JPH0247801U - - Google Patents
Info
- Publication number
- JPH0247801U JPH0247801U JP12678388U JP12678388U JPH0247801U JP H0247801 U JPH0247801 U JP H0247801U JP 12678388 U JP12678388 U JP 12678388U JP 12678388 U JP12678388 U JP 12678388U JP H0247801 U JPH0247801 U JP H0247801U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- microwave integrated
- circuit boards
- fitting
- conductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 239000004020 conductor Substances 0.000 claims 2
- 239000004809 Teflon Substances 0.000 claims 1
- 229920006362 Teflon® Polymers 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
Description
第1図、第2図はこの考案の一実施例によるM
IC基板接続金具の取付け状態を示す正面図と側
面図、第3図は第1図の−線における断面図
、第4図は基板接続金具の斜視図、第5図、第6
図はこの考案の他の実施例を示す要部拡大断面図
、第7図、第8図は従来のMIC基板接続状態を
示す正面図と側面図、第9図は接続部の斜視図で
ある。
図において1は金属ケース、2,3はMIC基
板a,b、4は基板固定ねじ、5は金リボン、6
はカバー、7はカバー固定ねじ、8は基板接続金
具を示す。なお図中、同一符号は同一、又は相当
部分を示す。
Figures 1 and 2 show an M according to an embodiment of this invention.
A front view and a side view showing the mounting state of the IC board connection fitting, FIG. 3 is a sectional view taken along the - line in FIG. 1, FIG. 4 is a perspective view of the board connection fitting, and FIGS. 5 and 6.
The figure is an enlarged sectional view of the main part showing another embodiment of this invention, FIGS. 7 and 8 are front and side views showing the conventional MIC board connection state, and FIG. 9 is a perspective view of the connection part. . In the figure, 1 is a metal case, 2 and 3 are MIC boards a and b, 4 is a board fixing screw, 5 is a gold ribbon, and 6
7 indicates a cover, 7 indicates a cover fixing screw, and 8 indicates a board connection fitting. In the figures, the same reference numerals indicate the same or equivalent parts.
Claims (1)
回路を構成するマイクロ波集積回路基板接続金具
において、2つのマイクロ波集積回路基板の接続
部に誘電率の低い材質、例えばテフロン〔登録商
標〕の金具を用い、この金具に導体を貼り付け、
2つのマイクロ波集積回路基板の導体部に跨がる
ように押しつけることにより、マイクロ波集積回
路基板間の電気的接続を可能にしたことを特徴と
するMIC基板接続金具。[Claims for Utility Model Registration] In a microwave integrated circuit board connecting fitting that configures an electric circuit using a plurality of microwave integrated circuit boards, the connecting part of two microwave integrated circuit boards is made of a material with a low dielectric constant, For example, use Teflon (registered trademark) metal fittings, attach a conductor to this metal fitting,
A MIC board connection fitting, characterized in that it enables electrical connection between two microwave integrated circuit boards by pressing it across the conductor portions of the two microwave integrated circuit boards.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12678388U JPH0247801U (en) | 1988-09-28 | 1988-09-28 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12678388U JPH0247801U (en) | 1988-09-28 | 1988-09-28 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0247801U true JPH0247801U (en) | 1990-04-03 |
Family
ID=31378613
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12678388U Pending JPH0247801U (en) | 1988-09-28 | 1988-09-28 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0247801U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000091802A (en) * | 1998-09-11 | 2000-03-31 | Matsushita Electric Ind Co Ltd | Microwave circuit |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5326714A (en) * | 1976-08-25 | 1978-03-13 | Nippon Kokan Kk <Nkk> | Fluidized bed heat-treating apparatus for strip |
JPS5641953U (en) * | 1979-09-10 | 1981-04-17 |
-
1988
- 1988-09-28 JP JP12678388U patent/JPH0247801U/ja active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5326714A (en) * | 1976-08-25 | 1978-03-13 | Nippon Kokan Kk <Nkk> | Fluidized bed heat-treating apparatus for strip |
JPS5641953U (en) * | 1979-09-10 | 1981-04-17 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000091802A (en) * | 1998-09-11 | 2000-03-31 | Matsushita Electric Ind Co Ltd | Microwave circuit |
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