JPH0242467U - - Google Patents

Info

Publication number

JPH0242467U

JPH0242467U JP12194988U JP12194988U JPH0242467U JP H0242467 U JPH0242467 U JP H0242467U JP 12194988 U JP12194988 U JP 12194988U JP 12194988 U JP12194988 U JP 12194988U JP H0242467 U JPH0242467 U JP H0242467U

Authority

JP

Japan

Prior art keywords

metal substrate

integrated circuit

hybrid integrated

metal

substrate

Prior art date

1988-09-16

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

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• 229910052751 metal Inorganic materials 0.000 claims description 12
• 239000002184 metal Substances 0.000 claims description 12
• 239000000758 substrate Substances 0.000 claims description 12
• 238000007747 plating Methods 0.000 claims description 6
• 239000011347 resin Substances 0.000 claims description 3
• 229920005989 resin Polymers 0.000 claims description 3
• 239000004065 semiconductor Substances 0.000 claims description 3
• PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims 4
• XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims 2
• 229910052759 nickel Inorganic materials 0.000 claims 2
• RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
• 229910052782 aluminium Inorganic materials 0.000 claims 1
• XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 1
• 229910052802 copper Inorganic materials 0.000 claims 1
• 239000010949 copper Substances 0.000 claims 1
• 229910052742 iron Inorganic materials 0.000 claims 1