JPH0242591B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention involves running a metal strip material such as an aluminum base material, mechanical treatment such as graining treatment, electrochemical treatment such as anodic oxidation and plating, and subsequent coating material such as photosensitive liquid. The present invention relates to a joining method and apparatus for coating and drying.

Regarding the joining method when applying webs such as photographic film base materials, in order to apply the coating material on the web while connecting the webs, when joining the webs, the joining is done by butt joining, and tape is applied to the joining part. , the tape is in the longitudinal direction of the web
JP-A-50-40638 discloses a web joining method characterized in that the webs are attached so as to form an angle in the range of (1) 30° to 75° or (2) 105° to 150°. has been done.

However, although this method has advantages as a joining method when coating webs such as photographic film substrates, it does not cause failures in the subsequent coating process.
The method of joining metal strip materials such as aluminum base materials, to which the present invention is applied, has the following drawbacks and cannot be applied, including other conventional techniques.

(1) In a mechanical treatment process such as graining, the rotation of the brushing head turns up the joint tape, damaging the joint and causing it to break.

(2) Butt joining or simple overlapping joining results in incomplete electrical joining, which interrupts electrochemical processing such as anodizing and plating.

(3) Mechanical processing such as graining, electrochemical processing such as anodic oxidation plating, and subsequent coating and drying processes for coating materials such as photosensitive liquid, over long periods of time. Since high tension and high shear forces are repeatedly applied, it cannot withstand this sufficiently, and breakage occurs frequently during the process.

(4) Complex mechanisms are required when automating.

(5) It is difficult to join in a short time.

(6) It is difficult to design a device that can automatically perform accurate joining.

Therefore, an object of the present invention is to continuously feed a metal strip material such as an aluminum base material from a coiled state and run it while performing mechanical processing such as graining and electrochemical processing such as anodizing and plating. In the case of continuous processing and subsequent application and drying of coating materials such as photosensitive liquids, high tension and high tension can be applied to the bonding between coils without damage due to rotation of the brushing head and without loss of conductivity. It is an object of the present invention to provide a method and apparatus for joining metal strip-like materials that can withstand sustained and repeated high shearing forces, do not cause coating failures in subsequent steps, and can be accurately and automatically performed in a short period of time.

On the other hand, overlap bonding of webs using adhesive tape or heat-sensitive tape and ultrasonic bonding of aluminum substrates are conventional bonding techniques, but the former loses electrical conductivity and is susceptible to detachment due to chemical liquid. Wake up,
Although the latter can maintain conductivity, it cannot withstand sustained high tension and high shear force, even when ultrasonic bonding is applied to multiple strips, and fractures occur frequently at the joint, and both methods require brushing. Contact rotation of the head sometimes caused the joining tape or joint to curl up, leading to breakage.

The present inventors combined these conventional methods under special conditions and combined them with a new configuration to achieve the above object. That is, the above-mentioned object of the present invention is to overlap the base materials so that the rotation of the brushing head in the post-processing is in the forward direction, and to apply at least one strip of ultrasonic bonding over the entire width and the inside of the overlap using double-sided adhesive tape. A method for joining metal strip materials by combining the following joining methods, and a method for joining metal strip materials, comprising a device for holding and moving the tip of a new coil, a device for cutting the rear end of the old coil, and a device for holding and moving the rear end. This is achieved by a joining device for metal strip materials, in which the device and the holding and moving device at the rear end each have positions that do not interfere with their movements.

Below, the content of the present invention will be explained in more detail with reference to the drawings.

In Fig. 1, the rear end 1 of the web sent out from the old coil is overlapped with the leading end 2 of the web sent out from the new coil, and the ends are covered and joined with one-sided adhesive tape 3. This is the joining method that has traditionally been used, and in Japanese Patent Application Laid-Open No. 1983-40638, as shown in FIG. , it is proposed to apply tape 3 to the joint part so that the tape forms an angle within the range of (1) 30° to 75° or (2) 105° to 150° with respect to the longitudinal direction of the web. has been done.

However, with conventional bonding methods, including those illustrated in FIGS. 1 and 2, (1) electrical conductivity cannot be maintained as described above. (2) Cannot withstand sustained or repeated high tension and high shear forces over long processes. (3) Poor workability. (4) Difficult to automate. (5) Occurrence of coating failure. In addition, when graining treatment by brushing is performed in a later step, the following disadvantages occur.

That is, in FIG. 3, a brushing head 8 made of metal bristles or nylon bristles implanted on the cylindrical surface of a cylindrical rotating roller 7 is pressed against the application surface of a band-shaped metal plate moving in the direction of an arrow 6. It is rotated in the direction of arrow 9 to mechanically grain the surface. This graining treatment is performed to increase the hydrophilicity of the metal plate surface, and in addition to using the above-mentioned brushing head 8, it can also be performed by a liquid honing method or a sandblasting method.
As shown in FIG. 3, when brushing is performed using the brushing head 8, for example, the joint portion 10 is connected to the joint tape 3 due to the direction of movement and direction of rotation.
Otherwise, the rear end 1 of the metal web often curls up, damaging the joint and causing breakage later.

