JPH0247061U - - Google Patents
Info
- Publication number
- JPH0247061U JPH0247061U JP1988125863U JP12586388U JPH0247061U JP H0247061 U JPH0247061 U JP H0247061U JP 1988125863 U JP1988125863 U JP 1988125863U JP 12586388 U JP12586388 U JP 12586388U JP H0247061 U JPH0247061 U JP H0247061U
- Authority
- JP
- Japan
- Prior art keywords
- lead terminal
- resin portion
- pellet
- integrated circuit
- external lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988125863U JPH0247061U (enFirst) | 1988-09-26 | 1988-09-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988125863U JPH0247061U (enFirst) | 1988-09-26 | 1988-09-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0247061U true JPH0247061U (enFirst) | 1990-03-30 |
Family
ID=31376845
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988125863U Pending JPH0247061U (enFirst) | 1988-09-26 | 1988-09-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0247061U (enFirst) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0536868A (ja) * | 1991-07-29 | 1993-02-12 | Mitsubishi Electric Corp | 薄型半導体装置 |
-
1988
- 1988-09-26 JP JP1988125863U patent/JPH0247061U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0536868A (ja) * | 1991-07-29 | 1993-02-12 | Mitsubishi Electric Corp | 薄型半導体装置 |