JPH0246987Y2 - - Google Patents
Info
- Publication number
- JPH0246987Y2 JPH0246987Y2 JP1985063479U JP6347985U JPH0246987Y2 JP H0246987 Y2 JPH0246987 Y2 JP H0246987Y2 JP 1985063479 U JP1985063479 U JP 1985063479U JP 6347985 U JP6347985 U JP 6347985U JP H0246987 Y2 JPH0246987 Y2 JP H0246987Y2
- Authority
- JP
- Japan
- Prior art keywords
- pot
- resin
- runner
- plunger
- protrusion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000011347 resin Substances 0.000 claims description 64
- 229920005989 resin Polymers 0.000 claims description 64
- 238000000465 moulding Methods 0.000 claims description 15
- 230000002093 peripheral effect Effects 0.000 claims description 4
- 230000000694 effects Effects 0.000 description 3
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000005580 one pot reaction Methods 0.000 description 2
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000994 depressogenic effect Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985063479U JPH0246987Y2 (US20080094685A1-20080424-C00004.png) | 1985-04-27 | 1985-04-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985063479U JPH0246987Y2 (US20080094685A1-20080424-C00004.png) | 1985-04-27 | 1985-04-27 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61180712U JPS61180712U (US20080094685A1-20080424-C00004.png) | 1986-11-11 |
| JPH0246987Y2 true JPH0246987Y2 (US20080094685A1-20080424-C00004.png) | 1990-12-11 |
Family
ID=30593665
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985063479U Expired JPH0246987Y2 (US20080094685A1-20080424-C00004.png) | 1985-04-27 | 1985-04-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0246987Y2 (US20080094685A1-20080424-C00004.png) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2591474B2 (ja) * | 1994-04-27 | 1997-03-19 | 日本電気株式会社 | モールド金型 |
| JP5341720B2 (ja) * | 2009-11-13 | 2013-11-13 | 積水化成品工業株式会社 | 発泡成形品の成形装置 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS601834A (ja) * | 1983-06-20 | 1985-01-08 | Toshiba Corp | 半導体装置用樹脂封止装置 |
-
1985
- 1985-04-27 JP JP1985063479U patent/JPH0246987Y2/ja not_active Expired
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS601834A (ja) * | 1983-06-20 | 1985-01-08 | Toshiba Corp | 半導体装置用樹脂封止装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61180712U (US20080094685A1-20080424-C00004.png) | 1986-11-11 |
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