JPH0242470U - - Google Patents
Info
- Publication number
- JPH0242470U JPH0242470U JP12077088U JP12077088U JPH0242470U JP H0242470 U JPH0242470 U JP H0242470U JP 12077088 U JP12077088 U JP 12077088U JP 12077088 U JP12077088 U JP 12077088U JP H0242470 U JPH0242470 U JP H0242470U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- copper foil
- exposed
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 9
- 239000011889 copper foil Substances 0.000 claims description 5
- 238000010586 diagram Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Combinations Of Printed Boards (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12077088U JPH0242470U (es) | 1988-09-15 | 1988-09-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12077088U JPH0242470U (es) | 1988-09-15 | 1988-09-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0242470U true JPH0242470U (es) | 1990-03-23 |
Family
ID=31367177
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12077088U Pending JPH0242470U (es) | 1988-09-15 | 1988-09-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0242470U (es) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005216915A (ja) * | 2004-01-27 | 2005-08-11 | Seiko Epson Corp | 実装構造体、実装構造体の製造方法、電気光学装置および電子機器 |
| JP2016146230A (ja) * | 2016-03-14 | 2016-08-12 | 大日本印刷株式会社 | サスペンション用フレキシャー基板、サスペンション、ヘッド付サスペンション、ハードディスクドライブ、およびサスペンション用フレキシャー基板の製造方法、ならびに検査方法 |
-
1988
- 1988-09-15 JP JP12077088U patent/JPH0242470U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005216915A (ja) * | 2004-01-27 | 2005-08-11 | Seiko Epson Corp | 実装構造体、実装構造体の製造方法、電気光学装置および電子機器 |
| JP2016146230A (ja) * | 2016-03-14 | 2016-08-12 | 大日本印刷株式会社 | サスペンション用フレキシャー基板、サスペンション、ヘッド付サスペンション、ハードディスクドライブ、およびサスペンション用フレキシャー基板の製造方法、ならびに検査方法 |