JPH0248425Y2 - - Google Patents

Description

[Detailed Description of the Invention] (a) Technical Field This invention relates to a wafer support stand for a vacuum evaporation apparatus for vapor depositing metal films on the front and back surfaces of a wafer used as a substrate for semiconductor devices and the like.

(b) Prior art and its disadvantages In a vacuum evaporation system for wafers, the wafer is mounted on a wafer support and the wafer is moved in a planetary motion within the vacuum evaporation system in order to ensure uniform and even deposition. There is. For this purpose, first, as shown in FIG. 2, a large number of wafer supports 2 are arranged and fixed on the inner surface of a planetary support 1 formed in the shape of a paraboloid of revolution. Next, as shown in FIG. 3, this planetary support 1 is rotatably attached around the multiple set rotation frame 3. And this rotating frame 3
At the same time, the peripheral end of the driven disk 4 fixed to the rotating shaft of the planetary support 1 is brought into contact with the annular rail 5 formed along the orbit of the planetary. The support body 1 rotates on its own axis as it revolves and performs planetary motion.

As shown in FIGS. 4 and 5, the wafer support 2 places the wafer 7 on a disk 6 that is fixed slightly floating on the inner surface of the planetary support 1 configured as described above. The orientation flat surface 8 of the wafer 7 is locked and pressed by a hook 11 pulled by a spring 9 and guided by a guide groove 10, and the other side of the wafer 7 is locked with two locking pins 12. supports the wafer 7. The spring 9 is a helical spring arranged on the back side of the disk 6,
One end is locked to a spring hook 13 provided at the center of the back surface of the disc 6, and the other end is bent to integrally form the hook 11. Further, the guide groove 10 is a slit formed in the radial direction from one peripheral end of the disk 6. Therefore, the hook 11 is pulled by the spring 9, guided by the guide groove 10, and tends to move toward the center of the disk 6. Therefore, the wafer 7 is fixed on the wafer support stand 2 by placing the wafer 7 on the disk 6 and pressing the orientation flat surface 8 of the wafer 7 with the hook 11. be able to.

However, the operation flat surface 8 of the wafer 7 placed on the disk 6 is not perpendicular to the guide groove 10, and as shown in FIG. If the wafer 7 is locked at 11, the wafer 7 becomes unstable and easily comes off, so there is a risk that the wafer 7 will fall from the wafer support stand 2 and be damaged during the vacuum deposition operation. Therefore, when the operator attaches the wafer 7 to the wafer support stand 2, it is necessary to ensure that the orientation flat surface 8 aligns with the guide groove 1 accurately.
It must be placed at right angles to the However, in the conventional wafer support 2, since the guide groove 10 is formed only in one place, the operator has to carefully mount the wafer, resulting in poor work efficiency. When the wafer 7 is corrected, the surface of the wafer 7 is scratched due to the contact with the disk 6, resulting in a defective product.

(c) Purpose of the invention This invention was developed in view of the above circumstances, and is a vacuum evaporation device that facilitates the setting of wafers by providing two or more guide grooves at different angles on the disk. The purpose of the present invention is to provide a wafer support stand.

(d) Structure and effect of the invention The wafer support of the vacuum evaporation apparatus of this invention supports the orientation flat surface of a wafer placed on a disk by connecting the other end of a spring with one end fixed to the center of the disk. The wafer is fixed and pressed by a single hook attached and guided by a guide groove, and the other side of the wafer is supported by being fixed at two or more places.
A vacuum evaporation device that causes planetary motion within the vacuum evaporation device is provided with a plurality of guide grooves formed in a radial direction from one circumferential end of the disk within a fan-shaped range with the center of the disk as the center of the fan on the wafer support stand. It is characterized by

When the wafer support base of the vacuum evaporation apparatus of this invention is configured as described above, two or more guide grooves are formed into which a single hook is inserted, and a single hook has two or more guide grooves. It is selectively fitted into one of the guide grooves. Since the hook is biased toward the center of the disk by a spring, in order to securely fix the wafer, the orientation flat surface must align with the direction perpendicular to the direction in which the hook is biased (normal to the disk). The wafer should be placed on the disk as shown. On the other hand, which normal direction of the disc surface the biasing direction of the hook corresponds to is determined by the formation position of the guide groove into which the hook is fitted. That is, the angle formed between the orientation flat surface of the wafer and the biasing direction of the hook is determined by the positional relationship between the orientation flat surface and the guide groove into which the hook is fitted. Therefore, even if the orientation flat surface is slightly tilted when placing the wafer on the disk, the hook can be inserted by selecting the guide groove that provides the most gripping force among the two or more guide grooves. All you have to do is lock the wafer. Therefore, the operator has a wider range of permissible angles when placing the wafer, making it easier to mount the wafer. Therefore, the wafer support stand of the vacuum evaporation apparatus of the present invention not only improves the workability when mounting the wafer, but also eliminates the need to correct the angle after the wafer is placed on the disk, making it easier to mount the wafer. This eliminates scratches on the surface and contributes to improved product yield.