In FIGS. 4 and 5 showing the joining method of metal strip materials according to the present invention, the rear end 1 of the web sent out from the old coil and the new This is due to the fact that the leading end 2 of the web sent out from the coil is overlapped as shown in Fig. 4, and a single ultrasonic welding part 4 covering at least the entire width is combined with the joining inside the overlap using double-sided adhesive tape 5. The bonding method is superior in (1) electrical conductivity and (2) durability compared to the conventional bonding method described with reference to FIGS. It is highly practical in terms of high tensile strength and durability, (3) workability, (4) automation, and (5) prevention of coating failures, and can also be grained by brushing in the subsequent process. In this case, the above-mentioned disadvantages can be prevented as described below.

That is, in FIG.
Since the rotation is in the forward direction with respect to the joint 10', there is no need to turn up the leading end of the joint tape or web, thereby eliminating the inconvenience of damaging the joint and making it more likely to break.

In FIGS. 7 to 10 showing the outline of the metal strip material joining apparatus according to the present invention, the old coil 11
The web 14 from the old coil 11 is sent out to the subsequent process from the so-called delivery turret 13 that carries the new coil 12 and the new coil 12, passing through the metal strip material joining device section. 2 is held by a holding and moving device 15 at the tip. In the web tip holding and moving device 15, 16 is a rotating shaft, 17 is a swing arm, and 18
is a suction table. 19 is a path roller movable by the air cylinder 20, 21 is a path roller movable together with the swing arm 17, 22 is also a movable path roller, and 23 and 24 are fixed path rollers.

25 is a holding and moving device for the rear end of the old coil, which is composed of a drive cylinder 26 and a suction table 27. The suction table 27 is connected to the drive cylinder 2.
6, it moves up and down along guide bars 28, 28'. 29 is a cutting device for the rear end of the old coil, 30 is its rotating cutting blade, 31 is an ultrasonic seam joining device,
32 is its rotary welding head. 33 is a clamp cylinder, which is a holding and moving device 2 for the rear end of the old coil.
It has 5 auxiliary operation functions.

In FIGS. 7 and 8, the new coil tip 2, which has been cut diagonally in advance, is attracted to the suction table 18 of the web tip holding and moving device 15 and is in a waiting state. Adhesive tape 5 is pasted on the back side, and preparation for joining is completed.

In FIG. 11, the holding and moving device 25 for the rear end of the old coil is activated by the operator's operation with a small amount of the waste portion left in the old coil 11. That is, the suction table 2 is moved by the drive cylinder 26.
7 rises and reaches the running surface of the web, and at the same time attracts the web, the clamp cylinder 33 works to hold the web. Next, the rotary cutting blade 30 of the old coil cutting device 29 runs to cut the web, and while holding the old coil rear end 1, the remaining part of the old coil is rewound in the direction of arrow A and then discarded.

Next, in FIG. 12, while holding the rear end part 1 of the old coil, the holding and moving device 2 for the rear end of the old coil
5, the movable pass roller 22 descends, and while continuing to hold the web tip 2, the web tip holding and moving device 15 pivots in the direction of arrow B around the rotating shaft 16 and rises to the joint surface. do. In FIG. 13, the web tip holding and moving device 15
When the web reaches the joint surface, the holding and moving device 25 at the rear end of the web also rises and reaches the joint surface. In this state, the rotary head 32 of the ultrasonic bonding device 31 rotates while being driven by ultrasonic waves, and connects the rear end 1 of the old coil and the front end 2 of the new coil as shown in FIGS. 4 and 5. Ultrasonic bonding is performed in the form shown in .

In FIGS. 12 and 13, the vertical relationship between the old coil rear end 1 and the new coil front end 2 is reversed,
In particular, in FIG. 12, the holding and moving device 25 at the rear end of the web is in a retracted state so as not to get in the way of the turning path B of the holding and moving device 15 at the leading end of the web, that is, the movements of the holding and moving device 15 at the leading end of the web are not obstructed. It is a feature of the device of the present invention that each device has its own position. Further, as the holding and moving device 25 for the trailing end of the web is moved upward in FIG. 13, the double-sided adhesive tape 5 is used to join the webs inside the stack.

As shown in FIG. 14, the web leading end holding/moving device 15, the web trailing end holding/moving device 25, and the movable pass roller 22 return to their original positions, and the movable pass roller 19 rises to secure the pass line. .
The delivery turret then rotates. When the web is further fed out, the remaining amount is reduced, and new coils are added, the state shown in FIG. 7 is reached.

