JPH0245654U - - Google Patents
Info
- Publication number
- JPH0245654U JPH0245654U JP12503788U JP12503788U JPH0245654U JP H0245654 U JPH0245654 U JP H0245654U JP 12503788 U JP12503788 U JP 12503788U JP 12503788 U JP12503788 U JP 12503788U JP H0245654 U JPH0245654 U JP H0245654U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- semiconductor integrated
- protection element
- ground terminal
- terminal part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 6
- 239000004020 conductor Substances 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
Landscapes
- Semiconductor Integrated Circuits (AREA)
Description
第１図は本考案の実施例を示す平面構造図、第
２図は第１図Ａ部の断面構造図、第３図は等価回
路図であり、１は半導体基体、２は電極端子部、
３，３′は接地端子部、４は半導体集積回路、５
は導電性材料からなる連結体、６は絶縁膜、７，
８は拡散領域である。
FIG. 1 is a plan view showing an embodiment of the present invention, FIG. 2 is a sectional view of section A in FIG. 1, and FIG. 3 is an equivalent circuit diagram, in which 1 is a semiconductor substrate, 2 is an electrode terminal portion,
3 and 3' are ground terminal parts, 4 is a semiconductor integrated circuit, and 5
is a connecting body made of a conductive material, 6 is an insulating film, 7,
8 is a diffusion region.
Claims (1)
形成し、かつ、その外周部に外部入／出力端子に
対応して設けた電極端子部、及びそれに対向して
配置した接地端子部を形成し、両端子部の下方に
保護素子を埋込むごとく形成するとともに、前記
接地端子部間を導電性材料で連結したことを特徴
とする保護素子内蔵型半導体集積回路装置。 A semiconductor integrated circuit is formed in the center of the main surface of a semiconductor substrate, and an electrode terminal part corresponding to an external input/output terminal and a ground terminal part arranged opposite thereto are formed on the outer periphery of the semiconductor integrated circuit, 1. A semiconductor integrated circuit device with a built-in protection element, characterized in that a protection element is formed so as to be buried below both terminal parts, and the ground terminal parts are connected with a conductive material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12503788U JPH0245654U (en) | 1988-09-24 | 1988-09-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12503788U JPH0245654U (en) | 1988-09-24 | 1988-09-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0245654U true JPH0245654U (en) | 1990-03-29 |
Family
ID=31375286
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12503788U Pending JPH0245654U (en) | 1988-09-24 | 1988-09-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0245654U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05129529A (en) * | 1991-10-31 | 1993-05-25 | Nec Corp | Semiconductor input protective device |
| JPH05211292A (en) * | 1992-01-29 | 1993-08-20 | Nec Corp | Semiconductor input protection device |
| JP2011502356A (en) * | 2007-11-01 | 2011-01-20 | エルジー イノテック カンパニー リミテッド | Light emitting device package and manufacturing method thereof |
-
1988
- 1988-09-24 JP JP12503788U patent/JPH0245654U/ja active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05129529A (en) * | 1991-10-31 | 1993-05-25 | Nec Corp | Semiconductor input protective device |
| JPH05211292A (en) * | 1992-01-29 | 1993-08-20 | Nec Corp | Semiconductor input protection device |
| JP2011502356A (en) * | 2007-11-01 | 2011-01-20 | エルジー イノテック カンパニー リミテッド | Light emitting device package and manufacturing method thereof |
| US8217416B2 (en) | 2007-11-01 | 2012-07-10 | Lg Innotek Co., Ltd. | Light emitting device package and method for fabricating the same |