(e) Embodiment FIG. 1 is a plan view of a wafer support stand of a vacuum evaporation apparatus which is an embodiment of this invention.

The wafer support stand of this embodiment has two guide grooves 1
0 and 10 are provided on the disk 16 at slightly different angles. The disk 6 is a table on which the wafer 7 is placed, and is fixed to the inside of the paraboloid of revolution of the planetary support 1 so as to be slightly floating. The guide grooves 10, 10 are slits formed in the radial direction from one peripheral end of the disk 6, and are formed over a length of about half the radius. The angle formed by the two guide grooves 10, 10 is set within an angular range within which the orientation flat surface 8 is allowed to tilt when the wafer 7 is attached. A spring hook 13 is provided at the center of the back side of the disc 6, and one end of the spring 9 is locked. The other end of the spring 9, which is a helical spring, is bent to protrude toward the front side of the disk 6 to form a hook 11. The hook 11 is pulled toward the center of the disk 6 by a spring 9, and engages the orientation flat surface 8 of the wafer 7 placed on the disk 6 by fitting into one of the guide grooves 10, 10. It can be pressed down. Further, on the other side of the circumferential edge of this disk 6, a locking pin 1 with a sufficient angular interval is provided.
2 and 12 are fixed so as to protrude to the front side.

The embodiment shows a case where a metal film such as gold is deposited on the back surface of the wafer 7 in order to process the back surface of the wafer 7. The wafer 7 placed on the disk 6 with its back side up is locked on the other side by locking pins 12, 12, and the orientation flat surface 8 is placed in the guide groove 1.
It is fixed by being locked and pressed by the hook 11 guided at zero. At this time, the guide grooves 10, 10 for guiding the hook 11 are selected to be the one most perpendicular to the orientation flat surface 8 of the wafer 7.

The wafer support stand 2 of the vacuum evaporation apparatus of this embodiment configured as described above has guide grooves 10, 10 in which the hooks 11 for locking the orientation flat surface 8 of the wafer 7 are fitted. Therefore, the allowable range of the inclination angle of the wafer 7 can be determined by adjusting the guide groove 1.
It is possible to expand the number of 0s twice as much as when there is only one 0. This expansion of the allowable range is achieved by the guide groove 10,
When the angle range of 10 is exactly the allowable range angle, it becomes twice the maximum. Therefore, the accuracy of the mounting work for placing the wafer 7 on the disk 6 is relaxed, and the operator's work is facilitated, so that troublesomeness can be eliminated and work efficiency can be improved. In addition, when the wafer 7 is placed on the disk 6, it is almost impossible for the angle to deviate from the permissible range.
Due to the later angle correction, the wafer 7 is brought into contact with the disk 6.
There is no need to worry about scratching the surface of the
It can contribute to improving product yield.

Note that one guide groove 10 may be provided on the perpendicular bisector between the locking pins 12, 12, and a plurality of guide grooves may be provided with this as the axis of symmetry. In this case, the permissible range of the tilt angle of the wafer 7 is further expanded. be able to.

[Brief explanation of the drawing]

FIG. 1 is a plan view of a wafer support stand of a vacuum evaporation apparatus that is an embodiment of this invention, and FIG. 2 is a plan view of a planetary support 1 on which a conventional wafer support stand is arranged.
FIG. 3 is a schematic vertical cross-sectional front view for explaining the internal mechanism of the vacuum evaporation apparatus, FIG. 4 is a plan view of a conventional wafer support, FIG. 5 is a vertical cross-sectional front view of the same wafer support, and FIG. The figure is a plan view when the wafer attached to the wafer support stand is tilted. 7... Wafer, 8... Orientation flat surface, 9... Spring, 10... Guide groove, 11...
Hutsuku.

Claims (1)

[Claims for Utility Model Registration] The orientation flat surface of a wafer placed on a disk is fixed to a spring whose one end is fixed to the center of the disk and the other end of which is guided by a guide groove. In a wafer support stand of a vacuum evaporation apparatus, the wafer is held and pressed by a hook, and the other side of the wafer is supported by locking at two or more places to cause the wafer to perform planetary motion in the vacuum evaporation apparatus. A wafer support stand for a vacuum evaporation apparatus, characterized in that a plurality of grooves are formed in a radial direction from one peripheral end of a disk within a fan-shaped range with the center of the disk as the fan center.