JPH02136363U - - Google Patents
Info
- Publication number
- JPH02136363U JPH02136363U JP4475889U JP4475889U JPH02136363U JP H02136363 U JPH02136363 U JP H02136363U JP 4475889 U JP4475889 U JP 4475889U JP 4475889 U JP4475889 U JP 4475889U JP H02136363 U JPH02136363 U JP H02136363U
- Authority
- JP
- Japan
- Prior art keywords
- microwave
- microwave circuit
- board
- metal cover
- dielectric substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 4
- 239000004020 conductor Substances 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Description
第１図は本考案実施例の分解斜視図、第２図は
第１図におけるＡ−Ａ線概略断面図、第３図ａ乃
至ｅは押圧部材の斜視図、第４図は従来技術の概
略断面図である。
１……マイクロ波基板、２……金属カバー、３
……導体ブロツク、５……ネジ、１１……導電膜
、１２……誘電体基板、１３……接地パターン、
１４……マイクロストリツプパターン、１５……
半導体素子、１６……スルーホール、２０……押
圧部材。
Fig. 1 is an exploded perspective view of an embodiment of the present invention, Fig. 2 is a schematic sectional view taken along the line A-A in Fig. 1, Fig. 3 a to e are perspective views of the pressing member, and Fig. 4 is a schematic diagram of the prior art. FIG. 1...Microwave board, 2...Metal cover, 3
... Conductor block, 5 ... Screw, 11 ... Conductive film, 12 ... Dielectric substrate, 13 ... Ground pattern,
14...Microstrip pattern, 15...
Semiconductor element, 16... Through hole, 20... Pressing member.
Claims (1)
路と、このマイクロ波回路の周囲の設けられた接
地パターンと、前記誘電体基板の他方側に設けら
れた導体膜と、前記マイクロ波回路を前記導体膜
に接地するスルーホールと、から成るマイクロ波
基板を前記マイクロ波回路を覆い前記接地パター
ンに接続される金属カバーとともに導体ブロツク
にネジにて接続する構造において、 前記マイクロ波基板の一方側及び前記接地パタ
ーンの内部に接続時前記金属カバーと前記マイク
ロ波基板に接触する押圧部材を設けたことを特徴
とするマイクロ波基板の接続構造。[Claims for Utility Model Registration] A microwave circuit provided on one side of a dielectric substrate, a grounding pattern provided around the microwave circuit, and a conductive film provided on the other side of the dielectric substrate. and a through hole for grounding the microwave circuit to the conductor film, and a structure in which a microwave substrate comprising a metal cover covering the microwave circuit and connected to the ground pattern is connected to a conductor block with screws, A connection structure for a microwave board, characterized in that a pressing member is provided on one side of the microwave board and inside the ground pattern to contact the metal cover and the microwave board during connection.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4475889U JPH02136363U (en) | 1989-04-17 | 1989-04-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4475889U JPH02136363U (en) | 1989-04-17 | 1989-04-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02136363U true JPH02136363U (en) | 1990-11-14 |
Family
ID=31558339
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4475889U Pending JPH02136363U (en) | 1989-04-17 | 1989-04-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02136363U (en) |
-
1989
- 1989-04-17 JP JP4475889U patent/JPH02136363U/ja active Pending