JPS6371578U - - Google Patents
Info
- Publication number
- JPS6371578U JPS6371578U JP16703686U JP16703686U JPS6371578U JP S6371578 U JPS6371578 U JP S6371578U JP 16703686 U JP16703686 U JP 16703686U JP 16703686 U JP16703686 U JP 16703686U JP S6371578 U JPS6371578 U JP S6371578U
- Authority
- JP
- Japan
- Prior art keywords
- copper foil
- resist layer
- solder resist
- foil land
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 239000011889 copper foil Substances 0.000 claims description 4
- 230000002093 peripheral effect Effects 0.000 claims 1
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16703686U JPS6371578U (es) | 1986-10-30 | 1986-10-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16703686U JPS6371578U (es) | 1986-10-30 | 1986-10-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6371578U true JPS6371578U (es) | 1988-05-13 |
Family
ID=31098587
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16703686U Pending JPS6371578U (es) | 1986-10-30 | 1986-10-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6371578U (es) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013031258A1 (ja) * | 2011-09-01 | 2013-03-07 | 住友電装株式会社 | プリント基板 |
-
1986
- 1986-10-30 JP JP16703686U patent/JPS6371578U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013031258A1 (ja) * | 2011-09-01 | 2013-03-07 | 住友電装株式会社 | プリント基板 |