JPH0244555Y2 - - Google Patents

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a chip-shaped electronic component placement device for use when mounting chip-shaped electronic components on a circuit board.

[Prior Art] A template as an electronic component placement device used when automatically mounting chip-shaped electronic components on a circuit board is used to store electronic components in positions corresponding to the placement of electronic components on the electronic circuit board to be manufactured. It has a recess. A typical template is obtained by preparing a plurality of thin plates with holes formed by etching or the like at positions corresponding to the positions where electronic components are to be placed, and stacking these sheets on a substrate. This type of template requires a thin plate with holes formed by etching or the like, so it is not only troublesome to manufacture, but also has the disadvantage of being expensive.

In order to solve this drawback, for example, Japanese Patent Application Laid-Open No. 139496/1983 discloses that a shoe is mounted on the substrate and a cylinder is fixed to the shoe to form a component storage recess.

[Problems to be solved by the invention] By the way, in the template (jig board) disclosed in the above-mentioned publication, both the shoe and the cylindrical body must be prepared, so the number of parts increases, and Assembly becomes troublesome.

In addition, when storing electronic components in the component storage recess of a template, it would be convenient if it could be determined from the back side of the template whether or not electronic components are stored here, but such a template has not yet been proposed. It has not been. Furthermore, it would be advantageous if the attitude of the electronic components in the component storage recesses of the template could be controlled from the back side of the template, but no device has yet been proposed that easily achieves such control.

SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide a chip-shaped electronic component placement device that is easy to manufacture and capable of determining whether components are stored and/or controlling the position of components.

[Means for Solving the Problems] In order to solve the above-mentioned problems and achieve the above-mentioned objects, the present invention is to arrange chip-like electronic parts so as to correspond to the arrangement of the chip-like electronic parts on the electronic circuit board to be manufactured. A device for arranging a chip-shaped electronic component on a placement board, the device having a component storage container arranged on one main surface side of the placement board so as to correspond to the placement of the chip-shaped electronic component on the electronic circuit board. , a through hole extending from one main surface to the other main surface of the arrangement plate is provided, the component storage container has a protrusion for insertion into the through hole of the arrangement plate, and the arrangement plate The positioning of the component storage container is achieved by inserting the protrusion into the through hole of the arrangement plate, and the protrusion is provided with a through hole that communicates with the component storage recess of the component storage container. This relates to a chip-shaped electronic component placement device.

[Function] The through holes provided in the arrangement plate of the above invention function to position and attach the component storage container. The protruding portion of the component storage container also functions as a portion providing a through hole for determining whether or not components are stored and/or controlling component position. The component storage recess communicates with the other main surface (back surface) of the arrangement plate through the through hole. Therefore, it is possible to control the presence or absence of component storage and/or the position of components from the other main surface side of the placement plate.

[Embodiment] Next, a chip-shaped electronic component placement device according to an embodiment of the present invention will be described with reference to FIGS. 1 to 9.

7 to 9 show the principle of a chip-shaped electronic component placement device, that is, a template 1, and a method of manufacturing an electronic circuit board using the same. The template 1 consists of a metal arrangement plate 2 made of iron or aluminum, and a plurality of component storage containers 3. A component storage recess 4 is provided in the component storage container 3. This component storage recess 4 is a portion that accommodates a chip-shaped electronic component 5. The electronic circuit board device to be manufactured has components 5 mounted at predetermined positions on a circuit board 6, as shown in FIG. Since the template 1 is for obtaining the circuit board device shown in FIG. 9, the component storage recesses 4 are arranged to correspond to the positions of the components 5 in FIG.

When manufacturing the circuit board device shown in FIG. 9 using the template 1 shown in FIG. 7, the template 1 and the circuit board 6 are overlapped as shown in FIG.
Component 5 of template 1 is transferred to circuit board 6. Note that the component 5 can be temporarily fixed to the circuit board 6 by applying an adhesive to a predetermined location on the circuit board 6.

Next, the template 1 will be explained in detail with reference to FIGS. 1 to 6. The arrangement plate 2 is provided with two through holes 7 and 8 corresponding to one component storage container 3. The component storage container 3 is formed by zinc die casting and has two protrusions 9 and 10 for insertion into the through holes 7 and 8 of the arrangement plate 2. One of the protrusions 9 has a through hole 1 leading to the component storage recess 4.
1 is provided. That is, a through hole 11 is provided in the protrusion 9 so as to extend from the bottom surface 12 of the component storage recess 4 located on one main surface side of the arrangement plate 2 to the other main surface side of the arrangement plate 2.

The bottom surface 12 of the component storage recess 4 is formed into an inclined surface of about 15 degrees to help the component 5 fall in a predetermined direction. In this embodiment, the component 5 is a cylindrical capacitor, and the bottom surface 12 of the cylindrical component 5 is inclined along the axial direction. Further, the bottom surface 12 is formed to have a U-shaped cross section as shown in FIG. 5 so as to fit the cylindrical component 5.
The through hole 11 of the protrusion 9 is provided at a position shifted to the left from the center of the bottom surface 12. When the through hole 11 is provided at such a position, the posture of the component 5 can be easily controlled by vacuum suction using the through hole 11.