The present invention is particularly effective when used in the manufacturing process of photosensitive planographic printing plates. i.e. for example 0.15mm thick
A 2S aluminum plate was degreased by immersing it in a 10% aqueous solution of tribasic sodium phosphate kept at 80℃ for 3 minutes, then grained with a nylon brush, etched with sodium aluminate at 60℃ for about 10 seconds, and then After desmutting with a 3% aqueous solution of sodium hydrogen sulfate, this aluminum plate was further anodized in 20% sulfuric acid at 2 A/dm ² for 2 minutes, and then silicate treated with a 2.5% aqueous solution of sodium silicate at 70°C for 1 minute. This method and apparatus are optimal as a bonding method and apparatus for the manufacturing process of photosensitive lithographic printing plates, in which the process of coating and drying is carried out while continuously running a strip-shaped aluminum plate.
In this manufacturing process, photosensitive liquids include, for example, a photosensitive composition consisting of a diazo resin and a silicone resin (Japanese Patent Application Laid-Open No. 47-24404), a photosensitive composition consisting of a poly(hydroxyethyl methacrylate) and a diazo resin, a diazo resin and a soluble polyamide resin (U.S. Pat. No. 3751257), azide photoreceptor and epoxy resin (US Pat. No. 2852379)
photosensitive resins, such as azide photosensitive materials, diazo resins, etc., which have unsaturated double bonds in their molecules and which undergo a dimerization reaction and become insolubilized by irradiation with actinic rays, such as polyvinyl cinnamate; For example, British Patent No. 843545, British Patent No. 966297, and US Patent No. 2725372.
Derivatives of polyvinyl cinnamate described in the specifications of Canadian Patent No. 696997, bisphenol A and divanyl cyclohexanone, P-phenylene diethoxy acrylate and 1 as described in Canadian Patent No. 696997. , 4-di-β-hydroxyethoxycyclohexanone, prepolymers of diallyl phthalate as described in U.S. Pat. Ethylene-based saturated compounds that have a bond and cause a polymerization reaction when irradiated with actinic rays, such as unsaturated esters of polyols such as those described in Japanese Patent Publication No. 35-8495, such as ethylene di(meth)acrylate, diethylene glycol di (meth)acrylate, glycerol di(meth)acrylate, glycerol tri(meth)acrylate, ethylene dimethacrylate, 1,3-propylene di(meth)acrylate, 1,4-cyclohexanediol(meth)acrylate, 1,4 -benzenediol di(meth)acrylate, pentaerythritol tetra(meth)acrylate, 1,
3-propylene glycol di(meth)acrylate, 1,5-pentadiol di(meth)acrylate, pentaerythritol tri(meth)acrylate, bisacrylate and methacrylate of polyethylene glycol with a molecular weight of 50 to 500, unsaturated amides, especially α- Amides of methylenecarboxylic acids and especially α,ω-diamines and ω-diamines with intermediate oxygen, such as methylene bis(meth)acrylamide and diethylenetriamine tris(meth)acrylamide, divinyl succinate, divinyl adibate, divinyl phthalate. , divinyl terephthalate, divinylbenzene-1,3 disulfonate, etc. and a suitable binder such as polynyl alcohol or a derivative of cellulose containing a carboxy group in the side chain such as polynyl hydrogen phthalate, carboxymethyl cellulose, or methyl methacrylate. A photosensitive composition comprising a copolymer of methacrylic acid is useful as a negative working type photosensitive composition that becomes insoluble by the action of actinic rays. O-diazooxide photosensitive materials such as those described in U.S. Patent Nos. 3,635,709, 3,061,430, and 3,061,120, phosphotungstate of diazo resin (Japanese Patent Publication No. 39-7663), yellow blood of diazo resin A photosensitive composition comprising a salt (US Pat. No. 3,113,023), a diazo resin, and polyvinyl hydrogen phthalate (Japanese Patent Application No. 18812/1972) is useful as a positively working type photosensitive material. Also, U.S. Patent No. 3,081,168,
Also useful are photosensitive compositions containing linear polyamides and monomers having addition-polymerizable unsaturated bonds, such as those described in Japanese Patent Nos. 3486903, 3512971, and 3615629.

Particularly useful photosensitive compositions include JP-A-47-
24404, a composition comprising a diazo resin and a hydroxyethyl methacrylate copolymer, and a composition comprising a diazo resin and a hydroxyethyl methacrylate copolymer as shown in JP-A-50-118802, US Pat.
Examples thereof include a composition comprising an esterified product of naphthoquinonediazide sulfonic acid and pyrogallol-acetone resin and a novolac resin as shown in No. 3635709.

