
ある。(Effects of the Invention) As explained above, the present invention has a novel composition that has not been seen before, so that the coefficient of thermal expansion is almost the same as that of the alumina substrate, and in addition to being excellent in heat resistance, it is possible to almost eliminate meniscus. If this glaze composition is used, the circuit will not collapse even when baked at a high temperature of 800°C or higher, and the accuracy of circuit formation by photolithography can be significantly improved, making it possible to manufacture high-performance thermal printer heads. It becomes possible to do so. Therefore, the present invention greatly contributes to the development of industry as a glaze composition for ceramic substrates that eliminates the conventional problems.
Claims (1)
〜１２％、ＣａＯ５〜１５％、ＢａＯ１５〜３０％、Ｓ
ｒＯ０．５〜５％、ＴｉＯ＿２０．５〜５％、ＭｇＯ０
．５〜５％を含有することを特徴とするセラミック基板
用のグレーズ組成物。SiO_245-60%, Al_2O_315 by weight ratio
~12%, CaO5~15%, BaO15~30%, S
rO0.5-5%, TiO_20.5-5%, MgO0
．． A glaze composition for a ceramic substrate, characterized in that it contains 5 to 5%.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19844988A JPH0248428A (en) | 1988-08-09 | 1988-08-09 | Glaze composition for ceramic base plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19844988A JPH0248428A (en) | 1988-08-09 | 1988-08-09 | Glaze composition for ceramic base plate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0248428A true JPH0248428A (en) | 1990-02-19 |
| JPH0471857B2 JPH0471857B2 (en) | 1992-11-16 |
Family
ID=16391285
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19844988A Granted JPH0248428A (en) | 1988-08-09 | 1988-08-09 | Glaze composition for ceramic base plate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0248428A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010500738A (en) * | 2006-04-14 | 2010-01-07 | レイセオン カンパニー | Solid state laser and method with spatially tuned active ion concentration using valence conversion by surface masking |
| WO2012108345A1 (en) * | 2011-02-08 | 2012-08-16 | 旭硝子株式会社 | Glass composition, glass substrate for solar cells using glass composition, and glass substrate for display panel |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS598638A (en) * | 1982-07-06 | 1984-01-17 | Ngk Spark Plug Co Ltd | Glaze composition |
-
1988
- 1988-08-09 JP JP19844988A patent/JPH0248428A/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS598638A (en) * | 1982-07-06 | 1984-01-17 | Ngk Spark Plug Co Ltd | Glaze composition |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010500738A (en) * | 2006-04-14 | 2010-01-07 | レイセオン カンパニー | Solid state laser and method with spatially tuned active ion concentration using valence conversion by surface masking |
| WO2012108345A1 (en) * | 2011-02-08 | 2012-08-16 | 旭硝子株式会社 | Glass composition, glass substrate for solar cells using glass composition, and glass substrate for display panel |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0471857B2 (en) | 1992-11-16 |
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