Attachment of the component storage container 3 to the arrangement plate 2 is achieved by inserting the protrusions 9 and 10 into the through holes 7 and 8 and fixing them with an adhesive (not shown).

Template 1 of this embodiment has the following advantages.

(1) Since the template 1 is obtained by attaching the molded component storage container 3 to the arrangement plate 2, the template 1 can be manufactured extremely easily and at low cost.

(2) Since the arrangement plate 2 is provided with the through hole 7, and the protruding portion 9 is also provided with the through hole 11, the component storage recess 4 also serves as the attachment portion of the component storage container 3.
It is possible to obtain a through hole 11 that reaches .

(3) The through hole 11 is located on the other main surface (back surface) of the arrangement plate 2.
Since it communicates with the component storage recess 4 from the side, it does not interfere with the supply of components 5 to the component storage recess 4 on one main surface side of the arrangement board 2 and the movement of the components 5 from the component storage recess 4 to the circuit board 6. As such, the attitude of the component 5 can be controlled from the other main surface side of the placement plate 2 by vacuum suction or the like. Further, since the through hole 11 is located below the inclined bottom surface 12 of the component storage recess 4, the component 5 can be easily tilted in a predetermined direction by vacuum suction.

(4) The presence or absence of the component 5 in the component storage recess 4 can be determined through the through hole 11.

(5) Since the bottom surface 12 of the component storage recess 4 is inclined, the components 5 can be tilted in a certain direction.

(6) Since the bottom surface 12 of the component storage recess 4 is U-shaped, the component 5 can be positioned accurately.

(7) Since the component storage container 3 is made of zinc die-casting, it is not only easy to manufacture, but also prevents static electricity.

[Modifications] The present invention is not limited to the above-described embodiments, but can be modified as follows, for example.

(1) The component storage container 3 may be a molded body of synthetic resin such as ABS, and the surface thereof may be provided with a metal plating layer for preventing static electricity such as nickel or chrome, or a thin electrical layer such as carbon.

(2) Instead of fixing the component storage container 3 with adhesive, it may be fixed only by fitting the protrusions 9 and 10, or by caulking, or by screws.

(3) Only one protrusion 9 is provided, and the other protrusion 1
The configuration may be such that 0 is omitted. Note that when only one protrusion 9 is provided, it is desirable to form it in the shape of a square column or an elliptical column in order to obtain directionality.

(4) Through holes may be provided in both of the protrusions 9 and 10.

(5) The through hole 11 is used to determine the presence or absence of the component 5, and a hole for sucking the component 5 may be provided separately.

(6) The bottom surface 12 of the component storage recess 4 is not limited to a U-shape, but may be V-shape or flat for square chips.

(7) In addition to using the through hole 11 to suck the component 5, compressed gas may be applied to the component 5 through the through hole 11 when the component 5 is transferred to the circuit board 6.

(8) A rod may be inserted into the through hole 11 to control the posture of the component 5 or to move the component 5 to the circuit board 6.

[Effects of the Invention] As is clear from the above, according to the present invention, it is possible to reduce the cost of a chip-shaped electronic component placement device used when mounting components on a circuit board. Further, since the protrusion has a through hole, the through hole can be used to easily control the position of the component and/or determine the presence or absence of the component.

[Brief explanation of the drawing]

Fig. 1 is a sectional view showing a part of the template of the embodiment of the present invention, Fig. 2 is a front view showing the parts storage container, Fig. 3 is a plan view of the parts storage container, and Fig. 4 is a diagram of the parts storage container. A bottom view, FIG. 5 is a sectional view taken along the - line in FIG. 3, FIG. 6 is a sectional view of the arrangement plate, FIG. 7 is a partially cutaway front view of the template, and FIG. A front view showing the state
FIG. 9 is a front view of the circuit board device. DESCRIPTION OF SYMBOLS 1...Template, 2...Arrangement board, 3...Component storage container, 4...Component storage recess, 5...Electronic component, 6...Circuit board, 7, 8...Through hole, 9, 1
0...Protrusion, 11...Through hole, 12...Bottom surface.

Claims (1)

[Claims for Utility Model Registration] [1] An apparatus for arranging chip-like electronic components on a placement board so as to correspond to the arrangement of the chip-like electronic components on an electronic circuit board to be manufactured, which comprises: A component storage container is arranged on one main surface side of the arrangement plate so as to correspond to the arrangement of the chip-shaped electronic components on the board, and a through hole is provided from one main surface to the other main surface of the arrangement plate. a hole is provided, the component storage container has a protrusion for insertion into the through hole of the placement plate, and positioning of the component storage container with respect to the placement plate is performed through the through hole of the placement plate. A chip-shaped electronic component arrangement device, which is achieved by inserting a protrusion, and the protrusion is provided with a through hole communicating with a component storage recess of the component storage container. [2] The chip-shaped electronic component arrangement device according to claim 1, wherein the bottom surface of the component storage recess is formed to be inclined. [3] The chip-shaped electronic component placement device according to claim 1, wherein the component storage container is a zinc container. [4] The chip-shaped electronic component arrangement device according to claim 1, wherein the component storage container is a synthetic resin container having a conductive film for preventing static electricity on the surface thereof.