In addition, these photosensitive liquids generally have a viscosity of 1 to 10 cps.
It is prepared so that

Drying is carried out with heated air. Heating is preferably in the range of 30°C to 200°C, particularly 40°C to 140°C. In addition to a method in which the drying temperature is kept constant during drying, a method in which it is increased stepwise can also be implemented.

Also, results may be obtained by dehumidifying the dry air. The heated air is directed against the coated surface.
It is suitable to supply at a rate of 0.1 m/sec to 30 m/sec, particularly 0.5 m/sec to 20 m/sec.

When the method for joining metal strip materials according to the present invention is used in the manufacturing process of photosensitive printing plates as described above,
It has the following advantages.

(1) Since the joints overlap in the forward direction relative to the rotation of the brushing head, the joints will not be damaged or broken during the graining process.

In addition, since the distance between the rear end of the web and the double-sided adhesive tape is short, in the case of light graining, the bonded portion will not be damaged and break when graining both sides of the web.

(2) Since the joint is ultrasonic bonded, conductivity is maintained and the continuity of the anodizing process is maintained during the anodizing process.

(3) The combination of ultrasonic bonding and bonding within the stack using double-sided adhesive tape can withstand sustained or repeated high tension and high shear forces without causing breakage.

(4) Since the diagonal joint is used, the frequency of thickness change and the degree of thickness change are relatively small, so the application area is not disturbed during the application of the photosensitive liquid as described above, and therefore the application is easy when passing through the joint. Suji,
No coating defects such as uneven coating or pinholes occur. The angle of the diagonal joint is relative to the longitudinal direction of the web when the web running speed is 25 m/min.
Preferably around 85°.

Further, the metal strip material joining apparatus according to the present invention includes:
Similarly, when used in the manufacturing process of photosensitive printing plates as described above, it has the following advantages: (1) The metal strip material according to the present invention can be used in a relatively simple structure in a large-scale manufacturing facility. The following joining methods can be implemented.

(2) A simple mechanism allows automatic and accurate joining.

(3) Bonding work can be carried out in a short time. In addition, the seventh
During the bonding operation described with reference to FIGS. 1 to 14, a so-called reservoir device is operated, so that the photosensitive printing plates can be manufactured without interruption thereafter.

The present invention is not limited to the examples of the present invention, and various embodiments are possible based on the idea of the present invention and within its technical scope. In particular, the apparatus for joining metal strip materials according to the present invention can have various configurations in addition to the one shown in the figures. Furthermore, the term "one line" described in the present invention refers to a continuous line. This shall include both cases of intermittent operation.

[Brief explanation of the drawing]

Figures 1 and 2 are side views showing a method of joining belt-shaped materials commonly used in the past, Figure 3 is an imaginary diagram of the joints formed by these conventional methods and subjected to a brushing process, and Figure 4 is an illustration of the present invention. FIG. 5 is a plan view thereof, and FIG. 6 is an imaginary view of the bonded portion according to the present invention passing through a brushing process. FIG. 7 is a side view showing an outline of the metal strip material joining apparatus according to the present invention, FIG. 8 is a front view seen from the plane A-A' in FIG. 7, and FIG.
It is a front view seen from the figure B-B' plane. FIG. 10 is a plan view taken from the plane C-C' in FIG. 7. Further, FIGS. 11 to 14 are side views showing the operation of the metal strip material joining apparatus according to the present invention, the outline of which is shown in FIGS. 7 to 10. 1...Rear end of the web, 2...Top end of the web, 3
...Joining tape, 4...Ultrasonic bonding part, 5...Double-sided adhesive tape, 8...Brushing head, 10, 10'
...Joint part, 11...Old coil, 12...New coil, 1
3... Delivery turret, 14... Web, 15... New coil tip holding and moving device, 17... Swing arm, 18... Suction table, 25... Old coil rear end holding and moving device, 27... Suction table, 29... Old A cutting device for the rear end of the coil, 31... an ultrasonic seam joining device.

Claims (1)

[Claims] 1. The new coil tip 2 and the old coil rear end 1 are overlapped so that the rotary brushing head that is post-processing is on the tip side of the new coil, and a single line of ultrasonic welding is performed over the entire width. 4. A method for joining metal strip materials for lithographic printing plates, which comprises forming a part 4 and then joining the two-sided adhesive tape 5 inside the overlap with a double-sided adhesive tape 5 substantially parallel to the ultrasonic weld part 4. 2. In a metal strip material welding device including a holding and moving device 15 for the front end of a new coil, a cutting device 29 for the rear end of the old coil, and a holding and moving device 25 for the rear end, the holding and moving device 15 for the tip end rotates. It has a swing arm 17 of the type, and a holding and moving device 25 at the rear end.
1. A welding device for metal strip-shaped materials, which has an upper and lower cylinder 26, and is arranged so that when the swing arm 17 swings, the upper and lower cylinders 26 are in a lowered position and are at a position away from a swing path B.