JPH0244370U - - Google Patents
Info
- Publication number
- JPH0244370U JPH0244370U JP12385788U JP12385788U JPH0244370U JP H0244370 U JPH0244370 U JP H0244370U JP 12385788 U JP12385788 U JP 12385788U JP 12385788 U JP12385788 U JP 12385788U JP H0244370 U JPH0244370 U JP H0244370U
- Authority
- JP
- Japan
- Prior art keywords
- spacer
- ground structure
- frame ground
- metal substrate
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002184 metal Substances 0.000 claims description 15
- 239000000758 substrate Substances 0.000 claims description 12
- 125000006850 spacer group Chemical group 0.000 claims 7
- 238000005476 soldering Methods 0.000 claims 2
- 239000000463 material Substances 0.000 claims 1
Landscapes
- Insulated Metal Substrates For Printed Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1988123857U JPH0648902Y2 (ja) | 1988-09-20 | 1988-09-20 | 金属基板のフレームグランド構造 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1988123857U JPH0648902Y2 (ja) | 1988-09-20 | 1988-09-20 | 金属基板のフレームグランド構造 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0244370U true JPH0244370U (US20100223739A1-20100909-C00025.png) | 1990-03-27 |
JPH0648902Y2 JPH0648902Y2 (ja) | 1994-12-12 |
Family
ID=31373092
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1988123857U Expired - Lifetime JPH0648902Y2 (ja) | 1988-09-20 | 1988-09-20 | 金属基板のフレームグランド構造 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0648902Y2 (US20100223739A1-20100909-C00025.png) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008294234A (ja) * | 2007-05-24 | 2008-12-04 | Densei Lambda Kk | 回路基板及び回路基板の製造方法 |
JP2009267174A (ja) * | 2008-04-25 | 2009-11-12 | Tdk-Lambda Corp | メタルコア基板の導通構造 |
Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4967948U (US20100223739A1-20100909-C00025.png) * | 1972-09-26 | 1974-06-13 | ||
JPS5461256U (US20100223739A1-20100909-C00025.png) * | 1977-10-07 | 1979-04-27 | ||
JPS57594U (US20100223739A1-20100909-C00025.png) * | 1980-05-29 | 1982-01-05 | ||
JPS5749432U (US20100223739A1-20100909-C00025.png) * | 1980-09-04 | 1982-03-19 | ||
JPS5754305U (US20100223739A1-20100909-C00025.png) * | 1980-09-11 | 1982-03-30 | ||
JPS5836619U (ja) * | 1981-09-04 | 1983-03-10 | ポツプリベツト・フアスナ−株式会社 | ブラインドナツト |
JPS58138368U (ja) * | 1982-03-13 | 1983-09-17 | 株式会社フジクラ | ほうろう基板 |
JPS59146607U (ja) * | 1983-01-19 | 1984-10-01 | ポツプリベツト・フアスナ−株式会社 | ブラインドナツト |
JPS6147243A (ja) * | 1984-08-11 | 1986-03-07 | 松下電工株式会社 | 金属ベ−ス積層板 |
JPS6335809U (US20100223739A1-20100909-C00025.png) * | 1986-08-22 | 1988-03-08 | ||
JPS6377188A (ja) * | 1986-09-19 | 1988-04-07 | 松下電工株式会社 | 金属ベ−スプリント配線板 |
-
1988
- 1988-09-20 JP JP1988123857U patent/JPH0648902Y2/ja not_active Expired - Lifetime
Patent Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4967948U (US20100223739A1-20100909-C00025.png) * | 1972-09-26 | 1974-06-13 | ||
JPS5461256U (US20100223739A1-20100909-C00025.png) * | 1977-10-07 | 1979-04-27 | ||
JPS57594U (US20100223739A1-20100909-C00025.png) * | 1980-05-29 | 1982-01-05 | ||
JPS5749432U (US20100223739A1-20100909-C00025.png) * | 1980-09-04 | 1982-03-19 | ||
JPS5754305U (US20100223739A1-20100909-C00025.png) * | 1980-09-11 | 1982-03-30 | ||
JPS5836619U (ja) * | 1981-09-04 | 1983-03-10 | ポツプリベツト・フアスナ−株式会社 | ブラインドナツト |
JPS58138368U (ja) * | 1982-03-13 | 1983-09-17 | 株式会社フジクラ | ほうろう基板 |
JPS59146607U (ja) * | 1983-01-19 | 1984-10-01 | ポツプリベツト・フアスナ−株式会社 | ブラインドナツト |
JPS6147243A (ja) * | 1984-08-11 | 1986-03-07 | 松下電工株式会社 | 金属ベ−ス積層板 |
JPS6335809U (US20100223739A1-20100909-C00025.png) * | 1986-08-22 | 1988-03-08 | ||
JPS6377188A (ja) * | 1986-09-19 | 1988-04-07 | 松下電工株式会社 | 金属ベ−スプリント配線板 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008294234A (ja) * | 2007-05-24 | 2008-12-04 | Densei Lambda Kk | 回路基板及び回路基板の製造方法 |
JP2009267174A (ja) * | 2008-04-25 | 2009-11-12 | Tdk-Lambda Corp | メタルコア基板の導通構造 |
Also Published As
Publication number | Publication date |
---|---|
JPH0648902Y2 (ja) | 1994-12-12 |