JPH0242429U - - Google Patents

Info

Publication number
JPH0242429U
JPH0242429U JP1988122287U JP12228788U JPH0242429U JP H0242429 U JPH0242429 U JP H0242429U JP 1988122287 U JP1988122287 U JP 1988122287U JP 12228788 U JP12228788 U JP 12228788U JP H0242429 U JPH0242429 U JP H0242429U
Authority
JP
Japan
Prior art keywords
adhesive
application
die bonding
chip
cleaning
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1988122287U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988122287U priority Critical patent/JPH0242429U/ja
Publication of JPH0242429U publication Critical patent/JPH0242429U/ja
Pending legal-status Critical Current

Links

Classifications

    • H10W72/0113—
    • H10W72/0711—
    • H10W72/073—

Landscapes

  • Die Bonding (AREA)
JP1988122287U 1988-09-19 1988-09-19 Pending JPH0242429U (cg-RX-API-DMAC10.html)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988122287U JPH0242429U (cg-RX-API-DMAC10.html) 1988-09-19 1988-09-19

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988122287U JPH0242429U (cg-RX-API-DMAC10.html) 1988-09-19 1988-09-19

Publications (1)

Publication Number Publication Date
JPH0242429U true JPH0242429U (cg-RX-API-DMAC10.html) 1990-03-23

Family

ID=31370078

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988122287U Pending JPH0242429U (cg-RX-API-DMAC10.html) 1988-09-19 1988-09-19

Country Status (1)

Country Link
JP (1) JPH0242429U (cg-RX-API-DMAC10.html)

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